公开(公告)号：US20180070438A1

公开(公告)日：2018-03-08

申请号：US15696270

申请日：2017-09-06

Applicant: Nitto Denko Corporation

Inventor： Daisuke YAMAUCHI ,  Hiroyuki TANABE

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/46 ,  G11B5/48

CPC classification number: H05K1/0224 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/056 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/10083

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

公开(公告)号：US09832864B2

公开(公告)日：2017-11-28

申请号：US15161731

申请日：2016-05-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Junichiro Iri ,  Ryo Sato ,  Kazuhiro Idogawa ,  Chiaki Muraoka ,  Hiromasa Amma ,  Takuya Iwano

IPC: H05K1/02 ,  B41J2/175 ,  B41J2/14 ,  H05K3/00

CPC classification number: H05K1/028 ,  B41J2/14 ,  B41J2/1752 ,  B41J2/1753 ,  B41J2/17553 ,  H05K1/0296 ,  H05K3/0058 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09663 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: A liquid ejection head includes a circuit board having a wire pattern divided into a plurality of portions in order to provide the circuit board with very reliable bonding.

公开(公告)号：US20160372811A1

公开(公告)日：2016-12-22

申请号：US15256818

申请日：2016-09-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Takahiro BABA ,  Kosuke NISHINO

IPC: H01P1/203 ,  H05K1/02 ,  H05K5/00 ,  H05K1/18 ,  H01P3/08 ,  H01P5/02

CPC classification number: H01P1/203 ,  H01P1/2039 ,  H01P3/026 ,  H01P3/08 ,  H01P5/02 ,  H05K1/0216 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/147 ,  H05K1/18 ,  H05K5/0086 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: A transmission line member includes a dielectric base body. At an intermediate point in a thickness direction of the dielectric base body, first and second signal conductors are disposed. A reference ground conductor is disposed at one side of the first and second signal conductors in the thickness direction, and an auxiliary ground conductor is disposed at the other side. At intermediate points of the first signal conductor, a coil conductor and a capacitor-defining plate conductor are disposed. The capacitor-defining plate conductor faces the reference ground conductor and the auxiliary ground conductor to connect a low pass filter and the first transmission line. A coil conductor is disposed between the second signal conductor and the reference ground conductor, and connected to the second signal conductor and the reference ground conductor to connect a high pass filter and the second transmission line.

Abstract translation: 传输线构件包括电介质基体。 在电介质基体的厚度方向的中间点设置有第一和第二信号导体。 参考接地导体设置在第一和第二信号导体的厚度方向的一侧，辅助接地导体设置在另一侧。 在第一信号导体的中间点设置有线圈导体和电容器限定板导体。 电容器限定板导体面向参考接地导体和辅助接地导体，以连接低通滤波器和第一传输线。 线圈导体设置在第二信号导体和参考接地导体之间，并连接到第二信号导体和参考接地导体，以连接高通滤波器和第二传输线。

公开(公告)号：US09398693B2

公开(公告)日：2016-07-19

申请号：US14300797

申请日：2014-06-10

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： Jun Muto

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  H05K1/16 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K1/181 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/162 ,  H05K1/165 ,  H05K3/247 ,  H05K2201/0305 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/43

Abstract: A capacitor arrangement structure includes: a first wiring pattern; a second wiring pattern; a first electrode pattern that protrudes from the first wiring pattern toward the second wiring pattern; a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to run in parallel to the first electrode pattern; and a plurality of capacitors that are arranged in parallel between the first electrode pattern and the second electrode pattern.

Abstract translation: 电容器配置结构包括：第一布线图案; 第二布线图案; 从所述第一布线图案朝向所述第二布线图案突出的第一电极图案; 第二电极图案，其从所述第二布线图案朝向所述第一布线图案突出以与所述第一电极图案平行; 以及平行布置在第一电极图案和第二电极图案之间的多个电容器。

公开(公告)号：US20160147374A1

公开(公告)日：2016-05-26

申请号：US15010744

申请日：2016-01-29

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya HASHIMOTO

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/11 ,  G06F3/044

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

公开(公告)号：US09209509B2

公开(公告)日：2015-12-08

申请号：US14218634

申请日：2014-03-18

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

IPC: G02B6/12 ,  H01P3/00 ,  G02F1/01 ,  H05K1/02 ,  G02F1/03 ,  G02F1/225

CPC classification number: H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

Abstract translation: 在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关联的电感 光电子组件。 信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

公开(公告)号：US09192080B2

公开(公告)日：2015-11-17

申请号：US13685713

申请日：2012-11-27

Applicant: Frank Scholz ,  Stefan Graf ,  Andre Waldschmidt ,  Lars Lindenstruth ,  Marco Jung

Inventor： Frank Scholz ,  Stefan Graf ,  Andre Waldschmidt ,  Lars Lindenstruth ,  Marco Jung

IPC: H01M10/46 ,  H05K9/00 ,  H02J7/02 ,  H02J7/00 ,  H01F27/36

CPC classification number: H05K9/00 ,  H01F27/362 ,  H02J7/0027 ,  H02J7/0042 ,  H02J7/025 ,  H02J50/10 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/0227 ,  H05K2201/09254

Abstract: A comb-structured shielding layer and a wireless charging transmitter thereof are provided. The wireless charging module is connected to a power source, has at least one wireless charging coil and at least one comb-structured shielding layer, and is configured to convert alternative current power from the power source to H-field electromagnetic radiations, and wirelessly charges an electronic device. The comb-structured shielding layer is disposed between the wireless charging module and the target electronic device and configured to allow the H-field electromagnetic radiations pass through. The comb-structured shielding layer includes a first area and a second area. The first area is electrically connected to a reference electric potential. The second area is electrically connected to the reference electric potential through the first area, and is configured to shield the E-field electromagnetic radiations but allow the H-field electromagnetic radiations pass through the comb-structured shielding layer.

Abstract translation: 提供梳状结构的屏蔽层及其无线充电发射器。 无线充电模块连接到电源，具有至少一个无线充电线圈和至少一个梳状屏蔽层，并且被配置为将来自电源的替代电流功率转换为H场电磁辐射，并且将无线充电模块无线充电 电子设备。 梳状结构的屏蔽层设置在无线充电模块和目标电子装置之间，并且被配置为允许H场电磁辐射通过。 梳状结构的屏蔽层包括第一区域和第二区域。 第一区域电连接到参考电位。 第二区域通过第一区域电连接到参考电位，并且被配置为屏蔽E场电磁辐射，但是允许H场电磁辐射通过梳结构屏蔽层。

公开(公告)号：US20150237726A1

公开(公告)日：2015-08-20

申请号：US14454850

申请日：2014-08-08

Applicant: Samsung Display Co., LTD.

Inventor： Ki-Hae SHIN ,  Jeong-Hun GO ,  Hee-Un KU ,  Young-Sun KIM ,  Hoe-Seok NA

IPC: H05K1/11 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.

Abstract translation: 一种带包装，包括：基底基板，包括信号传输区域和从信号传输区域突出的突出区域;安装在基底基板上的集成电路芯片;以及设置在基底基板上的引线， 集成电路芯片，与第一部分电连接并沿第一方向延伸的第二部分，以及与第二部分电连接并沿与​​第一方向交叉的第二方向延伸的第三部分。

公开(公告)号：US20150189742A1

公开(公告)日：2015-07-02

申请号：US14519636

申请日：2014-10-21

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE

IPC: H05K1/02 ,  H05K3/16 ,  H05K3/18 ,  H05K3/14

CPC classification number: H05K1/0245 ,  G11B5/484 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion.

Abstract translation: 具有电路的悬挂板包括金属支撑层和形成在金属支撑层上的绝缘层。 绝缘层由单层制成，在绝缘层中形成凹部，在凹部形成露出金属支撑层的开口部，在开口部形成导电性金属部。

公开(公告)号：US20140306793A1

公开(公告)日：2014-10-16

申请号：US14237981

申请日：2012-08-15

Applicant: King Abdullah University of Science and Technology

Inventor： Atif Shamim ,  Eyad Arabi

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F2017/0026 ,  H01F2017/0073 ,  H03H7/0115 ,  H03H7/09 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0078 ,  H03H2001/0085 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/09254 ,  H05K2201/09672 ,  H05K2201/09809

Abstract: Various methods and systems are provided for high Q, miniaturized LCP-based passive components. In one embodiment, among others, a spiral inductor includes a center connection and a plurality of inductors formed on a liquid crystal polymer (LCP) layer, the plurality of inductors concentrically spiraling out from the center connection. In another embodiment, a vertically intertwined inductor includes first and second inductors including a first section disposed on a side of the LCP layer forming a fraction of a turn and a second section disposed on another side of the LCP layer. At least a portion of the first section of the first inductor is substantially aligned with at least a portion of the second section of the second inductor and at least a portion of the first section of the second inductor is substantially aligned with at least a portion of the second section of the first inductor.

Abstract translation: 提供了高Q，小型化的基于LCP的无源​​组件的各种方法和系统。 在一个实施例中，螺旋电感器包括中心连接和形成在液晶聚合物（LCP）层上的多个电感器，多个电感器从中心连接同心地向外螺旋出。 在另一个实施例中，垂直交织的电感器包括第一和第二电感器，该电感器包括设置在LCP层的一侧的第一部分，其形成一小部分转弯，而第二部分设置在LCP层的另一侧上。 第一电感器的第一部分的至少一部分基本上与第二电感器的第二部分的至少一部分对准，并且第二电感器的第一部分的至少一部分基本上对准至少部分 第一电感的第二部分。