公开(公告)号：US5444187A

公开(公告)日：1995-08-22

申请号：US329222

申请日：1994-10-26

Applicant: Daniel R. Bree ,  Rafael Lem

Inventor： Daniel R. Bree ,  Rafael Lem

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component having a pair of input/output contact points or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces on a circuit board for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0.degree. (a chain configuration) and about 180.degree. (a "U"-turn).

Abstract translation: 表面安装射频成分的方法包括使用至少一个具有一对输入/输出接触点的射频分量或在组件的下侧的拐角处的区域，其中每个输入/输出接触点或区域邻接相邻的 角落的边缘。 该组件相对于电路板上的一对迹线定位，以使得能够在一定范围的角度配置中进行电连接。 通过使用单个非定制组件，相邻组件可以配置在约0°（链式配置）和约180°（“U”转）之间的范围内的信号流路径。

公开(公告)号：US5353980A

公开(公告)日：1994-10-11

申请号：US63492

申请日：1993-05-18

Applicant: Susan C. Miller

Inventor： Susan C. Miller

IPC: H01P7/10 ,  H05K1/02 ,  H05K3/34 ,  H05K3/30

CPC classification number: H01P7/10 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/10068 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A method of affixing a passive dielectric component to a printed circuit board comprising the steps of forming a metallised area on the p.c.b. separate from the printed electrical circuitry, forming a like metallised area on the component, applying solder material to one of the metallised areas, placing the component on the metallised area on the board and reflowing the solder to create a metal-solder-metal bond between the component and the p.c.b. whereby the component is accurately aligned with respect to the printed electrical circuitry on the p.c.b.

Abstract translation: 一种将无源介电元件固定在印刷电路板上的方法，包括在p.c.b上形成金属化区域的步骤。 与打印的电路分离，在组件上形成类似的金属化区域，将焊料材料施加到金属化区域之一，将组件放置在板上的金属化区域上并回流焊料，以在焊料之间形成金属 - 焊料 - 金属键 组件和pcb 从而组件相对于p.c.b上的印刷电路精确对准。

公开(公告)号：US4882550A

公开(公告)日：1989-11-21

申请号：US307439

申请日：1989-02-07

Applicant: Toshiki Baba

Inventor： Toshiki Baba

IPC: H03B1/00 ,  H03B5/18 ,  H04B1/38 ,  H04B1/40 ,  H05K1/02 ,  H05K3/30

CPC classification number: H04B1/40 ,  H03B5/18 ,  H05K1/0243 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K3/301

Abstract: A connecting structure for connecting two oscillator circuits to an amplifier. The oscillator circuits are provided on one surface of a printed circuit board and include two dielectric resonators. The amplifier circuit is provided on the other surface of the printed circuit board for selectively amplifying oscillatory outputs from the oscillator circuits. The dielectric resonators are fixed to a metal plate mounted on the printed circuit board, and the amplifier circuit is located at a position opposite to the metal plate.

Abstract translation: 用于将两个振荡电路连接到放大器的连接结构。 振荡器电路设置在印刷电路板的一个表面上并且包括两个介质谐振器。 放大电路设置在印刷电路板的另一表面上，用于选择性地放大来自振荡电路的振荡输出。 介质谐振器固定在安装在印刷电路板上的金属板上，放大电路位于与金属板相对的位置。

公开(公告)号：US4872937A

公开(公告)日：1989-10-10

申请号：US220857

申请日：1988-07-14

Applicant: Thomas E. Gouldy

Inventor： Thomas E. Gouldy

IPC: C09J7/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: C09J7/0289 ,  C09J7/0242 ,  H05K3/305 ,  H05K3/306 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2201/61 ,  H05K2201/0133 ,  H05K2201/10068 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K3/301 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T428/249983

Abstract: A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.

Abstract translation: 安装实体分层包含压敏粘合剂，泡沫隔离物，第二压敏粘合剂，填料和热敏粘合剂。 第一压敏粘合剂附接到电气部件，然后将电子部件安装在印刷电路上，其中热敏粘合剂与其接触。 板上通过焊波将板的顶表面加热到足够高的温度以激活热敏粘合剂并将该部件粘附到板上。 中间泡沫层可抑制冲击和振动。

公开(公告)号：US20230292441A1

公开(公告)日：2023-09-14

申请号：US18178830

申请日：2023-03-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Koji Kitahara

IPC: H05K1/18 ,  H01L23/48 ,  H01L21/306 ,  H01L21/768 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/182 ,  H01L23/481 ,  H01L21/30604 ,  H01L21/76831 ,  H05K3/107 ,  H05K3/0017 ,  H05K2201/10068 ,  H01L24/16

Abstract: A circuit board includes a semiconductor substrate having a first surface and a second surface located on an opposite side from the first surface, a through hole penetrating the first surface and the second surface, an organic insulating film disposed on the first surface and a side surface of the through hole, and a conductor disposed on an opposite side of the organic insulating film from a side surface side of the through hole. The side surface of the through hole has a first side surface coupled to the first surface and having a width decreased from the first surface toward the second surface, and a second side surface coupled to the second surface from an end portion of the first side surface on a second surface side.

公开(公告)号：US20170017873A1

公开(公告)日：2017-01-19

申请号：US15171281

申请日：2016-06-02

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Hiroyuki Nakamoto

IPC: G06K19/077 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  G06K19/0704 ,  G06K19/0716 ,  G06K19/072 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07773 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0314 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10098 ,  H05K2201/10143

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

Abstract translation: 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件上并具有柔性和导电性; 电子部件，设置在所述基座部件上并且耦合到所述导电部件; 以及覆盖部件，其具有柔性和绝缘性能，并且覆盖所述基部部件的一部分和所述电子部件的一部分，其中所述覆盖部件具有高于所述基部部件的硬度的硬度，并且其中所述基部部件弯曲 以便将盖部件保持在内部。

公开(公告)号：US20160219354A1

公开(公告)日：2016-07-28

申请号：US15004669

申请日：2016-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Il Nam KIM ,  Won Sang PARK ,  Yi Joon AHN ,  Byeong-Hee WON

IPC: H04R1/02 ,  H05K1/02 ,  G02B5/30 ,  H05K1/18

CPC classification number: H04R1/028 ,  G02B5/3033 ,  H04R1/025 ,  H04R2201/029 ,  H04R2499/15 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

Abstract translation: 提供了一种扬声器和麦克风集成显示面板，包括：显示面板，具有显示区域和围绕显示区域的非显示区域; 以及安装成对应于非显示区域中的空气孔的同时可转换的薄膜型扬声器或薄膜式麦克风，其中显示面板和胶片型扬声器或薄膜式麦克风至少部分地被集成，以便 被驱动连接。

公开(公告)号：US20160172775A1

公开(公告)日：2016-06-16

申请号：US14893408

申请日：2014-05-23

Applicant: RAPID DIAGNOSTEK

Inventor： John Mark Tischer ,  Christopher Jennings Madsen ,  Roger Paul Mann

IPC: H01R12/72 ,  H01L41/08 ,  G01N33/543 ,  H03H9/54

CPC classification number: H01R12/721 ,  G01N29/022 ,  G01N29/036 ,  G01N29/222 ,  G01N29/30 ,  G01N33/54373 ,  G01N2291/014 ,  G01N2291/022 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  H01L41/081 ,  H01L41/0825 ,  H03H9/54 ,  H05K1/118 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10068 ,  H05K2201/10151

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract translation: 公开了利用这种互连设备的互连设备和模块和系统的各种实施例。 在一个或多个实施例中，互连装置可以包括印刷电路板（PCB）。 PCB可以包括形成弹性偏转元件的基板，设置在基板上的导电材料，以及设置在弹性偏转元件上并电耦合到导电材料的电触点。 互连装置还可以包括连接器，该连接器包括连接销，该连接引脚被配置为与PCB的元件电耦合，并且当元件接触连接引脚时导致弹性偏转元件偏转。

公开(公告)号：US09306538B2

公开(公告)日：2016-04-05

申请号：US13759402

申请日：2013-02-05

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kanehisa Kimbara ,  Osamu Kawachi

IPC: H01L41/00 ,  H03H9/46 ,  H03H9/70 ,  H03H9/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H03H9/46 ,  H03H9/0542 ,  H03H9/70 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10204 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract translation: 复合电子部件包括：电路板; 包括声波滤波器并且位于电路板的顶表面上的封装; 位于电路板的顶表面上的虚拟封装; 以及位于包装和虚拟包装上方的盖子。

公开(公告)号：US20130098654A1

公开(公告)日：2013-04-25

申请号：US13497831

申请日：2011-03-24

Applicant: Minoru Iizuka ,  Yuka Kojo

Inventor： Minoru Iizuka ,  Yuka Kojo

IPC: H05K5/00

CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract translation: 表面安装电子部件封装的基座保持电子元件，并且将被安装在具有导电接合材料的电路板上。 基座具有主电路表面和与电路板电连接的外部连接端子。 外部连接端子形成在主表面上。 底座包括形成在外部连接端子上的凸块。 凸块小于外部连接端子。 底座在外部连接端子的应力的衰减方向上具有外部连接端子的外周端边缘与突起的外周端边缘之间的距离d。 电路板。 距离d大于0.00mm且等于或小于0.45mm。