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公开(公告)号：US11778743B2
公开(公告)日：2023-10-03
申请号：US17687548
申请日：2022-03-04
Applicant: XILINX, INC.
Inventor： Ieuan James Mackereth Marshall , Robert Andrew Daniels
CPC classification number: H05K1/14 , H05K1/0274 , H05K2201/0397 , H05K2201/1034 , H05K2201/10325
Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.
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公开(公告)号：US11754632B2
公开(公告)日：2023-09-12
申请号：US17544903
申请日：2021-12-07
Applicant: NIPPON MEKTRON, LTD.
Inventor： Hajime Gyotoku , Kazuki Ikemiya , Shuzo Yamada
IPC: G01R31/3835 , H05K1/02
CPC classification number: G01R31/3835 , H05K1/0277 , H05K2201/1034 , H05K2201/10272
Abstract: Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.
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公开(公告)号：US20230284384A1
公开(公告)日：2023-09-07
申请号：US17687548
申请日：2022-03-04
Applicant: XILINX, INC.
Inventor： Ieuan James Mackereth MARSHALL , Robert Andrew DANIELS
CPC classification number: H05K1/14 , H05K1/0274 , H05K2201/1034 , H05K2201/0397 , H05K2201/10325
Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.
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公开(公告)号：US20230254973A1
公开(公告)日：2023-08-10
申请号：US18009063
申请日：2021-06-21
Applicant: NITTO DENKO CORPORATION
Inventor： Tadao Okawa , Takashi Oda , Masataka Yamaji , Kazushi Ichikawa
CPC classification number: H05K1/117 , H05K1/0271 , H05K1/144 , G02B6/12 , H05K2201/1034 , H05K2201/041 , H05K2201/10121
Abstract: An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.
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公开(公告)号：US20180299370A1
公开(公告)日：2018-10-18
申请号：US15489289
申请日：2017-04-17
Applicant: Rockwell Automation Technologies, Inc.
Inventor： Will J. Preischel , John P. Caspers , Patrick K. Duffy
CPC classification number: G01R19/0092 , H05K1/117 , H05K1/142 , H05K2201/10151 , H05K2201/1034
Abstract: A system to verify the identity of modules within a stack light is disclosed. A sensor is mounted to a circuit board inserted within a housing of the module, and a target is mounted to or integrally formed in the housing. The sensor detects and generates a signal corresponding to the detected target. Different targets or locations for the target are provided for each housing. The module, a base for the stack light, or a remote controller in communication with the stack light identifies the housing in which the circuit board is mounted based on the feedback signal generated by detecting the target. At power-up, a routine may initiate a verification routine by which each module in the stack light determines the type of housing in which the circuit board for that module is located.
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Patent Agency Ranking
公开(公告)号：US09899282B2
公开(公告)日：2018-02-20
申请号：US15148144
申请日：2016-05-06
Applicant: Infineon Technologies Americas Corp.
Inventor： Wayne Partington
IPC: H01L23/057 , H01L23/24 , H01L23/00 , H01L23/367 , H01L23/498 , H01L25/065 , H01L25/07 , H01L23/42 , H05K1/02 , H01L25/16 , H01L25/18 , H05K1/11
CPC classification number: H01L23/057 , H01L23/24 , H01L23/3675 , H01L23/42 , H01L23/49838 , H01L23/562 , H01L25/0655 , H01L25/072 , H01L25/162 , H01L25/18 , H05K1/0216 , H05K1/117 , H05K2201/10295 , H05K2201/1034 , H05K2201/10371 , H05K2201/10424
Abstract: A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the suspended substrate being supported by a plurality of mechanical leads on opposing sides of the semiconductor package, at least one of the plurality of mechanical leads having a coefficient of thermal expansion (CTE) that substantially matches a CTE of the suspended substrate, where at least one of the plurality of mechanical leads is electrically connected to the suspended substrate, and where the plurality of mechanical leads absorb mechanical shocks so as to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metallic case. The suspended substrate can be a printed circuit board. The metallic case includes mounting ears for transferring heat away from the semiconductor package.
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公开(公告)号：US20180020542A1
公开(公告)日：2018-01-18
申请号：US15545092
申请日：2016-01-13
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor： Arinobu Nakamura , Tou Chin
CPC classification number: H05K1/11 , H01R12/58 , H05K1/0263 , H05K1/113 , H05K1/183 , H05K2201/10166 , H05K2201/10295 , H05K2201/1034
Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face, a conductive member fixed to another face of the substrate, and an electronic component that has first terminals and, which are a portion of a plurality of terminals, electrically connected to the conductive member, and a terminal, which is a portion of the plurality of terminals, electrically connected to the conductive pattern provided on the substrate, wherein the conductive member has a shape in which at least a portion of the second terminal of the electronic component is not overlapped.
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公开(公告)号：US20170374731A1
公开(公告)日：2017-12-28
申请号：US15526861
申请日：2016-06-16
Applicant: Reginald SIMPSON , Ronald NEHRING , Mokhtar ROUABHI
Inventor： Reginald SIMPSON , Ronald NEHRING , Mokhtar ROUABHI
CPC classification number: H05K1/0203 , H01L23/66 , H01L2223/6644 , H03F1/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H05K1/0243 , H05K3/325 , H05K3/3405 , H05K2201/10166 , H05K2201/1034 , H05K2201/10386 , H05K2201/10446 , H05K2201/10628 , H05K2201/10689 , H05K2201/10818 , H05K2201/10969
Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.
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公开(公告)号：US09743520B2
公开(公告)日：2017-08-22
申请号：US14650940
申请日：2012-12-11
Applicant: Telefonaktiebolaget L M Ericsson (publ)
Inventor： Martin Dermark
CPC classification number: H05K1/18 , H02M1/00 , H05K1/141 , H05K2201/10166 , H05K2201/1034 , H05K2201/10757
Abstract: A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d4, d5) from the external component (10) when the power module is attached to the external component (10).
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公开(公告)号：US09735481B2
公开(公告)日：2017-08-15
申请号：US14098285
申请日：2013-12-05
Applicant: Tyco Electronics Corporation
Inventor： Brian Patrick Costello , Christopher David Ritter , Steven Lee Flickinger , Evan Charles Wickes
IPC: H05K5/00 , H01R9/24 , H01R13/6471 , H01R13/74 , H05K1/11 , H05K1/14 , H01R13/64 , H01R13/60 , G02B6/00 , G02B6/38 , H01R12/50 , G02B6/42 , H01R12/72
CPC classification number: H01R9/2408 , G02B6/3897 , G02B6/4257 , H01R12/724 , H01R13/6471 , H01R13/74 , H01R23/70 , H05K2201/044 , H05K2201/1034
Abstract: Daughter card assembly including a circuit board and leading and trailing connectors mounted to the circuit board. The leading and trailing connectors have mating ends that face in different directions along a board plane. The daughter card assembly also includes a support wall that is coupled to the circuit board and extends orthogonal to the circuit board. The support wall has a wall opening therethrough. The trailing connector is positioned on the circuit board such that the mating end substantially aligns with the wall opening. The daughter card assembly also includes a retention shroud that projects from an exterior surface of the support wall. The retention shroud defines a shroud passage that aligns with the wall opening. The shroud and wall openings form a receiving passage for receiving at least one of the trailing connector or a corresponding cable connector that mates with the trailing connector.
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