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公开(公告)号:US20250006864A1
公开(公告)日:2025-01-02
申请号:US18756777
申请日:2024-06-27
Applicant: EPISTAR CORPORATION
Inventor: Yi-Chieh LIN , Shih-Chang LEE , Wei-Chu LIAO , Mei-Chun LIU , Hui-Ching FENG , Zhen-Kai KAO , Yih-Hua RENN , Min-Hsun HSIEH
Abstract: A semiconductor device is provided, which includes an epitaxial structure, a first contact electrode and a second contact electrode. The epitaxial structure includes a first semiconductor structure, a second semiconductor structure and an active region. The first semiconductor structure includes a first semiconductor contact layer. The second semiconductor structure includes a second semiconductor contact layer. The active region is located between the first semiconductor structure and the second semiconductor structure. The first contact electrode is located on the second semiconductor contact layer and directly contacts the first semiconductor contact layer. The second contact electrode is located on the second semiconductor contact layer and directly contacts the second semiconductor contact layer. The first semiconductor contact layer has a conductivity type of n-type and includes a first group III-V semiconductor material. The second semiconductor contact layer has a conductivity type of p-type and includes a second group III-V semiconductor material.
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公开(公告)号:US20200168757A1
公开(公告)日:2020-05-28
申请号:US16697340
申请日:2019-11-27
Applicant: EPISTAR CORPORATION
Inventor: Yi-Chieh LIN , Shiuan-Leh LIN , Yung-Fu CHANG , Shih-Chang LEE , Chia-Liang HSU , Yi HSIAO , Wen-Luh LIAO , Hong-Chi SHIH , Mei-Chun LIU
IPC: H01L31/167 , H01L31/0304 , H01L31/0232 , H01L31/02 , H01L25/16 , G01J3/10 , A61B5/024 , A61B5/021 , A61B5/1455 , A61B5/145
Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ≥13.
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公开(公告)号:US20200152836A1
公开(公告)日:2020-05-14
申请号:US16680214
申请日:2019-11-11
Applicant: EPISTAR CORPORATION
Inventor: Wen-Luh LIAO , Cheng-Long YEH , Ko-Yin LAI , Yao-Ru CHANG , Yung-Fu CHANG , Yi HSIAO , Shih-Chang LEE
Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.
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公开(公告)号:US20200152831A1
公开(公告)日:2020-05-14
申请号:US16680207
申请日:2019-11-11
Applicant: EPISTAR CORPORATION
Inventor: Yung-Fu CHANG , Hui-Fang KAO , Yi-Tang LAI , Shih-Chang LEE , Wen-Luh LIAO , Mei Chun LIU , Yao-Ru CHANG , Yi HISAO
IPC: H01L33/14 , H01L25/075 , H01L33/40
Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
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公开(公告)号:US20180351036A1
公开(公告)日:2018-12-06
申请号:US16041398
申请日:2018-07-20
Applicant: EPISTAR CORPORATION
Inventor: Cheng-Feng YU , Ching-Yuan TSAI , Yao-Ru CHANG , Hsin-Chan CHUNG , Shih-Chang LEE , Wen-Luh LIAO , Cheng-Hsing CHIANG , Kuo-Feng HUANG , Hsu-Hsuan TENG , Hung-Ta CHENG , Yung-Fu CHANG
CPC classification number: H01L33/06 , H01L33/002 , H01L33/0079 , H01L33/30 , H01L33/42 , H01L33/46 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2933/0016 , H01L2933/0066
Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
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公开(公告)号:US20170352782A1
公开(公告)日:2017-12-07
申请号:US15686331
申请日:2017-08-25
Applicant: Epistar Corporation
Inventor: Wen-Luh LIAO , Chih-Chiang LU , Shih-Chang LEE , Hung-Ta CHENG , Hsin-Chan CHUNG , Yi-Chieh LIN
CPC classification number: H01L33/20 , H01L33/0062 , H01L33/0079 , H01L2933/0091
Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.
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公开(公告)号:US20140312370A1
公开(公告)日:2014-10-23
申请号:US14257716
申请日:2014-04-21
Applicant: EPISTAR CORPORATION
Inventor: Shiuan-Leh LIN , Shih-Chang LEE
IPC: H01L33/12 , H01L31/0352
CPC classification number: H01L33/12 , H01L21/02461 , H01L21/02505 , H01L21/0251 , H01L21/02543 , H01L31/03046 , H01L31/06875 , H01L31/1844 , Y02E10/544
Abstract: An optoelectronic device comprising a first semiconductor layer having a first lattice constant; a second semiconductor layer having a second lattice constant, wherein the second lattice constant is smaller than the first lattice constant; and a first buffer layer formed between the first semiconductor layer and the second semiconductor layer, wherein a lattice constant of one side of the first buffer layer near the second semiconductor layer is smaller than the second lattice constant.
Abstract translation: 一种光电器件,包括具有第一晶格常数的第一半导体层; 具有第二晶格常数的第二半导体层,其中所述第二晶格常数小于所述第一晶格常数; 以及形成在第一半导体层和第二半导体层之间的第一缓冲层,其中在第二半导体层附近的第一缓冲层的一侧的晶格常数小于第二晶格常数。
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公开(公告)号:US20250169238A1
公开(公告)日:2025-05-22
申请号:US19031651
申请日:2025-01-18
Applicant: EPISTAR CORPORATION
Inventor: Jian-Zhi CHEN , Yen-Chun TSENG , Hui-Fang KAO , Yao-Ning CHAN , Yi-Tang LAI , Yun-Chung CHOU , Shih-Chang LEE , Chen OU
IPC: H10H20/83 , H01L25/075 , H10H20/819 , H10H20/824 , H10H20/825 , H10H20/831 , H10H20/841
Abstract: The present disclosure provides a semiconductor light-emitting device. The semiconductor light-emitting device includes a first semiconductor contact layer, a semiconductor light-emitting stack, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure, a first electrode pad and a second electrode pad. The semiconductor light-emitting stack is located on the first semiconductor contact layer and comprising an active layer. The first-conductivity-type contact structure is located on the first semiconductor contact layer. The second semiconductor contact layer is located on the semiconductor light-emitting stack. The second-conductivity-type contact structure is located on the semiconductor light-emitting stack and electrically connected to the second semiconductor contact layer. The first electrode pad is located on the first-conductivity-type contact structure. The second electrode pad is located on the second-conductivity-type contact structure. The second-conductivity-type contact structure includes a bonding portion, an extension portion, and a connection portion.
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公开(公告)号:US20250089400A1
公开(公告)日:2025-03-13
申请号:US18243985
申请日:2023-09-08
Applicant: EPISTAR CORPORATION
Inventor: Hao-Chun LIANG , Yi-Shan TSAI , Wei-Shan YEOH , Yao-Ning CHAN , Hsuan-Le LIN , Jiong-Chaso SU , Shih-Chang LEE , Chang-Da TSAI
Abstract: A semiconductor device, including a base and a semiconductor stack. The semiconductor stack includes a first semiconductor structure located on the base, a second semiconductor structure located on the first semiconductor structure, and an active structure located between the first semiconductor structure and the second semiconductor structure. The active structure includes two confinement layers and a well layer located between the two confinement layers. One of the confinement layers includes Alx1Ga1-x1As, and x1 is equal to or larger than 0.25 and equal to or smaller than 0.4. The well layer includes Inx2Ga1-x2As, and x2 is equal to or larger than 0.25 and equal to or smaller than 0.3. The one of the confinement layers and the well layer respectively have a first thickness in a range of 200 nm to 400 nm and a second thickness in a range of 3 nm to 6 nm.
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公开(公告)号:US20230163239A1
公开(公告)日:2023-05-25
申请号:US18099583
申请日:2023-01-20
Applicant: EPISTAR CORPORATION
Inventor: Yen-Chun TSENG , Kuo-Feng HUANG , Shih-Chang LEE , Ming-Ta CHIN , Shih-Nan YEN , Cheng-Hsing CHIANG , Chia-Hung LIN , Cheng-Long YEH , Yi-Ching LEE , Jui-Che SUNG , Shih-Hao CHENG
CPC classification number: H01L33/14 , H01L33/08 , H01L33/20 , H01L33/025
Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first dopant. The second semiconductor structure is located on the first semiconductor structure and includes a second dopant different from the first dopant. The active region includes a plurality of semiconductor pairs and located between the first semiconductor structure and the second semiconductor structure. Each semiconductor pair includes a barrier layer and a well layer and includes the first dopant. The active region does not include a nitrogen element. A doping concentration of the first dopant in the first semiconductor structure is higher than a doping concentration of the first dopant in the active region.
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