公开(公告)号：US08362366B2

公开(公告)日：2013-01-29

申请号：US13006222

申请日：2011-01-13

Applicant: Tsugio Ambo ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

Inventor： Tsugio Ambo ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

IPC: H05K1/11

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract translation: 电路板包括设置在通过注射成型形成的合成树脂板上的箔电路，由铜箔制成并且具有不同于电路板的图案。 在树脂板上设置向上突出的定位销，并穿过箔片电路中制成的针孔。 箔片电路定位并固定到树脂板上。 在树脂板的所需部分中，设置有端子插入孔，并且接收端子固定到端子插入孔的所需部分并连接到箔片电路。

公开(公告)号：US08192207B2

公开(公告)日：2012-06-05

申请号：US13034066

申请日：2011-02-24

Applicant: Mituru Iida

Inventor： Mituru Iida

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R12/52 ,  H01R12/55 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/1059 ,  H05K2201/2009

Abstract: A female circuit board for use with a male circuit board has electrically conductive projections. The female circuit board includes a flexible insulating film. The flexible insulating film includes insertion portions into which the conductive projections of the male circuit board are allowed to be inserted. Each of the insertion portions includes a plurality of slits communicating with each other at the center of each of the insertion portions. The flexible insulating film further includes electrically conduction portions for making contact with the conductive projections to come into conduction with the male circuit board. The conduction portions are disposed around the insertion portions on the surface of the female circuit board facing the male circuit board when the female circuit board is in contact with the male circuit board. The conduction portions conform in shape to the insertion portions.

Abstract translation: 与阳电路板一起使用的母电路板具有导电突起。 阴电路板包括柔性绝缘膜。 柔性绝缘膜包括允许插入阳电路板的导电突起的插入部分。 每个插入部分包括在每个插入部分的中心处彼此连通的多个狭缝。 柔性绝缘膜还包括用于与导电突起接触以与阳电路板导通的导电部分。 当阴电路板与阳电路板接触时，导电部分设置在阴电路板的面对阳电路板的表面上的插入部分周围。 导电部分的形状与插入部分一致。

公开(公告)号：US20120092844A1

公开(公告)日：2012-04-19

申请号：US12738167

申请日：2008-10-17

Applicant: Kate Stone

Inventor： Kate Stone

IPC: H05K7/06 ,  B31B1/88 ,  B23P19/00 ,  B65D85/00 ,  B32B3/10 ,  B31B1/14 ,  B31B3/00

CPC classification number: F21V21/14 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/12 ,  H05K3/32 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09936 ,  H05K2201/10674 ,  H05K2203/1545 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T428/24273

Abstract: A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.

Abstract translation: 一种制造产品包装的方法包括在一片材料上形成多个导电轨迹并形成物理屏障，例如孔，用于阻止相邻导电轨道之间的流体流动。 该方法还可以包括将第一和第二区域导电流体沉积到物理屏障两侧的相邻第一和第二导电轨道上，并且安装具有第一和第二端子的电子设备，使得电子设备在物理屏障上形成桥， 并且第二端子接触第一和第二导电相邻轨道。

公开(公告)号：US20110278048A1

公开(公告)日：2011-11-17

申请号：US13146358

申请日：2009-01-27

Applicant: Kenshi Numakura

Inventor： Kenshi Numakura

IPC: H05K1/00

CPC classification number: H05K3/365 ,  H01R12/613 ,  H01R12/62 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/1059

Abstract: A high-density, narrow-pitch, and high-pin-count connecting structure with a very low mounting height is realized at low cost.A flexible circuit 10 has first through holes 15 in a plane of first contact pads 13, the first through holes 15 passing through the flexible circuit 10 in a thickness direction of the flexible circuit 10. A target member 20 has second holes 25 in a plane of second contact pads 23, the second holes 25 passing through the target member 20 in a thickness direction of the target member 20. A connector main body 30 has first protrusions 33 on one surface of a third base 31, the first protrusions 33 corresponding to the first through holes 15 of the flexible circuit 10 and the second holes 25 of the target member 20. The connector main body 30 is pressed against the flexible circuit 10 disposed such that the first contact pads 13 face the second contact pads 23, so that the first protrusions 33 are passed through the first through holes 15 and inserted into the second holes 25, the flexible circuit 10 is mechanically connected to the target member 20, and an electrical connection between the first contact pads 15 and the second contact pads 15 is established by pressure contacting.

Abstract translation: 以低成本实现了具有非常低的安装高度的高密度，窄节距和高针数连接结构。 柔性电路10在第一接触焊盘13的平面中具有第一通孔15，第一通孔15沿柔性电路10的厚度方向穿过柔性电路10.目标构件20在平面中具有第二孔25 第二接触焊盘23，第二孔25沿着目标构件20的厚度方向穿过目标构件20.连接器主体30在第三基座31的一个表面上具有第一突起33，第一突起33对应于 柔性电路10的第一通孔15和目标构件20的第二孔25.连接器主体30被压靠设置成使得第一接触焊盘13面对第二接触焊盘23的柔性电路10，使得 第一突起33穿过第一通孔15并插入第二孔25中，柔性电路10与目标构件20机械连接，并且第二突起33之间的电连接 第一接触垫15和第二接触垫15通过压力接触建立。

公开(公告)号：US08040685B2

公开(公告)日：2011-10-18

申请号：US12146032

申请日：2008-06-25

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/11

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

公开(公告)号：US08009260B2

公开(公告)日：2011-08-30

申请号：US12504730

申请日：2009-07-17

Applicant: Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

Inventor： Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2202/22 ,  H05K1/0215 ,  H05K1/0393 ,  H05K2201/09063 ,  H05K2201/091

Abstract: A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.

Abstract translation: 提供了用于设置在液晶模块的框架和导电壳体之间的柔性印刷电路。 框架包括主板和连接到主板一侧的侧板。 柔性印刷电路包括主体和接地部分。 主体用于设置在框架的主板上。 接地部分从主体延伸。 接地部分相对于本体弯曲到预定角度，使得接地部分设置在框架的侧板上。 接地部分具有与导电壳体的侧板的内壁接触的金属层。 柔性印刷电路具有位于接地部与主体连接的位置的孔。

公开(公告)号：US20110120756A1

公开(公告)日：2011-05-26

申请号：US13006122

申请日：2011-01-13

Applicant: Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

Inventor： Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

公开(公告)号：US20110029723A1

公开(公告)日：2011-02-03

申请号：US12885451

申请日：2010-09-18

Applicant: Charles C. Lee ,  David Q. Chow ,  Abraham Chih-Kang Ma ,  I-Kang Yu ,  Ming-Shiang Shen

Inventor： Charles C. Lee ,  David Q. Chow ,  Abraham Chih-Kang Ma ,  I-Kang Yu ,  Ming-Shiang Shen

IPC: G06F12/02 ,  G06F12/00

CPC classification number: G06K19/07743 ,  A45C2011/188 ,  G06K19/07732 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

Abstract: Non-volatile memory based computer systems and methods are described. According to one aspect of the invention, at least one non-volatile memory module is coupled to a computer system as main storage. The non-volatile memory module is controlled by a northbridge controller configured to control the non-volatile memory as main memory. The page size of the at least one non-volatile memory module is configured to be the size of one of the cache lines associated with a microprocessor of the computer system. According to another aspect, at least one non-volatile memory module is coupled to a computer system as data read/write buffer of one or more hard disk drives. The non-volatile memory module is controlled by a southbridge controller configured to control the non-volatile memory as an input/out device. The page size of the at least one non-volatile memory module is configured in proportion to characteristics of the hard disk drives.

Abstract translation: 描述了基于非易失性存储器的计算机系统和方法。 根据本发明的一个方面，至少一个非易失性存储器模块耦合到作为主存储器的计算机系统。 非易失性存储器模块由配置成将非易失性存储器控制为主存储器的北桥控制器来控制。 至少一个非易失性存储器模块的页面大小被配置为与计算机系统的微处理器相关联的高速缓存行之一的大小。 根据另一方面，至少一个非易失性存储器模块作为一个或多个硬盘驱动器的数据读/写缓冲器耦合到计算机系统。 非易失性存储器模块由配置成将非易失性存储器控制为输入/输出设备的南桥控制器来控制。 至少一个非易失性存储器模块的页面大小被配置成与硬盘驱动器的特性成比例。

公开(公告)号：US07834441B2

公开(公告)日：2010-11-16

申请号：US11902675

申请日：2007-09-25

Applicant: Hiroki Kamiya ,  Motoki Shimizu ,  Satoshi Takeuchi

Inventor： Hiroki Kamiya ,  Motoki Shimizu ,  Satoshi Takeuchi

IPC: H01L23/14 ,  H01L23/053

CPC classification number: H05K1/186 ,  H05K1/183 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

Abstract translation: 多层基板包括具有多个树脂膜的绝缘基底构件，嵌入绝缘基底构件中的电气元件和间隔件。 树脂膜由热塑性树脂制成并且彼此堆叠并附接。 至少一个树脂膜具有用于插入电气元件的通孔。 一个树脂膜还具有多个突出部件。 一个突出构件与另一个突出构件相对，使得一个和另一个突出构件接触并夹着电气元件。 间隔件布置在一个树脂膜和相邻的树脂膜之间，并且设置在一个突出构件的基部。

公开(公告)号：US20100277666A1

公开(公告)日：2010-11-04

申请号：US12601526

申请日：2008-05-20

Applicant: Ralph Peter Bertram ,  David Dussault ,  Matthias Fiegler ,  Harald Stoyan

Inventor： Ralph Peter Bertram ,  David Dussault ,  Matthias Fiegler ,  Harald Stoyan

IPC: G02F1/1335 ,  F21S4/00 ,  G02F1/13357

CPC classification number: G02F1/133608 ,  F21K9/00 ,  F21S4/22 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  G02F1/133603 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/091 ,  H05K2201/10106

Abstract: A lighting arrangement is disclosed with a light module (2) that has at least one first group (22, 22′) of light sources (221, 222, 223) and one second group (22, 22″) of light sources that are arranged spaced apart from each other on a flexible circuit board (21), and with a carrier (1) on which the light module is mounted, and a buffer zone (12) that laterally overlaps with the light module between the first and the second group of light sources. Furthermore, a backlighting device and a display device are disclosed.

Abstract translation: 公开了具有光模块（2）的照明装置，所述光模块具有光源的至少一个第一组（22,22'）和第二组（22,22“），所述第一组（22,22'）和第二组22,22' 在柔性电路板（21）上彼此间隔开并且与其上安装有光模块的载体（1）和在第一和第二二极管（21）之间与光模块横向重叠的缓冲区（12） 一组光源。 此外，公开了一种背光装置和显示装置。