公开(公告)号：US09942988B2

公开(公告)日：2018-04-10

申请号：US15281340

申请日：2016-09-30

Applicant: TDK Corporation

Inventor： Kazuharu Kitatani ,  Yasunobu Noguchi

IPC: H05K7/00 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface of the base substrate; and an electronic component disposed on the mounting surface and including a plurality of terminals. At least one of the terminals is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion is inserted. A first insertion portion is provided in the component connecting end portion. The terminal is inserted through the first insertion portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface positioned closer to a rear surface of the base substrate than the component mounting surface. The soldering surface is on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes.

公开(公告)号：US09925880B2

公开(公告)日：2018-03-27

申请号：US14176483

申请日：2014-02-10

Applicant: Bayerische Motoren Werke Aktiengesellschaft

Inventor： Jose Lopez de Arroyabe

IPC: B60L11/18 ,  B60L15/00 ,  H05K1/14 ,  H05K7/14 ,  H05K1/02 ,  B60L15/20 ,  H02P27/06 ,  H02M7/00

CPC classification number: B60L11/1803 ,  B60L15/007 ,  B60L15/20 ,  B60L2240/429 ,  B60L2240/80 ,  B60L2270/147 ,  H02M7/003 ,  H02P27/06 ,  H05K1/0263 ,  H05K1/144 ,  H05K7/1432 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10272 ,  Y02T10/644 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/72 ,  Y02T10/7275

Abstract: A vehicle includes a power electronics unit for converting energy between a DC circuit and a polyphase machine, wherein the power electronics unit has a power module, a driver board, and a control board. The power electronics unit has two DC current rails, wherein the DC circuit can be connected to the same, and the power electronics unit has phase current rails, wherein the polyphase machine can be connected to the same. The number of the phase current rails corresponds to the number of the phases of the polyphase machine. The arrangement of the power module, the driver board, and the control board corresponds to a stacked or sandwiched construction, the phase current rails are electrically connected to the power module, and the control board has a passage for each of the phase current rails, wherein one phase current rail is fed through each passage.

公开(公告)号：US20180062539A1

公开(公告)日：2018-03-01

申请号：US15248241

申请日：2016-08-26

Applicant: Deere & Company

Inventor： Brij N. Singh ,  Christopher J. Schmit

IPC: H02M7/537 ,  H01L29/16 ,  H01L29/20 ,  H02M1/08 ,  H05K1/18 ,  H05K1/14 ,  H01L25/07 ,  H05K1/11 ,  H05K1/16 ,  H02M7/00 ,  H02P27/06 ,  G01R15/18 ,  G01R15/20

CPC classification number: H02M7/537 ,  G01R15/18 ,  G01R15/202 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H02M1/08 ,  H02M7/003 ,  H02M2001/0009 ,  H02P27/06 ,  H05K1/0263 ,  H05K1/117 ,  H05K1/144 ,  H05K1/165 ,  H05K1/181 ,  H05K7/1432 ,  H05K7/20518 ,  H05K7/20872 ,  H05K2201/042 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

公开(公告)号：US20170354027A1

公开(公告)日：2017-12-07

申请号：US15535089

申请日：2015-12-09

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Masayuki Inoue

IPC: H05K1/02 ,  C09J163/00 ,  C09J9/00 ,  G06F21/60 ,  G06F21/72 ,  C09K5/14 ,  H05K1/18

CPC classification number: H05K1/0203 ,  C09J9/00 ,  C09J163/00 ,  C09K5/14 ,  G06F21/602 ,  G06F21/72 ,  G06F21/86 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10272

Abstract: Provided is an information processing apparatus that enables acquisition, manipulation and the like of information through unauthorized access to be prevented with a simple structure, without needing constant supply of power. A control apparatus (20) operates using power supply from a built-in power source (30), in the case where power is not supplied from an external power source (3). In the case where a photoelectric conversion unit (31) performs photoelectric conversion and the built-in power source (30) supplies power to the control apparatus (20), the voltage output by the photoelectric conversion unit (31) is input to an input unit (24), when a switch (50) is ON. On the other hand, when the switch (50) is OFF, a voltage value of zero volts is input to the input unit (24).

公开(公告)号：US20170238411A1

公开(公告)日：2017-08-17

申请号：US15519715

申请日：2015-10-02

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Takehito Kobayashi ,  Arinobu Nakamura ,  Tou Chin ,  Shigeki Yamane

IPC: H05K1/02 ,  C09J163/00 ,  B32B37/12 ,  C09J7/02 ,  B32B7/12 ,  H05K1/18 ,  C09J9/00

CPC classification number: H05K1/0204 ,  B32B7/12 ,  B32B37/12 ,  B32B2457/08 ,  C09J7/22 ,  C09J7/38 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/066 ,  H05K2201/10272 ,  H05K2201/10598 ,  H05K2203/0522

Abstract: A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

公开(公告)号：US09705216B2

公开(公告)日：2017-07-11

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan Weale ,  Julian Peter Mayes

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R13/658 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US09613892B2

公开(公告)日：2017-04-04

申请号：US14529192

申请日：2014-10-31

Applicant: Goodrich Corporation

Inventor： Debabrata Pal

IPC: H01L23/49 ,  H01L23/50 ,  H01L23/498 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49811 ,  H01L23/50 ,  H01L24/00 ,  H05K1/0203 ,  H05K1/0265 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A printed circuit board for selectively communicating power from a power source to a use has an input bus for receiving a power supply. A transistor is connected to the input bus and is positioned on one side of the input bus in a first direction. An output bus is connected to the transistor on an opposed side of the transistor relative to the input bus. The transistor is intermediate at the first input and output buses in the first dimension. A power supply system is also disclosed.

公开(公告)号：US20170094790A1

公开(公告)日：2017-03-30

申请号：US15310530

申请日：2015-03-05

Applicant: Auto-Kabel Management GmbH

Inventor： Wacim Tazarine ,  Simon Betscher ,  Frank Gronwald ,  Sohejl Rafati

IPC: H05K1/14 ,  F02N11/08 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

公开(公告)号：US09584038B2

公开(公告)日：2017-02-28

申请号：US14725720

申请日：2015-05-29

Applicant: Enphase Energy, Inc.

Inventor： Ryan Linderman

IPC: H05K7/20 ,  H02M7/00 ,  H05K7/14 ,  H01L23/473

CPC classification number: H05K7/1432 ,  H01R13/642 ,  H02M7/003 ,  H02M7/44 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0065 ,  H05K2201/10272 ,  H05K2201/10356 ,  H05K2201/1059

Abstract: A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output.

Abstract translation: 一种无需连接到地的电力转换的系统和装置。 在一个实施例中，该装置包括具有由绝缘材料形成的外壳的逆变器，其中逆变器接收直流输入并从直流输入端产生不具有任何接地连接的第一交流线电压输出和第二交流线 电压输出。

公开(公告)号：US20170047720A1

公开(公告)日：2017-02-16

申请号：US15307703

申请日：2015-04-21

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Takehito Kobayashi ,  Yoshikazu Sasaki ,  Shigeki Yamane ,  Yokinori Kita ,  Tomohiro Ooi

IPC: H02G3/16 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H02G3/16 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K5/0069 ,  H05K2201/10272

Abstract: Provided is a circuit assembly that includes: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; a coil that includes a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars exposed through the connection opening; and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board. The circuit board is provided with a substrate through-hole in the vicinity of the connection opening, and the plurality of busbars are provided with a busbar through-hole at the position that corresponds to the substrate through-hole.

Abstract translation: 提供一种电路组件，其包括：具有连接开口的电路板; 布置在电路板的一个表面侧上的多个母线; 线圈，其包括主要部分和多个引线端子，所述引线端子连接到通过所述连接开口暴露的所述多个母线; 以及通过粘合剂在远离电路板的多个汇流条的表面上铺设的散热器。 电路板在连接开口附近设置有基板通孔，并且多个汇流条在与基板通孔对应的位置处设置有母线通孔。