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    FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED CAPACITORS
    74.
    发明申请
    FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED CAPACITORS 审中-公开
    包装嵌入式电容器的基板的制造方法

    公开(公告)号：US20140076492A1

    公开(公告)日：2014-03-20

    申请号：US14084901

    申请日：2013-11-20

    Applicant: UNIMICRON TECHNOLOGY CORPORATION

    Inventor： Chien-Kuang Lai ,  Chun-Chih Huang

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L28/40 ,  H01L2924/0002 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015 ,  H05K2201/10515 ,  H01L2924/00

    Abstract: A packaging substrate includes: a substrate having a core layer, a cavity penetrating the core layer and circuit layers formed on surfaces of the core layer; a first capacitor disposed in the cavity; a bonding layer formed on the first capacitor in the cavity of the substrate; a second capacitor disposed on the bonding layer so as to be received in the cavity; and a dielectric layer formed on the substrate and in the cavity for covering the first and second capacitors. By stacking the first and second capacitors in the cavity through the bonding layer, the single core layer is embedded with two layers of the capacitors to thereby meet the multi-function requirement.

    Abstract translation: 封装基板包括：具有芯层的基板，穿透芯层的空腔和形成在芯层表面上的电路层; 设置在所述空腔中的第一电容器; 形成在所述基板的空腔中的所述第一电容器上的接合层; 设置在所述接合层上以便容纳在所述空腔中的第二电容器; 以及形成在所述基板上和所述空腔中的用于覆盖所述第一和第二电容器的电介质层。 通过结合层将空腔中的第一和第二电容器堆叠起来，单芯层嵌有两层电容器，从而满足多功能要求。

    INFRARED SENSOR
    76.
    发明申请
    INFRARED SENSOR 有权
    红外传感器

    公开(公告)号：US20140042321A1

    公开(公告)日：2014-02-13

    申请号：US13959479

    申请日：2013-08-05

    Applicant: NEC Tokin Corporation

    Inventor： Yuji NITOBE ,  Masahiro SAITO ,  Shigemi FUJIWARA ,  Akitoshi SHIMO

    IPC: G01J5/34

    CPC classification number: G01J5/34 ,  G01J5/0285 ,  G01J5/045 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/181 ,  H05K2201/0723 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00

    Abstract: An infrared sensor comprises a circuit board, at least two support portions, an FET element and a pyroelectric element. The circuit board has an upper principal surface formed with a plurality of electrodes. Each of the support portions has an upper surface, a lower surface, an upper conductive pattern formed on the upper surface and a lower conductive pattern formed on the lower surface. The upper conductive pattern is electrically connected with the lower conductive pattern. The lower conductive pattern is connected to the electrode of the upper principal surface of the circuit board. The FET element is located between the at least two support portions and arranged on the upper principal surface of the circuit board. The pyroelectric element is electrically connected with the upper conductive patterns of the support portions. The pyroelectric element is supported by the support portions so as to be located above the FET element.

    Abstract translation: 红外线传感器包括电路板，至少两个支撑部分，FET元件和热电元件。 电路板具有形成有多个电极的上主表面。 每个支撑部分具有形成在上表面上的上表面，下表面，上导电图案和形成在下表面上的下导电图案。 上导电图案与下导电图案电连接。 下导电图案连接到电路板的上主表面的电极。 FET元件位于至少两个支撑部分之间并且布置在电路板的上主表面上。 热电元件与支撑部分的上导电图案电连接。 热电元件由支撑部支撑，以便位于FET元件的上方。

    Electronic circuit board and power line communication apparatus using it
    79.
    发明授权
    Electronic circuit board and power line communication apparatus using it 失效
    电子电路板和电力线通信设备使用它

    公开(公告)号：US08582312B2

    公开(公告)日：2013-11-12

    申请号：US12933860

    申请日：2009-03-24

    Applicant: Hiroshi Kawano ,  Shuichiro Yamaguchi ,  Takumi Naruse ,  Toshihiro Yamauchi

    Inventor： Hiroshi Kawano ,  Shuichiro Yamaguchi ,  Takumi Naruse ,  Toshihiro Yamauchi

    IPC: H05K7/00 ,  H05K1/14 ,  H05K1/16 ,  H05K1/11

    CPC classification number: H04B3/54 ,  H04B2203/54 ,  H04B2203/5445 ,  H04B2203/5483 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/141 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/042 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/061

    Abstract: A highly reliable electronic circuit board for suppressing propagation of noise and a power line communication apparatus using it are provided. An electronic circuit board of the invention is connected to a different electronic circuit board and including a first board having a first face and a second face opposed to the first face and a second board having a third face and a fourth face opposed to the third face. The electronic circuit board includes a first circuit mounted on one end of the first face for performing analog signal processing; a second circuit mounted on another end of the first face for performing digital signal processing; a junction layer provided between the second face and the third face for jointing the first board and the second board; a built-in electronic component built into the junction layer; a connection part mounted on the fourth face and to be connected to the different electronic circuit board; and a first conducting path for electrically connecting the second circuit and the connection part, wherein the connection part is mounted at a position overlapping projection projecting the second circuit onto the fourth face from a vertical direction relative to the first face.

    Abstract translation: 提供了用于抑制噪声传播的高度可靠的电子电路板和使用它的电力线通信装置。 本发明的电子电路板连接到不同的电子电路板，并且包括具有与第一面相对的第一面和第二面的第一板和具有与第三面相对的第三面和第四面的第二板 。 电子电路板包括安装在第一面的一端上用于进行模拟信号处理的第一电路; 安装在第一面的另一端的第二电路用于执行数字信号处理; 连接层，设置在第二面和第三面之间，用于接合第一板和第二板; 内置在接合层中的电子部件; 安装在第四面上并连接到不同的电子电路板的连接部分; 以及用于电连接所述第二电路和所述连接部分的第一导电路径，其中所述连接部分安装在相对于所述第一面的垂直方向上的重叠突起将所述第二电路突出到所述第四面上的位置。

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