Abstract:
A flexible printed circuit board includes a first substrate portion having at least one first terminal, a second substrate portion in communication with the first substrate portion and having at least one circuit device, a connection substrate portion in communication with the second substrate portion, the connection substrate portion extending away from the second substrate portion in a same direction as the first substrate portion, and a third substrate portion in communication with the connection substrate portion, the third substrate portion having at least one second terminal.
Abstract:
According to one embodiment, an electronic apparatus includes a printed circuit board on which a part is mounted, a first connector for external connection provided in a peripheral portion of the printed circuit board, a reinforcing plate, a first fixing member, and a second fixing member. The reinforcing plate has a first portion to be attached in a region corresponding to the part on the printed circuit board, and a second portion attached to the printed circuit board to reinforce the first connector. The first fixing member fixes the first portion to the printed circuit board at an end of the first portion that is opposite to a portion facing the second portion. The second fixing member fixes the second portion to the printed circuit board.
Abstract:
An RFID tag including a base including a resin material, an antenna pattern disposed on a surface of the base, and a reinforcement pad disposed on the surface of the base. A thermosetting adhesive is applied onto the antenna pattern and the reinforcement pad, and a circuit chip is electrically coupled to the antenna pattern via the thermosetting adhesive. The reinforcement pad is formed within a region where the circuit chip is mounted, and the circuit chip includes a first protrusion contacting the antenna pattern and a second protrusion contacting the reinforcement pad.
Abstract:
A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.
Abstract:
A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.
Abstract:
According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.
Abstract:
Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section (32) having a shielding layer (45) on an outer surface, and a rigid mounting section (34) having a wiring layer (47) provided on the same surface as the shielding layer (45). The shielding layer (45) and the wiring layer (47) are made of a same sheet of continuous copper foil (46). The wiring layer (47) is plated and is made thicker than the shielding layer (45). A same continuous insulating layer (48) is provided on outer sides of the shielding layer (45) and the wiring layer (47) of the mounting section (34).
Abstract:
A flexible printed circuit board has a flexible dynamic region, and relatively rigid static regions between which the dynamic region extends. Portions of a base layer, a patterned conductive layer extending on the base layer, and a cover layer covering the conductive layer make up the dynamic region. Extensions of the base layer, the conductive layer, and the cover layer, and portions of a metal layer to which the base layer is attached make up each of the static regions. The metal layer enhances the rigidity of the flexible printed circuit board at the static regions. The metal layer also has rounded corners at sides of each of the boundaries between the dynamic region and each of the static regions to minimize stress concentrations at the boundaries. The conductive layer is made up of real traces through which electrical signals are transmitted, and dummy traces. The dummy traces are disposed outwardly of the real traces to prevent the flexible printed circuit board from cracking at the boundaries between the dynamic region and each of the static regions. In an HDD, the flexible printed circuit board electrically connects a head stack assembly (HSA) and a main circuit board.
Abstract:
To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.
Abstract:
A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10Ω and not more than 50Ω.