公开(公告)号：US07649740B2

公开(公告)日：2010-01-19

申请号：US12015212

申请日：2008-01-16

Applicant: Takanori Sekido

Inventor： Takanori Sekido

IPC: H05K7/00

CPC classification number: H05K3/368 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0367 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/00

Abstract: In a stacked mounting structure At least a pair of a first connecting terminal and a second connecting terminal is formed, and further, the stacked mounting structure includes a protruding electrode which is provided on at least any one of the first connecting terminal and the second connecting terminal, and an electroconductive paste which is formed on a side surface of an intermediate substrate, and which electrically connects the first connecting terminal and the second connecting terminal. The first connecting terminal and the second connecting terminal are exposed by a recess in a surface of the intermediate substrate. The first connecting terminal and the second connecting terminal are electrically connected via the protruding electrode and the electroconductive paste in the recess which is provided in the intermediate substrate.

Abstract translation: 在堆叠安装结构中，形成至少一对第一连接端子和第二连接端子，此外，堆叠的安装结构包括设置在第一连接端子和第二连接端子中的至少任一个上的突出电极 端子，以及形成在中间基板的侧面上并将第一连接端子和第二连接端子电连接的导电性糊料。 第一连接端子和第二连接端子由中间基板的表面中的凹部露出。 第一连接端子和第二连接端子经由设置在中间基板的凹部中的突出电极和导电浆料电连接。

公开(公告)号：US20090315168A1

公开(公告)日：2009-12-24

申请号：US12543104

申请日：2009-08-18

Applicant: Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

Inventor： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract translation: 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

公开(公告)号：US07633055B2

公开(公告)日：2009-12-15

申请号：US11715746

申请日：2007-03-08

Applicant: Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

Inventor： Jeffrey Nall ,  Babi Koushik Saha ,  Bill Xin Wang

IPC: H01J40/14 ,  H01J5/02

CPC classification number: H05K3/284 ,  F21K9/00 ,  F21V31/005 ,  F21V31/04 ,  F21Y2115/10 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.

Abstract translation: 光电子器件组件包括电路板和设置在电路板上并与电路板电连接的光电器件。 环形垫片设置在电路板上并围绕光电器件。 将密封剂设置在并且密封电路板的至少一部分并且还覆盖环形垫圈的至少外部环形部分。 密封剂未设置在光电子器件上。 在一种方法中，光电子器件设置在电路板上，该布置包括将光电器件与电路板电连接。 环形垫圈设置在电路板上以围绕光电子器件。 电路板用密封剂密封，密封剂还覆盖环形垫片的至少外环形部分，但不覆盖光电子器件。

公开(公告)号：US07633016B2

公开(公告)日：2009-12-15

申请号：US11714394

申请日：2007-03-05

Applicant: Masaki Yamamoto

Inventor： Masaki Yamamoto

IPC: H01R12/04

CPC classification number: H05K3/3405 ,  H05K3/4015 ,  H05K9/0039 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: A coupling structure between a circuit board and a frame member according to the present invention includes: the frame member made of a metal material; and the circuit board set in the frame member and having a land portion soldered to the frame member, in which a solder reinforcing member that is put on the land portion and is solderable is provided at a corner formed by the frame member and the circuit board, and the frame member, the land portion, and the solder reinforcing member are soldered at the corner.

Abstract translation: 根据本发明的电路板和框架构件之间的联接结构包括：由金属材料制成的框架构件; 并且电路板设置在框架构件中，并且具有焊接到框架构件的焊盘部分，其中放置在焊盘部分上并且可焊接的焊料加强构件设置在由框架构件和电路板形成的拐角处 并且框架部件，焊盘部分和焊料加强部件在角部焊接。

公开(公告)号：US20090290315A1

公开(公告)日：2009-11-26

申请号：US12373154

申请日：2007-06-08

Applicant: Hiroki Iwamiya ,  Yukio Sakai ,  Yuji Osumi

Inventor： Hiroki Iwamiya ,  Yukio Sakai ,  Yuji Osumi

IPC: H05K7/00

CPC classification number: H05K1/141 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: In a communication device, a ground plane disposed on the upper or lower surface of a board or inside the board includes a first ground region disposed on a semiconductor circuit and connected thereto, and a second ground region disposed under an amplifier-and connected thereto. The first ground region and the second ground region do not overlap with each other.

Abstract translation: 在通信装置中，设置在基板的上表面或下表面或基板内的接地平面包括设置在半导体电路上并与其连接的第一接地区域和设置在放大器下方并与其连接的第二接地区域。 第一接地区域和第二接地区域彼此不重叠。

公开(公告)号：US07615712B2

公开(公告)日：2009-11-10

申请号：US11590229

申请日：2006-10-31

Applicant: Hugh Patton Hanley

Inventor： Hugh Patton Hanley

IPC: H01L23/28

CPC classification number: H05K5/0213 ,  H05K3/284 ,  H05K3/301 ,  H05K2201/10689 ,  H05K2201/2018 ,  H05K2203/304

Abstract: An electronic assembly for use in a downhole tool includes a damming boot deployed about at least one integrated circuit component on a circuit board. The boot is disposed to house the integrated circuit leads and solder joints in a substantially sealed cavity between the circuit board, the integrated circuit body, and an inner surface of the damming boot. The boot is also disposed to support the integrated circuit body and thereby improve the shock and vibration resistance of various electronic assemblies used in downhole tools. The invention also tends to improve the reworkability of downhole electronic assemblies.

Abstract translation: 用于井下工具的电子组件包括围绕电路板上的至少一个集成电路部件部署的防护罩。 引导件被设置为将集成电路引线和焊接点容纳在电路板，集成电路体和防护罩的内表面之间的基本密封的空腔中。 该引导罩还设置成支撑集成电路体，从而提高了井下工具中使用的各种电子组件的抗冲击和抗振动性。 本发明也倾向于提高井下电子组件的再加工性。

公开(公告)号：US20090268414A1

公开(公告)日：2009-10-29

申请号：US12148832

申请日：2008-04-23

Applicant: Bo Lu

Inventor： Bo Lu

IPC: H05K5/00 ,  B29C45/14

CPC classification number: H05K5/0034 ,  B29C45/14639 ,  B29C2045/14934 ,  B29L2031/3481 ,  H05K3/284 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An over-molded electronic module (2) includes a frame (10), an electronic assembly (20), and a polymeric body (32). The frame (10) includes a sidewall (14) that defines an opening (12) to provide a position for the electronic assembly (20), and includes an upper face (16) and a lower face (18) opposite the upper face (16) to act as sealing surfaces during over-molding. The polymeric body (32) is formed of a polymeric composition encapsulating both sides of the electronic assembly (20) and a portion of the frame (10).

Abstract translation: 包覆模制电子模块（2）包括框架（10），电子组件（20）和聚合体（32）。 框架（10）包括限定开口（12）以提供电子组件（20）的位置的侧壁（14），并且包括与上表面相对的上表面（16）和下表面（18） 16）作为过度成型时的密封面。 聚合物主体（32）由包封电子组件（20）的两侧和框架（10）的一部分的聚合物组合物形成。

公开(公告)号：US20090263990A1

公开(公告)日：2009-10-22

申请号：US12148279

申请日：2008-04-17

Applicant: Robert W. Brown ,  Tod M. Harlan ,  Kevin E. Walker ,  Terrance F. Little

Inventor： Robert W. Brown ,  Tod M. Harlan ,  Kevin E. Walker ,  Terrance F. Little

IPC: H01R12/04

CPC classification number: H01R12/52 ,  H01R12/7047 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A connector assembly includes a mother board (12), a mother receptacle (11), a daughter board (22), a daughter receptacle (21), and a connecting device (30) mounted between said two boards. The connecting device includes a number of fixing portions, a shroud (31) defining an insertion slot (313) and engageable with said two boards via the fixing portions, and an extender (32) inserted in the insertion slot. The extender defines a lower opening (322) mating with the mother receptacle and an upper opening (321) mating with the daughter receptacle.

Abstract translation: 连接器组件包括母板（12），母插座（11），子板（22），子插座（21）和安装在所述两个板之间的连接装置（30）。 连接装置包括多个固定部分，限定插入槽（313）并且经由固定部分可与所述两个板卡合的护罩（31）和插入插入槽中的扩展器（32）。 扩展器限定与母插座配合的下开口（322）和与子插座配合的上开口（321）。

公开(公告)号：US07602613B2

公开(公告)日：2009-10-13

申请号：US11624608

申请日：2007-01-18

Applicant: Paul Goodwin ,  James W. Cady ,  Douglas Wehrly

Inventor： Paul Goodwin ,  James W. Cady ,  Douglas Wehrly

IPC: H05K1/00

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

Abstract translation: 柔性电路具有用于安装在插座或卡缘连接器中的触点。 柔性电路包括安装在边缘连接器触头两侧的集成电路器件。 优选地，柔性电路围绕刚性基板的边缘缠绕，并且在基板的两侧上提供用于安装在插座中的触点。 可以用相同的策略覆盖多个柔性电路。 柔性电路可以表现出一个或两个或更多个导电层，并且可能具有分层结构的变化或具有分裂层。

公开(公告)号：US20090225523A1

公开(公告)日：2009-09-10

申请号：US12397062

申请日：2009-03-03

Applicant: Hiroyuki Onishi ,  Toshiaki Nagase ,  Jun Ishikawa ,  Naohito Kanie ,  Kazuyoshi Kontani

Inventor： Hiroyuki Onishi ,  Toshiaki Nagase ,  Jun Ishikawa ,  Naohito Kanie ,  Kazuyoshi Kontani

IPC: H05K5/00 ,  H01R12/16

CPC classification number: H02M7/003 ,  H01L25/162 ,  H01L25/165 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An electronic unit includes a first circuit board having a power semiconductor device and an electrolytic capacitor and a second circuit board having an electronic component to control the power semiconductor device. The second circuit board is arranged perpendicular to the first circuit board and along the surface of the electrolytic capacitor. The electronic unit further includes a connecting member being jointed at one end thereof to the first circuit board and jointed at the other end thereof to the second circuit board for electrical connection between the first and second circuit boards.

Abstract translation: 电子单元包括具有功率半导体器件和电解电容器的第一电路板和具有用于控制功率半导体器件的电子元件的第二电路板。 第二电路板垂直于第一电路板并且沿着电解电容器的表面布置。 电子单元还包括连接构件，其一端连接到第一电路板，并在另一端连接到第二电路板，用于第一和第二电路板之间的电连接。