公开(公告)号：US5789811A

公开(公告)日：1998-08-04

申请号：US725735

申请日：1996-10-04

Applicant: Chok J. Chia ,  Patrick Variot

Inventor： Chok J. Chia ,  Patrick Variot

IPC: H01L23/12 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01L23/24 ,  H01L23/3128 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49816 ,  H05K3/341 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A surface mounted integrated circuit die package includes a group of peripheral leads extending laterally outwardly from the perimeter of the package and also includes an array of solder balls on the bottom of the package. The arrangement provides for a greater number of input/output connections to a die package by utilizing both peripheral leads and a ball grid array without requiring increases in package size or a reduction in the width of electrically conductive interconnections.

公开(公告)号：US5680191A

公开(公告)日：1997-10-21

申请号：US668520

申请日：1996-06-28

Applicant: Paul A. Voisin ,  Brian K. Bradford, III

Inventor： Paul A. Voisin ,  Brian K. Bradford, III

IPC: G02F1/13 ,  G02F1/133 ,  G02F1/13357 ,  G02F1/1362 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  G02F1/1345

CPC classification number: G02F1/133382 ,  G02F1/13452 ,  H05K1/189 ,  G02F1/1336 ,  G02F1/1362 ,  H05K1/118 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K3/361

Abstract: An active matrix liquid crystal display assembly including a flex circuit for interfacing substantially all of the row and column address lines of the display panel with a display output controller. The flex circuit is preferably made of two planar sheets laminated to one another, the first flex circuit sheet interfacing the row address lines with the display output controller and the second sheet interfacing the column address lines of the active matrix with the controller. The flex circuit includes a plurality of extension members, each extension member being electrically adhered to a driver TAB mounted to a peripheral side of the display panel.

Abstract translation: 一种有源矩阵液晶显示组件，包括用于将显示面板的基本上所有行列列地址线与显示器输出控制器对接的柔性电路。 柔性电路优选由彼此层叠的两个平面片制成，第一柔性电路板将行地址线与显示器输出控制器接口，而第二片与有源矩阵的列地址线与控制器接口。 柔性电路包括多个延伸构件，每个延伸构件电连接到安装到显示面板的周边侧的驱动器TAB。

公开(公告)号：US5676301A

公开(公告)日：1997-10-14

申请号：US733835

申请日：1996-10-18

Applicant: Bernie Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Frederick G. Weindelmayer

Inventor： Bernie Hernandez ,  Raymond R. Horton ,  Michael J. Palmer ,  Frederick G. Weindelmayer

IPC: H01L21/60 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34 ,  B23K3/04

CPC classification number: H01L24/86 ,  H05K3/363 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/0394 ,  H05K2201/09709 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/167 ,  H05K3/4084

Abstract: A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row.

Abstract translation: 一种用于将多个微电子引线连接到相关联的多个接触焊盘的雉形喷嘴及其使用方法。 所述雉形喷嘴包括具有从其突出的多个蓖耳体的主体，其中每个所述雉ations都具有接触表面。 形成与多个城堡中的至少一个城堡相邻的通道。 开口延伸穿过主体，用于在其中引入加热的气体。 多个城堡的接触表面与相应的多个引线对准。 典型地，雉形喷嘴包括形成第一排的第一多个雉ell和形成第二排的第二多个雉。。

公开(公告)号：US5587341A

公开(公告)日：1996-12-24

申请号：US323709

申请日：1994-10-18

Applicant: Watanabe Masayuki ,  Sugano Toshio ,  Tsukui Seiichiro ,  Ono Takashi ,  Wakashima Yoshiaki

Inventor： Watanabe Masayuki ,  Sugano Toshio ,  Tsukui Seiichiro ,  Ono Takashi ,  Wakashima Yoshiaki

IPC: G11C5/00 ,  H01L23/495 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L21/58 ,  H01L21/60 ,  H01L21/70

CPC classification number: G11C5/02 ,  G11C5/00 ,  G11C5/04 ,  G11C5/06 ,  G11C8/12 ,  H01L23/49572 ,  H01L24/16 ,  H01L24/50 ,  H01L25/0657 ,  H01L25/105 ,  H05K1/141 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K2201/10515 ,  H05K2201/10681 ,  H05K2203/1572 ,  H05K3/3447 ,  H05K3/368

Abstract: In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.

Abstract translation: 在本发明中，存储芯片通过TAB（磁带自动键合）以堆叠的方式粘合在一起，并且由芯片和引线形成像SOP（小外线封装）的多存储器芯片和引线复合体，由此存储器 高封装密度的模块可以通过扁平封装技术实现。

公开(公告)号：US5585162A

公开(公告)日：1996-12-17

申请号：US491120

申请日：1995-06-16

Applicant: Randolph D. Schueller

Inventor： Randolph D. Schueller

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/36 ,  B32B9/00

CPC classification number: H05K3/363 ,  H05K1/112 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0393 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K3/28 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917

Abstract: A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.

Abstract translation: 灵活的电路结构允许焊球通过提供与接地平面的其余部分分开的第一通孔而连接到双面柔性电路的接地平面上，而通过第一通孔与接地平面电连接 第二通过与柔性电路的与接地平面相对的一侧上的电路迹线与第一通路相距一定距离。

公开(公告)号：US5517208A

公开(公告)日：1996-05-14

申请号：US523167

申请日：1995-09-05

Applicant: Hideo Mori ,  Hisao Tajima ,  Hiroshi Takabayashi ,  Toshiaki Itazawa ,  Masanori Takahashi ,  Kenji Niibori

Inventor： Hideo Mori ,  Hisao Tajima ,  Hiroshi Takabayashi ,  Toshiaki Itazawa ,  Masanori Takahashi ,  Kenji Niibori

IPC: G02F1/13 ,  H05K1/00 ,  H05K1/02 ,  H05K3/36 ,  G09G3/36

CPC classification number: H05K3/0058 ,  G02F1/13452 ,  H05K1/028 ,  H05K1/02 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/10136 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10681 ,  H05K3/361

Abstract: A liquid crystal apparatus is constituted by a display device for data display, a drive circuit unit for driving the display device, a unit substrate for supplying electric signals to the drive circuit unit, and a tape-form film carrier comprising an insulating substrate and a conductor covered with the insulating substrate for connecting the display device, the drive circuit unit and the unit substrate. A part of the film carrier is provided with a blank portion where the insulating substrate is locally removed to absorb a stress applied to the film carrier. A unit substrate constituting the drive circuit unit is screwed to a supporting member so as to allow a movement thereof relative to the supporting member by use of a space regulating means surrounding the screw shank.

Abstract translation: 液晶装置由用于数据显示的显示装置，用于驱动显示装置的驱动电路单元，向驱动电路单元提供电信号的单位基板，以及包括绝缘基板和 导体被绝缘基板覆盖，用于连接显示装置，驱动电路单元和单元基板。 薄膜载体的一部分设置有空白部分，其中局部去除绝缘基板以吸收施加到薄膜载体上的应力。 构成驱动电路单元的单元基板通过使用围绕螺杆的空间调节装置而被旋拧到支撑构件以允许其相对于支撑构件的移动。

公开(公告)号：US5440452A

公开(公告)日：1995-08-08

申请号：US59547

申请日：1993-05-12

Applicant: Akira Kitahara

Inventor： Akira Kitahara

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/16 ,  H01L23/495 ,  H01L25/065 ,  H05K3/34 ,  H01R9/00

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/16 ,  H01L23/49572 ,  H01L25/0655 ,  H05K3/3426 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10424 ,  H05K2201/10681 ,  Y02P70/613

Abstract: A surface mount component comprising an IC chip, and a plurality of leads extending outward from the body of the chip. The leads are interconnected by an insulating frame at their outer ends. Each of the leads is provided in the vicinity of the portion thereof joined to the frame with an outer lead portion to be electrically connected to a wiring board. The frame is integrally connected to the chip body by bridges. When the component is mounted on the surface of the wiring board, the outer lead portion of each lead is bonded to the board by a solder layer without separating off the frame.

Abstract translation: 一种表面安装部件，包括IC芯片和从芯片的主体向外延伸的多个引线。 引线通过绝缘框架在其外端互连。 每个引线设置在与框架连接的部分附近，外引线部分电连接到布线板。 框架通过桥连接到芯片主体。 当组件安装在布线板的表面上时，每个引线的外部引线部分通过焊料层接合到板上，而不会分离框架。

公开(公告)号：US5400221A

公开(公告)日：1995-03-21

申请号：US139084

申请日：1993-10-21

Applicant: Joji Kawaguchi

Inventor： Joji Kawaguchi

IPC: H01L21/60 ,  H05K1/18 ,  H05K3/24 ,  H05K3/36 ,  H05K7/10

CPC classification number: H05K3/244 ,  H05K1/181 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K2201/10681 ,  H05K3/361 ,  Y02P70/611

Abstract: Electric elements such as a resistance chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from the re-flow method using cream solder, the chip-on board method using bonding wires, the outer lead bonding method, and the thermal pressing method using heat-seal. The printed circuit board is provided with lands having surface layers of a non-electrolysis Ni--Au plate, a soft Au plate and an electrolysis solder plate, each corresponding to a selected mounting method.

Abstract translation: 电子芯片，电容器芯片，半导体器件封装和连接器等电气元件通过使用从使用膏状焊料的再流动方法中选择的至少两种方法安装在印刷电路板上， 使用接合线，外引线接合方法和使用热封的热压法。 印刷电路板设置有具有非电解Ni-Au板，软Au板和电解焊料板的表面层的焊盘，每个对应于所选择的安装方法。

公开(公告)号：US5375003A

公开(公告)日：1994-12-20

申请号：US130870

申请日：1993-10-04

Applicant: Minoru Hirai

Inventor： Minoru Hirai

IPC: G02F1/1345 ,  G02F1/13 ,  H01L23/498 ,  H01R4/04 ,  H05K3/22 ,  H05K3/32 ,  H05K3/36 ,  G02F1/1343

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L23/49883 ,  H01R4/04 ,  H05K3/361 ,  H01L2924/0002 ,  H05K2201/0394 ,  H05K2201/10681 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K3/225 ,  H05K3/323

Abstract: The improved liquid-crystal display device has a slit formed in part of the TAB area where the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB and the liquid-crystal display panel is bonded to the TAB by means of a first anisotropic conductive adhesive having a comparatively weak adhesive force, such as a thermoplastic anisotropic conductive adhesive, whereas a second anisotropic conductive adhesive having a comparatively strong adhesive force, such as a uv curable adhesive, is coated in the slit. This liquid-crystal display device can be produced by a process that proceeds basically as follows: the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB by means of a thermoplastic adhesive as the first anisotropic conductive adhesive having a comparatively weak adhesive force; then, the assembly is subjected to an operating test; if the TAB is found to be defective in the operating test, it is replaced and, if no defect is found, a uv curable or a thermosetting adhesive as the second anisotropic conductive adhesive having a comparatively strong adhesive force is coated in the slit and then cured as the output terminals are compressed against the electrodes.

Abstract translation: 改进的液晶显示装置具有形成在TAB区域的一部分上的狭缝，其中液晶显示面板上的电极连接到TAB上的输出端子，并且液晶显示面板通过装置结合到TAB 具有比较弱的粘合力的第一各向异性导电粘合剂，例如热塑性各向异性导电粘合剂，而具有比较强的粘合力的第二各向异性导电粘合剂，例如紫外线可固化粘合剂，被涂覆在狭缝中。 该液晶显示装置可以通过以下方式进行制造：液晶显示面板上的电极通过热塑性粘合剂与TAB上的输出端子连接，作为第一各向异性导电粘合剂，具有 粘合力较弱; 然后，对组件进行操作试验; 如果在操作试验中发现TAB有缺陷，则更换，如果没有发现缺陷，则在狭缝中涂覆作为具有较强粘合力的第二各向异性导电粘合剂的紫外线固化型或热固性粘合剂，然后 当输出端子压靠电极时被固化。

公开(公告)号：US5362547A

公开(公告)日：1994-11-08

申请号：US745918

申请日：1991-08-16

Applicant: Hideo Yamazaki

Inventor： Hideo Yamazaki

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K3/36 ,  B32B3/28

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K3/361 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/24917

Abstract: A film carrier having a multiplicity of leads bonded on one surface, is provided with a thickness-reduced portion at the area where the tape is to be bent to remove stress to the leads.

Abstract translation: 具有结合在一个表面上的多个引线的薄膜载体在要弯曲的区域处设置有减薄部分以去除引线的应力。