公开(公告)号：US09979320B2

公开(公告)日：2018-05-22

申请号：US15248241

申请日：2016-08-26

Applicant: Deere & Company

Inventor： Brij N. Singh ,  Christopher J. Schmit

IPC: H02M7/537 ,  H02M7/00 ,  H02M1/42 ,  H01L29/16 ,  H01L29/20 ,  H02M1/08 ,  H05K1/18 ,  H05K1/14 ,  H01L25/07 ,  H05K1/11 ,  H05K1/16 ,  H02P27/06 ,  G01R15/18 ,  G01R15/20 ,  H02M1/00

CPC classification number: H02M7/537 ,  G01R15/18 ,  G01R15/202 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H02M1/08 ,  H02M7/003 ,  H02M2001/0009 ,  H02P27/06 ,  H05K1/0263 ,  H05K1/117 ,  H05K1/144 ,  H05K1/165 ,  H05K1/181 ,  H05K7/1432 ,  H05K7/20518 ,  H05K7/20872 ,  H05K2201/042 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

公开(公告)号：US09974177B2

公开(公告)日：2018-05-15

申请号：US14781603

申请日：2014-01-30

Applicant: OSRAM GmbH

Inventor： Thomas Preuschl ,  Peter Sachsenweger

IPC: H05K7/00 ,  H05K1/18 ,  F21V15/01 ,  F21V17/10 ,  F21V19/00 ,  F21V23/06 ,  H05K3/32 ,  F21K9/90 ,  F21K9/20 ,  F21V23/00 ,  F21V29/00 ,  F21V29/507 ,  F21Y105/00 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: H05K1/18 ,  F21K9/20 ,  F21K9/90 ,  F21V15/01 ,  F21V17/10 ,  F21V17/101 ,  F21V19/0035 ,  F21V23/006 ,  F21V23/06 ,  F21V29/20 ,  F21V29/507 ,  F21V29/70 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  H05K1/182 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10962

Abstract: Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.

公开(公告)号：US20180124920A1

公开(公告)日：2018-05-03

申请号：US15561457

申请日：2016-03-17

Applicant: NTT ELECTRONICS CORPORATION

Inventor： Kazumasa YOSHIDA ,  Toshiyuki OZAWA ,  Teruaki SATO ,  Atsushi TOMITA ,  Yosuke TAKEUCHI ,  Shinji MINO ,  Yusuke NASU

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/147 ,  H05K1/02 ,  H05K1/0237 ,  H05K1/028 ,  H05K1/115 ,  H05K2201/09027 ,  H05K2201/10189

Abstract: A flexible substrate having a branch structure in the related art has problems in that: adhesive strength after two bodies are folded and fixed at a bonding region decreases due to an unfolding and opening force at a curve portion and ends of the bonded portions are peeled off and generate gaps; and in a soldering process of the two bodies, the electrodes of one body soldered first are displaced due to reheating in soldering the other body secondly and deteriorate in soldered connection. The present invention provides a new flexible substrate having a branch structure, including first and second bodies joined together, and having a structure in which one of the bodies can be folded back in a longitudinal direction of the whole flexible substrate. Tip ends of the two bodies are provided with multiple electrodes, and are connected by soldering to approximately corresponding positions on both surfaces of an end portion of a printed substrate concerned.

公开(公告)号：US20180124918A1

公开(公告)日：2018-05-03

申请号：US15394845

申请日：2016-12-30

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： WEN-HSIANG HUNG ,  CHUN-BAO GU ,  CHING-JOU CHEN

IPC: H05K1/11 ,  G06F1/18 ,  H05K1/18

CPC classification number: H05K1/117 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A circuit board combination includes a circuit board and a control chip. The circuit board includes first and second edges. The circuit board is provided with a first interface module close to the first edge and a second interface module which is close to the second edge. The first interface module is electrically connected with the control chip by a first wire, and the second interface module is electrically connected with the control chip by a second wire, the respective lengths of the first and second wires being equal.

公开(公告)号：US20180115037A1

公开(公告)日：2018-04-26

申请号：US15849996

申请日：2017-12-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P1/213 ,  H01F27/00 ,  H01P1/203 ,  H03H7/01 ,  H05K1/16 ,  H04B1/38 ,  H05K1/02 ,  H01F17/00 ,  H03H1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01P1/2135 ,  H01F17/00 ,  H01F27/00 ,  H01P1/203 ,  H03H7/0115 ,  H03H7/0123 ,  H03H2001/0085 ,  H04B1/38 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/0239 ,  H05K1/147 ,  H05K1/162 ,  H05K1/165 ,  H05K1/186 ,  H05K3/4635 ,  H05K2201/10098 ,  H05K2201/10189

Abstract: A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer.

公开(公告)号：US09954332B2

公开(公告)日：2018-04-24

申请号：US15621688

申请日：2017-06-13

Applicant: Intel Corporation

Inventor： Shaowu Huang ,  Beom-Taek Lee

IPC: H01R33/92 ,  H01R12/73 ,  G06F1/18 ,  H01R25/00 ,  H05K7/14 ,  H05K1/14 ,  G11C5/04

CPC classification number: H01R33/92 ,  G06F1/185 ,  G11C5/04 ,  H01R12/737 ,  H01R25/00 ,  H05K1/14 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.

公开(公告)号：US20180103536A1

公开(公告)日：2018-04-12

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.

公开(公告)号：US09939455B2

公开(公告)日：2018-04-10

申请号：US15436051

申请日：2017-02-17

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Hans Schneider ,  Christian Riether

IPC: B65G54/02 ,  G01N35/04 ,  H01F5/04 ,  H05K3/32 ,  H01F7/20

CPC classification number: G01N35/04 ,  B65G54/02 ,  G01N2035/0477 ,  H01F5/04 ,  H01F7/206 ,  H05K3/325 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10962

Abstract: A laboratory sample distribution system and to a laboratory automation system comprising a printed circuit board arrangement and a coil are presented. The printed circuit board arrangement and the coil are configured such that assembly and maintenance of the laboratory automation system are greatly simplified.

公开(公告)号：US09936577B1

公开(公告)日：2018-04-03

申请号：US15703257

申请日：2017-09-13

Applicant: WIESON TECHNOLOGIES CO., LTD.

Inventor： Qiang-Long Hu ,  Wen-Sheng Liu

IPC: H05K1/11 ,  H01R12/62 ,  G06F13/40 ,  H01R12/59 ,  H01R43/20 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/11 ,  G06F13/409 ,  H01R12/592 ,  H01R12/62 ,  H01R12/79 ,  H01R43/20 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/2009

Abstract: The present disclosure illustrates a dual-channel flexible circuit bridge connector and a dual graphics card system using the same. The dual-channel flexible circuit bridge connector includes a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two graphics cards spaced apart by a non-fixed distance, thereby forming a bridging status. Therefore, the dual graphics card system can manipulate two graphics cards to perform parallel computation, so as to achieve better efficiency in computing process and graphics display.

公开(公告)号：US20180076549A1

公开(公告)日：2018-03-15

申请号：US15703190

申请日：2017-09-13

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： MING-CHING CHEN

IPC: H01R12/71 ,  H01R24/60 ,  H01R12/70

CPC classification number: H01R12/716 ,  H01R12/57 ,  H01R12/7017 ,  H01R12/7082 ,  H01R12/7088 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189

Abstract: An electrical connector includes: an insulative housing; plural signal contacts secured to the insulative housing; plural power contacts secured to the insulative housing; and a pair of holding members secured to two opposite ends of the insulative housing, wherein the power contacts are disposed adjacent to the pair of holding members and the pair of holding members also act as power contacts.