中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

198 records (took 0.019 seconds)

    Circuit board clamping device
    81.
    发明申请
    Circuit board clamping device 有权
    电路板夹紧装置

    公开(公告)号：US20060215374A1

    公开(公告)日：2006-09-28

    申请号：US11091974

    申请日：2005-03-28

    Applicant: Hsien-Te Chang

    Inventor： Hsien-Te Chang

    IPC: H05K1/14

    CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K7/142 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10393 ,  H05K2201/2036

    Abstract: A circuit board clamping device is applied to at least two spaced and stacked circuit boards, wherein the two circuit boards are spaced apart and fixed by a plurality of spacing posts. The circuit board clamping device includes a securing member, a pressing member and a forcing member. The securing member can be disposed on one of the circuit boards and adjacent to the spacing posts. The pressing member can be disposed on the securing member and is used to press the spacing posts. The forcing member is disposed on the pressing member and is engaged with the pressing member. The two circuit boards are securely stacked and coupled to each other by the pressing member pressing the spacing posts.

    Abstract translation: 电路板夹持装置被施加到至少两个间隔和堆叠的电路板，其中两个电路板由多个间隔柱间隔开并固定。 电路板夹持装置包括固定构件，按压构件和迫动构件。 固定构件可以设置在一个电路板上并与间隔柱相邻。 按压构件可以设置在固定构件上并用于按压间隔柱。 强制构件设置在按压构件上并与按压构件接合。 两个电路板通过按压间隔柱的按压构件被牢固地堆叠并彼此联接。

    Connection system for communication channels and expansion card for electronic apparatus adopting said connection system
    85.
    发明申请
    Connection system for communication channels and expansion card for electronic apparatus adopting said connection system 审中-公开
    用于通信通道的连接系统和采用所述连接系统的电子设备的扩展卡

    公开(公告)号：US20050215091A1

    公开(公告)日：2005-09-29

    申请号：US11086252

    申请日：2005-03-23

    Applicant: Mauro Rossi ,  Giampietro Tecchiolli

    Inventor： Mauro Rossi ,  Giampietro Tecchiolli

    IPC: G06F1/18 ,  G06F13/40 ,  H05K1/14 ,  H01R4/66

    CPC classification number: G06F13/409 ,  G06F1/185 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10356

    Abstract: Connection system to connect a plurality of communication channels to an electronic apparatus such as a personal computer, a PC-cluster or suchlike, and expansion card to manage the communication channels on the electronic apparatus. The electronic apparatus has a chassis. The system consists of a first printed circuit, which supports first connectors for managing a first pair of communication channels on the electronic apparatus and connection members for assembling at least a second printed circuit. The second printed circuit supports in turn second connectors for managing a second pair of communication channels on the electronic apparatus. The first and the second printed circuit develop at least partly outside the chassis.

    Abstract translation: 连接系统，用于将多个通信信道连接到诸如个人计算机，PC集群等的电子设备和扩展卡，以管理电子设备上的通信信道。 电子设备具有底盘。 该系统包括第一印刷电路，其支持用于管理电子设备上的第一对通信信道的第一连接器和用于组装至少第二印刷电路的连接构件。 第二印刷电路依次支撑第二连接器，用于管理电子设备上的第二对通信信道。 第一和第二印刷电路至少部分地发展到底盘外部。

    Electronic assembly with integrated IO and power contacts
    86.
    发明申请
    Electronic assembly with integrated IO and power contacts 失效
    具有集成IO和电源触点的电子组件

    公开(公告)号：US20050212120A1

    公开(公告)日：2005-09-29

    申请号：US10810957

    申请日：2004-03-26

    Applicant: Donald Tran

    Inventor： Donald Tran

    IPC: H01L23/02 ,  H01L23/10 ,  H01L23/50 ,  H01L23/52 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K7/10

    CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

    Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

    Abstract translation: 在一些示例性实施例中，集成电路，电子组件和方法提供用于向处理器供电的电流路径。 作为示例，集成电路包括具有从基座的上表面延伸的电力触点的基座。 集成电路还包括安装到基座的上表面以将基板电耦合到基座的基板。 模具安装在基板上，使得模具电耦合到基板。 基座上表面上的电源触点接合子板，使得管芯能够通过基座上表面上的电源触点从安装在子板上的电压源接收电力。

    Semiconductor assembly with a semiconductor module
    89.
    发明授权
    Semiconductor assembly with a semiconductor module 失效
    具有半导体模块的半导体组件

    公开(公告)号：US06774483B2

    公开(公告)日：2004-08-10

    申请号：US10414837

    申请日：2003-04-16

    Applicant: Jürgen Högerl ,  Erich Syri

    Inventor： Jürgen Högerl ,  Erich Syri

    IPC: H01L2334

    CPC classification number: H05K1/141 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10189 ,  H01L2924/00

    Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.

    Abstract translation: 半导体组件包括模块保持器和半导体模块，其具有带有导体轨迹的板基板和安装在基板上的一个或多个未封装的半导体芯片，其通过电触点连接到基板上的导体轨道。 衬底在一个边缘处具有至少一个具有连接接触区域的接触片，其连接到至少一些导体轨道。 模块保持器具有用于与其他部件的电连接的插入式连接，用于连接至少一个半导体模块的接触条的至少一个配合接触条和至少一个半导体的接触区之间的电导体 插头连接的模块和电气触点。 该配置允许半导体模块以经济的方式连接到外部世界。

Patent Agency Ranking