公开(公告)号：US20080280463A1

公开(公告)日：2008-11-13

申请号：US11746463

申请日：2007-05-09

Applicant: Darryl J. McKenney ,  Michael W. Gust ,  David G. Persad

Inventor： Darryl J. McKenney ,  Michael W. Gust ,  David G. Persad

IPC: H01R12/00

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K1/112 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10704 ,  H05K2201/10901 ,  H05K2203/1178 ,  Y02P70/613

Abstract: Improved printed circuit boards (PCBs), printed circuit board assemblies (PCBAs) and methods thereof contemplate PCBs with recesses incorporated into planar surfaces thereof adapted to receive respective elongate leads of circuit components. The recesses are sized so as to prevent distal ends of the leads from emerging through the far sides of the boards and, indeed, allow for positioning of the component flush with, or offset above, the board to which they are mounted.

Abstract translation: 改进的印刷电路板（PCB），印刷电路板组件（PCBA）及其方法考虑了具有并入其适于接收电路部件的相应细长引线的平面中的凹部的PCB。 凹槽的尺寸设计成防止引线的远端通过板的远侧出现，并且实际上允许将元件与其安装的板齐平或偏置在其上。

公开(公告)号：US07442046B2

公开(公告)日：2008-10-28

申请号：US11433363

申请日：2006-05-15

Applicant: Olof Simon Simonsson ,  Omid Kazemifar ,  Mikael Pär-Oskar Häll ,  Maiko Anneli Karlsson ,  H{dot over (a)}kan Klas Petersson

Inventor： Olof Simon Simonsson ,  Omid Kazemifar ,  Mikael Pär-Oskar Häll ,  Maiko Anneli Karlsson ,  H{dot over (a)}kan Klas Petersson

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: A system includes a first electrical device including a conductive structure, and a second electrical device including an opening and a conductor provided in the opening. The conductor contacts the conductive structure of the first electrical device to electrically interconnect the first electrical device to the second electrical device.

Abstract translation: 一种系统包括包括导电结构的第一电气装置和包括设置在开口中的开口和导体的第二电气装置。 导体接触第一电气装置的导电结构以使第一电气装置与第二电气装置电互连。

公开(公告)号：US07438581B1

公开(公告)日：2008-10-21

申请号：US11433099

申请日：2006-05-12

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R4/50

CPC classification number: H01R12/523 ,  H01R12/57 ,  H01R12/714 ,  H05K1/0206 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/09609 ,  H05K2201/10333 ,  H05K2201/10704 ,  Y10S439/947

Abstract: A high speed socket includes an insulative housing and a printed circuit board body portion. The PCB body portion includes a PCB and surface mount contacts. Each surface mount contact has a first end portion for making contact with an integrated circuit held in the socket and a second end portion for surface mounting to a printed circuit board. The socket's printed circuit board includes AC grounded conductive columns (ACGCC) that extend from a first planar surface of the PCB to a second planar surface of the PCB. The printed circuit board also includes signal conductors. The signal conductors are shielded by the ACGCCs. In one aspect, the socket includes capacitors that are surface mounted to the socket's PCB. In another aspect, the surface mount contacts include self-adjusting solder tails that accommodate PCB warpage.

Abstract translation: 高速插座包括绝缘壳体和印刷电路板主体部分。 PCB主体部分包括PCB和表面安装触点。 每个表面安装触点具有用于与保持在插座中的集成电路接触的第一端部分和用于表面安装到印刷电路板的第二端部。 插座的印刷电路板包括从PCB的第一平面表面延伸到PCB的第二平面的AC接地导电柱（ACGCC）。 印刷电路板还包括信号导体。 信号导线被ACGCC屏蔽。 在一个方面，插座包括表面安装到插座的PCB的电容器。 在另一方面，表面安装触点包括适应PCB翘曲的自调整焊尾。

公开(公告)号：US20080192452A1

公开(公告)日：2008-08-14

申请号：US11705260

申请日：2007-02-12

Applicant: Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

Inventor： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

IPC: H05K7/00 ,  H05K1/16

CPC classification number: H05K1/0231 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10378 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

Abstract translation: 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个电容器。 电容器具有多个平行板，其间具有电介质。 至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

公开(公告)号：US20080064207A1

公开(公告)日：2008-03-13

申请号：US11942658

申请日：2007-11-19

Applicant: Edward Osburn

Inventor： Edward Osburn

IPC: H01L21/44

CPC classification number: H05K1/0262 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

Abstract translation: 公开了一种用于改进对半导体器件的功率的传递和滤波的方法和装置，其通过组织用于以条形配置携带功率的互连（引脚，球，焊盘或其他互连），其缩短了功率之间所需的导电路径 源极和半导体器件，并且降低该导电路径的电阻。

公开(公告)号：US20070284706A1

公开(公告)日：2007-12-13

申请号：US11689558

申请日：2007-03-22

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于含铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

公开(公告)号：US20070272436A1

公开(公告)日：2007-11-29

申请号：US11528349

申请日：2006-09-28

Applicant: Akiko Matsui

Inventor： Akiko Matsui

IPC: H05K1/16

CPC classification number: H05K1/183 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0228

Abstract: A depression is formed in a first surface of a printed wiring board. A through hole penetrates through the printed wiring board from the bottom surface of the depression to a second surface of the printed wiring board. The second surface is the opposite surface of the first surface. A terminal of an electronic component is received in the through hole. The terminal has the tip end protruding from the second surface of the printed wiring board. Solder is filled in the through hole. The tip end of the terminal is allowed to protrude from the second surface of the printed wiring board even when the terminal is shorter than the original thickness of the printed wiring board. It is not necessary to change the length of the terminal.

Abstract translation: 在印刷电路板的第一表面上形成凹陷。 通孔从印刷电路板的凹陷的底面穿过印刷线路板的第二表面。 第二表面是第一表面的相对表面。 电子部件的端子被容纳在通孔中。 端子具有从印刷线路板的第二表面突出的尖端。 焊料填充在通孔中。 即使端子短于印刷电路板的原始厚度，也允许端子的顶端从印刷电路板的第二表面突出。 不需要改变终端的长度。

公开(公告)号：US07280372B2

公开(公告)日：2007-10-09

申请号：US10990280

申请日：2004-11-15

Applicant: Kevin P. Grundy ,  William F. Wiedemann ,  Joseph C. Fjelstad

Inventor： Kevin P. Grundy ,  William F. Wiedemann ,  Joseph C. Fjelstad

IPC: H05K1/11

CPC classification number: H05K3/3405 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.

Abstract translation: 公开了楼梯级PCB结构，其提供包括IC封装和连接器在内的电子互连结构的各种元件之间的高性能，直接路径，无通孔互连。

公开(公告)号：US20070013047A1

公开(公告)日：2007-01-18

申请号：US11532643

申请日：2006-09-18

Applicant: Edgardo Hortaleza

Inventor： Edgardo Hortaleza

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10704 ,  Y02P70/613 ,  H01L2924/00

Abstract: A pin grid array package, comprising a substrate, a chip mounted abutting said substrate, and a plurality of pins electrically connected to said substrate, each pin comprising a substantially flat disc at an end of the pin opposite the substrate, said disc oriented perpendicular to said pin. The substrate contains metal traces to transfer electrical signals between the chip and each pin, wherein said disc is usable to provide each pin an electrical connection to a structure external to the package.

Abstract translation: 一种引脚格栅阵列封装，包括基板，安装在所述基板上的芯片，以及电连接到所述基板的多个引脚，每个引脚在与所述基板相对的所述引脚的端部处包括基本平坦的盘，所述盘垂直于 说针 衬底包含用于在芯片和每个引脚之间传送电信号的金属迹线，其中所述盘可用于向每个引脚提供与封装外部结构的电连接。

公开(公告)号：US07023685B2

公开(公告)日：2006-04-04

申请号：US10695197

申请日：2003-10-29

Applicant: Terumi Fujiyama ,  Kazuo Fukunaga ,  Morihiro Fukuda ,  Yoshiaki Kuwada ,  Hiromasa Mori ,  Yoshio Hashimoto

Inventor： Terumi Fujiyama ,  Kazuo Fukunaga ,  Morihiro Fukuda ,  Yoshiaki Kuwada ,  Hiromasa Mori ,  Yoshio Hashimoto

IPC: H01G4/228

CPC classification number: H01G4/40 ,  H01L23/66 ,  H01L24/81 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19011 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A sheet capacitor of the invention has a contact portion formed in a through-hole requiring electrical connection with an IC connection pin among the through-holes in which the IC connection pins are inserted, and a capacitor element connected to the contact portion. Another sheet capacitor of the invention includes an insulating board and a capacitor element mounted on the insulating board. The insulating board has a connection land with an IC at the upper side, and a connection land with a printed wiring board at the lower side. The capacitor element and connection lands at the upper and lower side of the insulating board are connected with each other electrically. In any one of these configurations, a capacitor element of large capacity and low ESL is connected closely to the IC, and the mounting area of the peripheral circuits of the IC can be increased.