公开(公告)号：US20180070436A1

公开(公告)日：2018-03-08

申请号：US15561504

申请日：2016-03-01

Applicant: EPCOS AG ,  AT&S Austria Technologie & Systemtechnik AG

Inventor： Thomas FEICHTINGER ,  Oliver DERNOVSEK ,  Franz RINNER ,  Christian VOCKENBERGER

IPC: H05K1/02 ,  H05K1/18 ,  H01L33/64 ,  H01L33/54 ,  H01L25/16

CPC classification number: H05K1/0206 ,  H01L25/167 ,  H01L33/54 ,  H01L33/647 ,  H05K1/185 ,  H05K2201/0195 ,  H05K2201/10015 ,  H05K2201/10106 ,  H05K2201/10196 ,  H05K2201/10219

Abstract: The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).

公开(公告)号：US20180055140A1

公开(公告)日：2018-03-01

申请号：US15687382

申请日：2017-08-25

Applicant: ARIA S.R.L.

Inventor： Alessandra ANTONETTI ,  Eros BRIENZA

IPC: A43B7/04 ,  H05K1/02 ,  H01L35/30 ,  H01L35/32 ,  G01K13/00 ,  A43B17/00 ,  A43B17/14 ,  A43B3/00

CPC classification number: A43B7/04 ,  A43B3/0005 ,  A43B7/005 ,  A43B17/006 ,  A43B17/14 ,  G01K13/002 ,  H01L35/30 ,  H01L35/32 ,  H05K1/028 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: An insole for controlling and adjusting the temperature of the foot. The insole includes a first heat conductive layer made of fabric, a second heat insulating layer comprising a Peltier cell. The Peltier cell includes a first surface and has a predetermined polarity such that, when the Peltier cell is on, the first surface is heated or cooled. A third heat dissipating layer includes an accelerometer and a logic control unit connected to the accelerometer and to the Peltier cell. The insole further includes a first flexible printed circuit configured to measure the temperature of the foot, through at least a first temperature sensor and the temperature of the first surface of the Peltier cell, through a further first temperature sensor.

公开(公告)号：US09781821B2

公开(公告)日：2017-10-03

申请号：US15074558

申请日：2016-03-18

Applicant: DELTA ELECTRONICS, INC.

Inventor： Lee-Lung Chen ,  Ching-Shun Wang ,  Jin-Hong Cai

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L23/38 ,  H01L35/00 ,  H05K1/0206 ,  H05K1/115 ,  H05K1/144 ,  H05K1/145 ,  H05K7/20854 ,  H05K2201/042 ,  H05K2201/10219

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

公开(公告)号：US09532463B2

公开(公告)日：2016-12-27

申请号：US13656293

申请日：2012-10-19

Applicant: THE BOEING COMPANY

Inventor： Mark J. Clemen, Jr.

IPC: H05K3/22 ,  C25D5/48 ,  H05K1/02

CPC classification number: H05K3/22 ,  C25D5/48 ,  H05K1/0212 ,  H05K2201/0769 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2203/102 ,  H05K2203/107

Abstract: Methods and apparatus for reducing the occurrence of metal whiskers on surfaces are disclosed herein. In particular, the present disclosure teaches providing at least one source of electromagnetic energy to emit energy to reduce the occurrence of metal whiskers on a surface.

Abstract translation: 本文公开了用于减少表面上的金属晶须的发生的方法和装置。 特别地，本公开教导提供至少一个电磁能源以发射能量以减少表面上的金属晶须的出现。

公开(公告)号：US20160363974A1

公开(公告)日：2016-12-15

申请号：US15247902

申请日：2016-08-25

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC: G06F1/20 ,  H01L23/498 ,  H05K1/18 ,  H01L35/30 ,  H05K1/02

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US09468105B2

公开(公告)日：2016-10-11

申请号：US14659178

申请日：2015-03-16

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu Kondo

IPC: H03L1/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/18 ,  H05K1/0212 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/1056

Abstract: An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface, a heating element arranged on the first surface of the pedestal plate, and a resonator element arranged on the heating element. The pedestal plate overlaps the resonator element in a plan view.

Abstract translation: 一种电子部件，包括具有由金属构成的第一表面和与第一表面相反的表面的第二表面的基座板，布置在基座板的第一表面上的加热元件和布置在加热器上的谐振元件 元件。 基座板在平面图中与谐振器元件重叠。

公开(公告)号：US09468085B2

公开(公告)日：2016-10-11

申请号：US14135160

申请日：2013-12-19

Applicant: Zephyr Photonics Inc.

Inventor： Duane Louderback

IPC: F21V5/00 ,  H05K1/02 ,  H01L33/64 ,  H01S5/024 ,  F21V29/54 ,  H01L23/24 ,  H01S5/022

CPC classification number: H05K1/0203 ,  F21V29/54 ,  H01L23/24 ,  H01L33/645 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02415 ,  H05K2201/10106 ,  H05K2201/10219 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An optical module apparatus and method operates at high temperatures. The apparatus has a first printed circuit board with optoelectronics and electronics located on a thermoelectric cooler. The thermoelectric cooler is located on a second printed circuit board that also has electronics that control the thermoelectric cooler separately mounted thereon. The optical module operates at substantially higher temperatures by placing the optoelectronics and the electronics, not including the thermoelectric cooler controller, on the thermoelectric cooler. The electronics controlling the thermoelectric cooler only require relatively simple, low-speed electronics that are implemented in integrated circuit technologies. The integrated circuit electronics may operate at very high temperatures (200° C. or higher) thereby making control of the thermoelectric cooler with uncooled electronics possible.

Abstract translation: 光模块装置和方法在高温下运行。 该装置具有位于热电冷却器上的具有光电子和电子器件的第一印刷电路板。 热电冷却器位于第二印刷电路板上，该印刷电路板还具有控制分别安装在其上的热电冷却器的电子器件。 光学模块通过将光电子器件和电子设备（不包括热电冷却器控制器）放置在热电冷却器上而在更高的温度下工作。 控制热电冷却器的电子器件仅需要在集成电路技术中实现的相对简单的低速电子设备。 集成电路电路可以在非常高的温度（200℃或更高）下运行，从而使得具有非制冷电子部件的热电冷却器成为可能。

公开(公告)号：US20160276566A1

公开(公告)日：2016-09-22

申请号：US15032841

申请日：2014-10-06

Applicant: ROBERT BOSCH GMBH

Inventor： Tjalf Pirk ,  Ricardo Ehrenpfordt ,  Frederik Ante ,  Johannes Kenntner

IPC: H01L35/32 ,  H01L35/30 ,  H01L23/31

CPC classification number: H01L35/32 ,  H01L23/3121 ,  H01L35/30 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K2201/09072 ,  H05K2201/10151 ,  H05K2201/10219 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical circuit includes a component, a thermoelectric generator, and a housing. The component is a sensor element configured to sense a quantity to be measured. The component is mechanically connected to an element side of a carrier element of the circuit. The thermoelectric generator is electrically connected to the component and mechanically connected to the carrier element. The thermoelectric generator is configured to supply the component with electrical energy by using a heat flow flowing through the thermoelectric generator. The housing is arranged on the element side of the carrier element and at least partially covers the component and the thermoelectric generator. The housing is configured to conduct the heat flow to the thermoelectric generator.

Abstract translation: 电路包括部件，热电发电机和壳体。 该部件是被配置为感测待测量的传感器元件。 该部件机械地连接到电路的载体元件的元件侧。 热电发生器电连接到部件并机械连接到载体元件。 热电发电机被配置为通过使用流过热电发电机的热流向部件供应电能。 壳体布置在载体元件的元件侧上并且至少部分地覆盖部件和热电发电机。 壳体构造成将热流传导到热电发电机。

公开(公告)号：US20160174382A1

公开(公告)日：2016-06-16

申请号：US14909180

申请日：2014-07-03

Applicant: HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH

Inventor： Guenther KRAFT ,  Krunoslac ORCIC ,  Didier BERTHOMIER ,  Thomas SCHIEMANN ,  Valod NOSHADI

IPC: H05K1/18 ,  H01L25/16 ,  H01L23/538 ,  H05K1/11 ,  H05K1/02 ,  H01L23/38

CPC classification number: H05K1/185 ,  H01L23/38 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0203 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/10159 ,  H05K2201/10219 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Abstract translation: 提供一种电子模块，其包括多层电路板和电子部件以及珀耳帖热泵。 电子部件安装在多层电路板的主表面上并电连接至至少一个存储管芯。 所述至少一个存储器管芯至少部分地嵌入所述多层电路板内。 珀耳帖热泵装置具有至少一对并联热电并且电串联的至少一对热电半导体部件，并且至少一对半导体部件至少部分地嵌入电路板中。

公开(公告)号：US20150319880A1

公开(公告)日：2015-11-05

申请号：US14268276

申请日：2014-05-02

Applicant: Honeywell International Inc.

Inventor： Peter Charles Strickland ,  Sergiy Borysenko ,  Bradley Jessup

IPC: H05K7/20 ,  H05K3/06 ,  H05K1/02

CPC classification number: H05K7/20 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/06 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10219 ,  Y10T29/49156 ,  Y10T29/49361

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

Abstract translation: 提供了一种与被配置为冷却至少一个装置的冷却装置一起使用的印刷电路板。 印刷电路板包括具有与第一表面相对的第一表面和第二表面的基板; 在衬底的第一表面上的接地平面，以及在衬底的第二表面上的电路区域中的电路。 接地平面包括图案化的具有孔阵列的图案区域。 电路被配置为与要冷却的至少一个设备一起使用。 当冷却装置的第一侧接触接地平面时，并且当待冷却的至少一个装置接触电路时，图案化区域的减小的横截面面积防止来自冷却装置的第二侧的热量降解 至少一个设备的性能。