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公开(公告)号:US3179854A
公开(公告)日:1965-04-20
申请号:US10486861
申请日:1961-04-24
Applicant: RCA CORP
Inventor: EDUARD LUEDICKE , HARRY REINIG
CPC classification number: H05K1/0221 , H05K1/056 , H05K3/284 , H05K3/4644 , H05K2201/0715 , H05K2201/09809 , H05K2201/09872 , H05K2201/09981
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公开(公告)号:US11659656B2
公开(公告)日:2023-05-23
申请号:US17847233
申请日:2022-06-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takahito Tomoda
CPC classification number: H05K1/0283 , H05K1/189 , H05K2201/09245 , H05K2201/09872 , H05K2201/09909 , H05K2201/1003 , H05K2201/10015 , H05K2201/10022 , H05K2201/10166
Abstract: A stretchable wiring board that includes a stretchable substrate having a first main surface with a first region, a second region adjacent the first region, and a third region adjacent the second region; a first stretchable wiring line on the first main surface and extending over the first region; an insulating layer extending over the first region and the second region; and a second stretchable wiring line extending over the first region, the second region, and the third region. When a thickness of the insulating layer is defined as Z2, and when a minimum value of a length of the second region in an extending direction of the second stretchable wiring line in a plan view of the stretchable wiring board is defined as Y, Y>Z2.
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公开(公告)号:US20180171176A1
公开(公告)日:2018-06-21
申请号:US15895643
申请日:2018-02-13
Applicant: Motorola Mobility LLC
Inventor: Richard W. Brotzman , Ernest Sirois , Deborah Paskiewicz
IPC: C09D183/04 , H05K1/18
CPC classification number: C09D183/04 , C08G77/24 , C08G77/80 , C09D183/08 , H05K1/18 , H05K3/282 , H05K3/285 , H05K2201/0162 , H05K2201/09872 , H05K2201/10015 , H05K2201/10022 , H05K2203/095
Abstract: A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.
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公开(公告)号:US09932493B2
公开(公告)日:2018-04-03
申请号:US14760779
申请日:2014-01-10
Applicant: ALLNEX IP S.Á.R.L.
Inventor: Abdullah Ekin , Michael J Dvorchak
IPC: C09D175/14 , C09D4/00 , B05D3/06 , C08G18/72 , C08G18/79 , C08G18/81 , C09D175/16 , C08G18/30 , H05K3/28 , C08G18/67 , C08G63/08 , C08G18/42 , C08G18/78
CPC classification number: C09D175/14 , B05D3/067 , C08G18/307 , C08G18/4277 , C08G18/672 , C08G18/725 , C08G18/7837 , C08G18/798 , C08G18/81 , C08G63/08 , C09D4/00 , C09D175/16 , H05K3/284 , H05K3/287 , H05K2201/09872
Abstract: Disclosed are one-component compositions that include: (1) an isocyanate-functional urethane acrylate and (2) a polyisocyanate containing allophanate and/or uretdione groups, wherein the one-component composition has a viscosity of less than or equal to about 800 mPa·s and an isocyanate content of greater than about 5% by weight, based on the weight of the one-component composition. Also disclosed are circuit boards and electronic components that are coated with such compositions.
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公开(公告)号:US20180072897A1
公开(公告)日:2018-03-15
申请号:US15558956
申请日:2016-03-18
Applicant: LOUGHBOROUGH UNIVERSITY
Inventor: Mark Andrew ASHWORTH , Helen Elizabeth PEARSON , Xujin BAO , Geoffrey David WILCOX
IPC: C09D7/12 , C09D5/00 , C09D175/04 , H05K3/28
CPC classification number: C09D7/70 , C08K3/346 , C08K7/00 , C08K9/02 , C08K9/04 , C08K2201/004 , C08K2201/005 , C08K2201/011 , C09D5/00 , C09D7/61 , C09D7/62 , C09D175/04 , H05K1/0373 , H05K3/28 , H05K3/285 , H05K2201/0209 , H05K2201/0245 , H05K2201/0769 , H05K2201/09872
Abstract: A nanocomposite coating composition for use in the mitigation of whisker growth from a metallic surface (82) includes a polymer matrix (86) comprising a base polymer and insulating material nanoplatelets (85), for example clay nanoplatelets, within the polymer matrix (86). A conformal coating (84) for application to a metal surface (82) is formed from the coating composition. The conformal coating mitigates the spontaneous growth of whiskers (83), in particular tin whiskers, from the coated surface (82), reducing the risk of short-circuits caused by such whiskers bridging gaps within electronic devices. Methods are provided for the preparation of coating compositions and coatings.
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公开(公告)号:US20180070456A1
公开(公告)日:2018-03-08
申请号:US15257726
申请日:2016-09-06
Applicant: Intel Corporation
Inventor: Priyanka Dobriyal , Suriyakala Ramalingam , Chester C. Lee , Raiyomand F. Aspandiar
CPC classification number: H05K3/284 , H01L21/563 , H05K1/18 , H05K3/285 , H05K2201/09872 , H05K2201/10977 , H05K2203/1338 , H05K2203/304
Abstract: An electronic system may include a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer may include parylene. Furthermore, the electronic system may include an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments may be described and/or claimed.
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公开(公告)号:US20180007778A1
公开(公告)日:2018-01-04
申请号:US15544206
申请日:2016-01-12
Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Inventor: Maki ITO , Toshiaki ISHII , Yoshio KAWAI
IPC: H05K1/02 , B60R16/023
CPC classification number: H05K1/0203 , B60R16/02 , B60R16/0231 , C09D5/00 , C09D7/40 , C09D201/00 , H05K1/0209 , H05K7/20 , H05K2201/09872 , H05K2203/0759
Abstract: Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.
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公开(公告)号:US20170367194A1
公开(公告)日:2017-12-21
申请号:US15612182
申请日:2017-06-02
Applicant: Nanoshield Technology Co. Ltd.
Inventor: James Cheng LEE
CPC classification number: H05K3/285 , C23C14/08 , C23C18/1212 , C23C18/1216 , C23C18/1254 , C23C18/1266 , H05K1/0306 , H05K3/282 , H05K3/284 , H05K2201/0175 , H05K2201/0179 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2201/09872 , H05K2203/0783 , H05K2203/1366 , H05K2203/1476
Abstract: A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating.
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公开(公告)号:US20170365760A1
公开(公告)日:2017-12-21
申请号:US15690474
申请日:2017-08-30
Applicant: Grote Industries, LLC
Inventor: Jiabiao RUAN , Cesar Perez-Bolivar
CPC classification number: H01L33/641 , B82B1/002 , B82Y30/00 , F21S4/22 , F21S43/15 , F21S45/47 , F21V29/87 , F21Y2103/10 , F21Y2115/10 , H01L24/13 , H01L24/16 , H01L25/0753 , H01L33/64 , H01L33/644 , H01L2224/1329 , H01L2224/13339 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/18161 , H05K1/189 , H05K3/284 , H05K2201/09872 , H05K2201/10106 , H05K2201/10977 , H01L2924/00014 , H01L2924/0665
Abstract: A lighting device is provided, including: a substrate having a first surface and a second surface opposite the first surface; one or more light-emitting structures formed on the first surface of the substrate; and a heat spreading and dissipating layer formed on the second surface of the substrate, wherein the heat spreading and dissipating layer comprises a polymer layer mixed with nano graphite particles.
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公开(公告)号:US20170315596A1
公开(公告)日:2017-11-02
申请号:US15140981
申请日:2016-04-28
Applicant: DELL PRODUCTS, LP
Inventor: Christopher A. Torres , Travis Christian North , Deeder M. Aurgonzeb
CPC classification number: G06F1/20 , H05K1/0209 , H05K3/284 , H05K7/20454 , H05K2201/0323 , H05K2201/09872 , H05K2203/1366
Abstract: An information handling system includes an electronic assembly, the assembly including heat-generating components arranged on a printed circuit board. The system further includes a conformal coating that is applied over a first region of the electronic assembly. The coating includes a graphene containing polymer material configured to dissipate heat away from the heat-generating components.
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