公开(公告)号：US5608265A

公开(公告)日：1997-03-04

申请号：US207697

申请日：1994-03-09

Applicant: Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

Inventor： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L25/105 ,  H01L25/16 ,  H05K1/181 ,  H05K3/3436 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K2201/09472 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10818 ,  H05K2201/10931 ,  H05K3/3426 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

Abstract translation: 设置在塑料封装封装中的半导体器件具有半导体芯片，引线和用于将它们电连接在一起的部件。 半导体器件具有分别从封装的一个表面延伸到设置在封装内部的引线的第一侧的一个或多个第一孔，并且分别具有与第一孔对准的一个或多个第二孔， 以使得每个第二孔从包装的相对表面延伸到引线的第二侧上的对应位置并且与包装中的相应的相对的第一孔对准，延伸到包装的第一侧 铅。 这些孔被设置为多组对齐的对齐的孔，分别从包装的相对表面向内延伸到相应引线的相对侧。 在装置中，引线或具有树脂的引线作为隔板，从而实现每对对齐的孔的第一和第二孔之间的隔离。

公开(公告)号：USRE33541E

公开(公告)日：1991-02-19

申请号：US364472

申请日：1989-06-09

Applicant: Theodore S. Pryst ,  John G. Kirschner

Inventor： Theodore S. Pryst ,  John G. Kirschner

IPC: H01C1/14 ,  H01C17/00 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01C1/14 ,  H01C17/006 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point of the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

公开(公告)号：US4644096A

公开(公告)日：1987-02-17

申请号：US713312

申请日：1985-03-18

Applicant: Romulo Gutierrez ,  Albert W. Bauer ,  Thomas L. McDonald

Inventor： Romulo Gutierrez ,  Albert W. Bauer ,  Thomas L. McDonald

IPC: H05K1/02 ,  H05K3/34 ,  H05K5/00 ,  H05K5/06

CPC classification number: H05K5/0095 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10818 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/1147 ,  H05K3/3421

Abstract: A modified TO-8 package has a kovar header supporting an FET amplifier hermetically sealed by a cover welded along the seam between the cover edge and header edge. The header is formed with three circular openings in space quadrature about the package axis. A circular copper spacer contacts the header and is formed with channels extending radially outward from the header openings to define with the openings three lead channels. A lead having a right angle bend is seated in each channel having an upstanding pin portion above the header. The volume between the lead and the header is filled with hermetically sealing low expansion borosilicate glass. The remainder of each channel is filled or coated with nonconductive epoxy. The depending portions of the leads are flush with the bottom of the copper spacer. In another form the base and cover are rectangular in the form of a four-lead DIP package also having the channels, right-angle-bent leads flush with the bottom surrounded by hermetically sealing insulating low expansion borosilicate glass.

Abstract translation: 经修改的TO-8封装具有一个科瓦头，它支持一个FET放大器，该盖放大器通过沿盖边缘和集管边缘之间的接缝焊接的盖子进行气密密封。 集管形成有围绕封装轴线的空间正交的三个圆形开口。 环形铜隔离物与集管接触并形成有从集管开口径向向外延伸的沟道，以限定开口三个引线通道。 具有直角弯曲的引线位于每个通道中，其具有在头部上方的直立销部分。 引线和插头之间的体积填充有气密密封的低膨胀硼硅酸盐玻璃。 每个通道的其余部分被填充或涂覆有非导电环氧树脂。 引线的悬垂部分与铜间隔物的底部齐平。 在另一种形式中，底座和盖子是具有通道的四引脚DIP封装形式的矩形，直角弯曲引线与由气密密封的绝缘低膨胀硼硅酸盐玻璃包围的底部齐平。

公开(公告)号：US4629278A

公开(公告)日：1986-12-16

申请号：US723241

申请日：1985-04-15

Applicant: Jeffrey M. Norton ,  Shoji Yamada

Inventor： Jeffrey M. Norton ,  Shoji Yamada

IPC: H01R4/02 ,  H01R12/55 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R12/716 ,  H05K3/341 ,  H01R4/02 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K3/3426 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A pair of retention clips are disposed around end flanges of a connector to be mounted to a printed circuit board and have board-proximate surface sections which are firmly secured to the board surface to hold the connector firmly to the board without screws, rivets or the like. The clips allow limited axial expansion and contraction of the connector during significant changes in temperature by securely engaging the flanges. Where the retention clips are metal, the securing method could involve vapor phase reflow soldering which also solders the terminals to the conductors on the board surface. Where the retention clips are plastic, the securing method could involve actinic radiation curing of adhesive material. Retention clips also can secure an edge connector to an edge of a board.

Abstract translation: 一对保持夹设置在要安装到印刷电路板的连接器的端部凸缘周围，并且具有牢固地固定到板表面的板 - 靠近的表面部分，以将连接器牢固地保持在板上，而不需要螺钉，铆钉或 喜欢。 通过牢固地接合凸缘，夹子允许在温度显着变化期间连接器的有限的轴向膨胀和收缩。 在固定夹是金属的情况下，固定方法可能涉及气相回流焊接，其也将端子焊接到板表面上的导体。 保持夹是塑料的，固定方法可能涉及粘合剂材料的光化辐射固化。 固定夹还可以将边缘连接器固定到电路板的边缘。

公开(公告)号：US4477970A

公开(公告)日：1984-10-23

申请号：US364380

申请日：1982-04-01

Applicant: Robert P. Alexander ,  Robert J. Pichia ,  Stephen F. Dauksch

Inventor： Robert P. Alexander ,  Robert J. Pichia ,  Stephen F. Dauksch

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/30

CPC classification number: H05K1/184 ,  H05K1/0243 ,  H05K3/3447 ,  H05K2201/0792 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/09981 ,  H05K2201/10166 ,  H05K2201/10818 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A method for preparing a printed circuit board for mounting of surface mounted RF components such that the lead inductance of the components is minimized. The process consists of producing plated through apertures in the printed circuit board to create a component body hole with lead contacts extending to the edge of the component body hole. The resulting aperture is then blanked to remove portions of the metal lining to provide electrical isolation between the lead contacts while maintaining lead contacts that extend to the edge of the component body hole. A component is then soldered into position such that solder is wicked through the plated through apertures to create solder contact of the leads at the edge of the component body hole. This results in substantial reduction in lead inductance improving RF amplifier gain and stability and improving bandwidth characteristics.

Abstract translation: 一种制备用于安装表面安装的RF部件的印刷电路板的方法，使得部件的引线电感最小化。 该方法包括在印刷电路板中生产电镀通孔，以产生具有延伸到部件主体孔的边缘的引线触头的部件主体孔。 然后将所得孔径冲切以除去金属衬里的部分，以在引线触头之间提供电隔离，同时保持延伸到部件主体孔的边缘的引线触头。 然后将组件焊接到位置，使得焊料通过镀覆的通孔被弄脏，以在部件主体孔的边缘处产生引线的焊接接触。 这导致铅电感的显着降低，从而提高RF放大器的增益和稳定性并提高带宽特性。

公开(公告)号：US20240006403A1

公开(公告)日：2024-01-04

申请号：US18036904

申请日：2021-12-03

Applicant: Molex, LLC

Inventor： Victor Zaderej ,  Richard Fitzpatrick ,  Alan Han ,  Lily Yeung ,  Ronald C. Hodge ,  Gary Thomas O'Connor

IPC: H01L25/00 ,  H01L21/48 ,  H01L23/495 ,  H01L25/07 ,  H05K1/18 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L25/50 ,  H01L21/4842 ,  H01L23/49575 ,  H01L25/072 ,  H01L21/4846 ,  H01L23/49562 ,  H05K1/181 ,  H01L23/49861 ,  H05K3/32 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10522 ,  H05K2201/10818 ,  H05K2201/10378 ,  H05K2201/10628

Abstract: A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.

公开(公告)号：US20230309229A1

公开(公告)日：2023-09-28

申请号：US18073670

申请日：2022-12-02

Applicant: TDK CORPORATION

Inventor： Takeshi OOHASHI ,  Yukio MITAKE ,  Daiki KUSUNOKI

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K1/165 ,  H05K1/162 ,  H05K1/111 ,  H05K2201/09545 ,  H05K2201/10522 ,  H05K2201/10931 ,  H05K2201/10818

Abstract: An electronic component includes an insulator and an inductor pattern and a capacitor pattern which are arranged in the insulator. The inductor pattern and the capacitor pattern are electrically connected between one end and the other end of the first inductor pattern.

公开(公告)号：US20170085015A1

公开(公告)日：2017-03-23

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US20160316564A1

公开(公告)日：2016-10-27

申请号：US15097018

申请日：2016-04-12

Applicant: Braun GmbH

Inventor： Christian ELLSAESSER

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/184 ,  H05K1/115 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/1009 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2203/046 ,  H05K2203/1173

Abstract: A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

Abstract translation: 具有至少一个用于将特殊电气部件焊接到印刷电路板的焊接销的电动机，蓄电池或电子组件的特殊电气部件。 焊接销具有连接端，其包括在焊接销的自由端处的前部部分和与前部部分相邻的第一部分。 前部的宽度小于第一部分的宽度。 一种印刷电路板组件和包括至少一个特殊电气部件的电气装置。

公开(公告)号：US08646963B2

公开(公告)日：2014-02-11

申请号：US13603096

申请日：2012-09-04

Applicant: Kyong Jun Kim

Inventor： Kyong Jun Kim

IPC: F21V7/04

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。