中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1152 records (took 0.022 seconds)

    Flexible printed circuit board
    71.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US08039753B2

    公开(公告)日：2011-10-18

    申请号：US11819021

    申请日：2007-06-25

    Applicant: Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

    Inventor： Jin-seok Jang ,  Jae-mo Chung ,  Jin-hee Sung ,  So-bo Chung ,  Jeong-su Kim ,  Dong-ho Lee ,  Tae-soo Kim

    IPC: H05K9/00

    CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009

    Abstract: A flexible printed circuit board includes a first substrate portion having at least one first terminal, a second substrate portion in communication with the first substrate portion and having at least one circuit device, a connection substrate portion in communication with the second substrate portion, the connection substrate portion extending away from the second substrate portion in a same direction as the first substrate portion, and a third substrate portion in communication with the connection substrate portion, the third substrate portion having at least one second terminal.

    Abstract translation: 柔性印刷电路板包括具有至少一个第一端子的第一衬底部分，与第一衬底部分连通并具有至少一个电路器件的第二衬底部分，与第二衬底部分连通的连接衬底部分， 基板部分沿与第一基板部分相同的方向从第二基板部分延伸，以及与连接基板部分连通的第三基板部分，第三基板部分具有至少一个第二端子。

    Electronic apparatus
    72.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US08004859B2

    公开(公告)日：2011-08-23

    申请号：US12603277

    申请日：2009-10-21

    Applicant: Hirofumi Morita

    Inventor： Hirofumi Morita

    IPC: H05K7/02 ,  H05K7/04

    CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10522 ,  H05K2201/10734 ,  H05K2201/2009

    Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board on which a part is mounted, a first connector for external connection provided in a peripheral portion of the printed circuit board, a reinforcing plate, a first fixing member, and a second fixing member. The reinforcing plate has a first portion to be attached in a region corresponding to the part on the printed circuit board, and a second portion attached to the printed circuit board to reinforce the first connector. The first fixing member fixes the first portion to the printed circuit board at an end of the first portion that is opposite to a portion facing the second portion. The second fixing member fixes the second portion to the printed circuit board.

    Abstract translation: 根据一个实施例，电子设备包括其上安装有部件的印刷电路板，设置在印刷电路板的周边部分中的用于外部连接的第一连接器，加强板，第一固定构件和第二固定 会员。 加强板具有第一部分，其被附接在与印刷电路板上的部分相对应的区域中，第二部分附接到印刷电路板以加强第一连接器。 第一固定构件将第一部分固定在第一部分的与面对第二部分的部分相对的端部处的印刷电路板上。 第二固定构件将第二部分固定到印刷电路板。

    Motherboard Assembly for Interconnecting and Distributing Signals and Power
    74.
    发明申请
    Motherboard Assembly for Interconnecting and Distributing Signals and Power 失效
    用于互连和分配信号和电源的主板组件

    公开(公告)号：US20110085313A1

    公开(公告)日：2011-04-14

    申请号：US12579051

    申请日：2009-10-14

    Applicant: John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    Inventor： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

    IPC: H05K1/11 ,  G06F17/50

    CPC classification number: H05K1/144 ,  G11C5/025 ,  H05K1/113 ,  H05K1/114 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/044 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2009

    Abstract: A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.

    Abstract translation: 描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。 主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。 组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。 所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。 它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X） 。 第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。 第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。 它将第一个PCB电连接到第二个PCB上的组件。

    Package mounted module and package board module
    75.
    发明授权
    Package mounted module and package board module 有权
    封装安装模块和封装板模块

    公开(公告)号：US07919856B2

    公开(公告)日：2011-04-05

    申请号：US11838431

    申请日：2007-08-14

    Applicant: Yoshihiro Morita

    Inventor： Yoshihiro Morita

    IPC: H01L23/34

    CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0061 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2009

    Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

    Abstract translation: 一种封装板模块，其中诸如LSI的半导体芯片安装在封装板的顶侧表面上，以及封装安装模块，其中封装板安装在大型计算机等的主板上。 用于支撑包装板的加强件和/或用于支撑母板的加强件各自具有双金属结构，其中具有相互不同的热膨胀系数的第一构件和第二构件分别彼此粘合，以便使加强件翘曲 与由温度变化引起的封装板和母板的翘曲一致，从而防止在焊接部分中产生应力。

    FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS HAVING FLEXIBLE PRINTED WIRING BOARD
    76.
    发明申请
    FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS HAVING FLEXIBLE PRINTED WIRING BOARD 有权
    柔性印刷线路板和具有柔性印刷线路板的电子设备

    公开(公告)号：US20110061928A1

    公开(公告)日：2011-03-17

    申请号：US12857463

    申请日：2010-08-16

    Applicant: Kenji HASEGAWA

    Inventor： Kenji HASEGAWA

    IPC: H05K7/14 ,  H05K1/00

    CPC classification number: H05K1/189 ,  H05K3/0064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/2009

    Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.

    Abstract translation: 根据一个实施例，柔性印刷线路板包括部件安装部分，部件安装到该部件安装部分上，并且加强板被粘合到该部件安装部分。 部件安装部分包括包括布线图案的内层和设置成覆盖布线图案的最外面的薄膜层。 形成加强片的最外层膜形成有槽，使得当加强板粘合时，槽在最外膜层和加强板之间的区域中延伸，并与 地区。

    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    77.
    发明申请
    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
    FLEX-RIGID接线板及其制造方法

    公开(公告)号：US20110036619A1

    公开(公告)日：2011-02-17

    申请号：US12989485

    申请日：2009-04-23

    Applicant: Atsuhiro Uratsuji

    Inventor： Atsuhiro Uratsuji

    IPC: H05K1/00 ,  H05K3/46

    CPC classification number: H05K1/0218 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0715 ,  H05K2201/09736 ,  H05K2201/2009

    Abstract: Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section (32) having a shielding layer (45) on an outer surface, and a rigid mounting section (34) having a wiring layer (47) provided on the same surface as the shielding layer (45). The shielding layer (45) and the wiring layer (47) are made of a same sheet of continuous copper foil (46). The wiring layer (47) is plated and is made thicker than the shielding layer (45). A same continuous insulating layer (48) is provided on outer sides of the shielding layer (45) and the wiring layer (47) of the mounting section (34).

    Abstract translation: 本发明提供一种具有增加的屏蔽效果和提高的生产率的弯曲刚性布线板，并减少制造工艺步骤的数量，以及制造柔性刚性布线板的方法。 挠性刚性布线板由在外表面上具有屏蔽层（45）的柔性电缆部分（32）和刚性安装部分（34）组成，刚性安装部分（34）具有设置在与屏蔽层相同的表面上的布线层（47） 层（45）。 屏蔽层（45）和布线层（47）由相同的连续铜箔片（46）制成。 布线层（47）被电镀并且被制成比屏蔽层（45）更厚。 在屏蔽层（45）的外侧和安装部（34）的布线层（47）上设置相同的连续绝缘层（48）。

    Flexible printed circuit board having crack-preventing features between static and dynamic regions, and hard disk drive employing the same
    78.
    发明授权
    Flexible printed circuit board having crack-preventing features between static and dynamic regions, and hard disk drive employing the same 有权
    柔性印刷电路板在静态和动态区域之间具有防裂特性，并且采用这种功能的硬盘驱动器

    公开(公告)号：US07869164B2

    公开(公告)日：2011-01-11

    申请号：US11730199

    申请日：2007-03-30

    Applicant: Sang-chul Shin

    Inventor： Sang-chul Shin

    IPC: G11B5/55

    CPC classification number: H05K1/0281 ,  G11B5/4846 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/2009 ,  Y10T29/49025 ,  Y10T29/49124

    Abstract: A flexible printed circuit board has a flexible dynamic region, and relatively rigid static regions between which the dynamic region extends. Portions of a base layer, a patterned conductive layer extending on the base layer, and a cover layer covering the conductive layer make up the dynamic region. Extensions of the base layer, the conductive layer, and the cover layer, and portions of a metal layer to which the base layer is attached make up each of the static regions. The metal layer enhances the rigidity of the flexible printed circuit board at the static regions. The metal layer also has rounded corners at sides of each of the boundaries between the dynamic region and each of the static regions to minimize stress concentrations at the boundaries. The conductive layer is made up of real traces through which electrical signals are transmitted, and dummy traces. The dummy traces are disposed outwardly of the real traces to prevent the flexible printed circuit board from cracking at the boundaries between the dynamic region and each of the static regions. In an HDD, the flexible printed circuit board electrically connects a head stack assembly (HSA) and a main circuit board.

    Abstract translation: 柔性印刷电路板具有柔性动态区域和动态区域在其间延伸的相对刚性的静态区域。 基底层的一部分，在基底层上延伸的图案化导电层和覆盖导电层的覆盖层构成动态区域。 基底层，导电层和覆盖层的延伸部以及附着有基底层的金属层的部分构成每个静态区域。 金属层增强了柔性印刷电路板在静态区域的刚性。 金属层在动态区域和每个静态区域之间的每个边界的侧面也具有圆角，以使边界处的应力集中最小化。 导电层由传输电信号的真实迹线和虚拟轨迹组成。 虚拟轨迹设置在实际迹线的外侧，以防止柔性印刷电路板在动态区域和每个静态区域之间的边界处开裂。 在HDD中，柔性印刷电路板电连接磁头堆叠组件（HSA）和主电路板。

    FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING SAME
    79.
    发明申请
    FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING SAME 有权
    柔性印刷电路及其制造方法

    公开(公告)号：US20100307797A1

    公开(公告)日：2010-12-09

    申请号：US12754929

    申请日：2010-04-06

    Applicant: Hirohito WATANABE

    Inventor： Hirohito WATANABE

    IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00

    CPC classification number: H05K3/281 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49124

    Abstract: To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.

    Abstract translation: 为了通过防止附着在柔性印刷电路上的片材的分离来提高可靠性，提供了包括印刷板主体和加强板的柔性印刷电路。 粘合剂的泄漏部形成为相对于加强板的端面在向外方向泄漏。 泄漏部分粘附在加强板的端面的一部分上，从端面的下端连续，形成向外方向倾斜的倾斜面。 泄漏部分形成为使得其覆盖端面的部分具有从加强板的粘合表面测量的粘合高度hA大于加强件的厚度H1的0％且不大于80％ 板。

Patent Agency Ranking