公开(公告)号：US20180040452A1

公开(公告)日：2018-02-08

申请号：US15667040

申请日：2017-08-02

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Ryo TAJIMA ,  Kenichi SUEMATSU ,  Kenji WATANABE ,  Yasushi TOMA ,  Kenji TERAO ,  Takeshi MURAKAMI

IPC: H01J37/05 ,  H01J37/147 ,  H01J37/141

CPC classification number: H01J37/05 ,  H01J37/141 ,  H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/29

Abstract: An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. A cylindrical member that is formed with conductors stacked as an inner layer and an outer layer, and an insulator stacked as an intermediate layer is provided inside a lens tube into which the secondary electron optical system is incorporated. An electron orbital path is formed inside the cylindrical member, and the members constituting the secondary electron optical system are arranged outside the cylindrical member.

公开(公告)号：US20150285746A1

公开(公告)日：2015-10-08

申请号：US14680286

申请日：2015-04-07

Applicant: EBARA CORPORATION

Inventor： Kenichi SUEMATSU

IPC: G01N21/88 ,  G06T7/00 ,  H04N7/18

CPC classification number: G06T7/0004 ,  G01N23/2251 ,  G01N2223/6116 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/20292 ,  H01J2237/24592

Abstract: A control unit for generating a timing signal for an imaging unit in an inspection system in which an image of an inspection target object is captured by the imaging unit while the inspection target object is caused to travel in a predetermined direction includes a traveling distance determination section configured to detect a traveling distance of the inspection target object based on a count value acquired as an integer value from a laser interferometer provided in the inspection system for detecting a traveling distance of the inspection target object, and configured to determine whether the detected traveling distance reaches a threshold, and a timing signal generation section configured to generate a timing signal when it is determined that the detected traveling distance reaches the threshold. The traveling distance determination section executes the determination by using a plurality of values selectively as the threshold.

Abstract translation: 一种控制单元，用于在使检查对象物沿预定方向行进的同时，由成像单元捕获检查对象物的图像的检查系统中的摄像部的定时信号，包括行驶距离判定部 被配置为基于从所述检查系统中设置的用于检测所述检查对象物体的行驶距离的激光干涉仪获取的作为整数值的计数值来检测所述检查对象物体的行驶距离，并且被配置为确定所检测的行进距离 达到阈值，以及定时信号生成部，被配置为当确定检测到的行进距离达到阈值时产生定时信号。 行驶距离确定部通过选择性地使用多个值作为阈值来执行确定。

公开(公告)号：US20150371813A1

公开(公告)日：2015-12-24

申请号：US14747488

申请日：2015-06-23

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Kenichi SUEMATSU ,  Ryo TAJIMA ,  Kiwamu TSUKAMOTO ,  Kenji TERAO ,  Shoji YOSHIKAWA

IPC: H01J37/20 ,  H01J37/305 ,  H01J37/22 ,  H01J37/073 ,  H01J37/10

CPC classification number: H01J37/20 ,  H01J37/226 ,  H01J37/3005 ,  H01J37/3023 ,  H01J37/3056 ,  H01J37/3177 ,  H01J2237/24535

Abstract: A surface processing apparatus is an apparatus which performs surface processing on an inspection object 20 by irradiating the inspection object with an electron beam. A surface processing apparatus includes: an electron source 10 (including lens system that controls beam shape of electron beam) which generates an electron beam; a stage 30 on which an inspection object 20 to be irradiated with the electron beam is set; and an optical microscope 110 for checking a position to be irradiated with the electron beam. The current value of the electron beam which irradiates the inspection object 20 is set at 10 nA to 100 A.

Abstract translation: 表面处理装置是通过用电子束照射检查对象对检查对象物20进行表面处理的装置。 表面处理装置包括：产生电子束的电子源10（包括控制电子束的光束形状的透镜系统）; 设置有用电子束照射的检查对象物20的台架30; 以及用于检查用电子束照射的位置的光学显微镜110。 将检查对象物20照射的电子束的当前值设定为10nA〜100A。

公开(公告)号：US20180233374A1

公开(公告)日：2018-08-16

申请号：US15873108

申请日：2018-01-17

Applicant: EBARA CORPORATION

Inventor： Ryo TAJIMA ,  Masahiro HATAKEYAMA ,  Kenichi SUEMATSU ,  Kiwamu TSUKAMOTO ,  Kenji WATANABE ,  Shoji YOSHIKAWA ,  Shinichi OKADA ,  Kenji TERAO

IPC: H01L21/3065 ,  H01J37/302 ,  H01J37/305 ,  H01J37/147

CPC classification number: H01L21/3065 ,  H01J37/073 ,  H01J37/1474 ,  H01J37/20 ,  H01J37/244 ,  H01J37/3023 ,  H01J37/304 ,  H01J37/3053 ,  H01J37/317 ,  H01J2237/043 ,  H01J2237/061 ,  H01J2237/06333 ,  H01J2237/06375 ,  H01J2237/083 ,  H01J2237/1205 ,  H01J2237/1516 ,  H01J2237/166 ,  H01J2237/204 ,  H01J2237/24514 ,  H01J2237/30455 ,  H01J2237/30483 ,  H01L21/0273

Abstract: Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.

公开(公告)号：US20140291515A1

公开(公告)日：2014-10-02

申请号：US14220719

申请日：2014-03-20

Applicant: EBARA CORPORATION

Inventor： Ryo TAJIMA ,  Kenichi SUEMATSU ,  Shoji YOSHIKAWA

IPC: H01J37/26 ,  G06T7/00

CPC classification number: H01J37/222 ,  H01J37/244 ,  H01J37/265 ,  H01J37/285

Abstract: An inspection system includes a primary optical system configured to irradiate a charged particle or an electromagnetic wave as a beam, a movable unit configured to hold an inspection target and move the target through a position where the beam is irradiated, and a TDI sensor configured to integrate an amount of secondary charged particles in a predetermined direction to sequentially transfer the integrated amount. The secondary charged particles are obtained by irradiating the beam onto the target while moving the movable unit in the predetermined direction. The inspection system further includes a prevention module configured to prevent an arrival of the beam at the target side or an arrival of the secondary charged particles at the TDI sensor during a time period from one transfer to the following transfer after the elapse of a predetermined length of time from the one transfer and until the following transfer.

Abstract translation: 检查系统包括被配置为照射带电粒子或作为光束的电磁波的主光学系统，被配置为保持检查目标并将目标移动通过射束的位置的移动单元，以及被配置为 在预定方向上积分一定量的二次带电粒子以顺序地转移积分量。 通过在沿着预定方向移动可移动单元的同时将光束照射到目标物上而获得二次带电粒子。 所述检查系统还包括防止模块，所述防止模块被配置为在经过预定长度之后的一次转移到后续转移的时间段期间防止所述束到达所述目标侧或所述二次带电粒子到达所述TDI传感器 的时间从一次转移到下一次转移。