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    Conductive adhesive bonding means
    1.
    发明公开
    Conductive adhesive bonding means 失效
    LeitfähigeFixiereinlagen

    公开(公告)号：EP0803558A2

    公开(公告)日：1997-10-29

    申请号：EP97302560.4

    申请日：1997-04-15

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Lyons, Alan Michael ,  Dahringer, Donald William

    IPC: C09J5/02

    CPC classification number: H05K3/0061 ,  C09J5/02 ,  H05K3/321 ,  H05K3/323 ,  H05K3/382 ,  H05K3/383 ,  H05K2201/023 ,  H05K2203/025 ,  H05K2203/0315

    Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength ofthe bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.

    Abstract translation: 一种用导电粘合剂将导电表面电气和机械结合的方法，其中至少一个导电表面是易于形成不稳定氧化物的类型。 导电粘合剂具有预定量的导电颗粒。 导电粒子的刚性至少与组成导电表面的材料和形成在其上的任何氧化物一样硬。 该接合方法包括制备导电表面以在其上形成微观粗糙化的氧化物表面的步骤。 该方法还包括同时施加预定量的热和压力以固化导电表面导电粘合剂导电表面接头的步骤，使得导电粘合剂中的导电颗粒穿透氧化物以与其下的导电表面直接接触 。 该方法控制键合的机械强度和接合点的电气特性。 电气特性包括对高温和/或湿度条件的接头电阻率和接头灵敏度。

    Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure
    2.
    发明公开
    Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure 失效
    使用金属化的柔性外壳的电子电路和组件的保护装置

    公开(公告)号：EP0802710A2

    公开(公告)日：1997-10-22

    申请号：EP97302412.8

    申请日：1997-04-08

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Dahringer, Donald William ,  Hubbauer, Philip ,  Lambert, William Roger ,  Lyons, Alan Michael ,  Shepherd, Lloyd ,  Weld, John David

    IPC: H05K9/00 ,  H05K3/28

    CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K3/281 ,  H05K9/0039 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    Abstract translation: 用于保护电子产品的有源电子部件从环境和电磁干扰（EMI）的组件。 描述了一种方法由电子产品周围提供一金属化柔性外壳，其中所述组件被形成，检查印刷电路板，并随后密封所述金属化柔性外壳，求也可分离连接器可以在不比奥拉·廷容易地访问该密封件的完整性 ， 金属化柔性外壳包括聚合物材料的多个层提供没有扩散阻挡性和金属层并同时提供扩散阻挡性和EMI屏蔽功能。 所述多个层片被图案化以优化扩散阻挡性和EMI屏蔽功能。 另外，多层片材能够实现高效，大批量的生产。 因此，电子产品可设置有在环境防护能力和EMI屏蔽能力适合于可靠和具有成本效益的大批量生产在组装具有。

    A jet impingement cooling system
    4.
    发明公开
    A jet impingement cooling system 审中-公开
    Düsenprallkühlungssystem

    公开(公告)号：EP2151863A1

    公开(公告)日：2010-02-10

    申请号：EP08161526.2

    申请日：2008-07-31

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Salamon, Todd Richard ,  Lyons, Alan Michael

    IPC: H01L23/473

    CPC classification number: H01L23/4735 ,  H01L2224/73253 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A jet impingement cooling system (1) for an electronic device (3) comprises: a housing (4); a substrate to be cooled (5) located in the housing which substrate is arranged to be in thermal contact with the device to be cooled and which has a surface pattern (14) thereon; a fluid inlet (8) to the housing; at least one fluid outlet (9) from the housing; and at least one nozzle (17) in fluid connection with the fluid inlet for directing a jet (12) of fluid at a portion of the substrate, wherein that the surface pattern (14) defines at least one channel (19) and the jet is aligned with the pattern (14) such that at least a portion of the jet is incident on at least a portion of the channel (19) such that the flow of the fluid from the jet is subsequently confined by the channel (19). The arrangement assists in maximizing the cooling effect of the fluid on a given area of substrate.

    Abstract translation: 一种用于电子设备（3）的射流冲击冷却系统（1）包括：壳体（4）; 待冷却的基板（5），位于所述壳体中，所述基板被布置成与要冷却的装置热接触并且其上具有表面图案（14）; 流体入口（8）到壳体; 至少一个流体出口（9）; 以及与所述流体入口流体连接的至少一个喷嘴（17），用于在所述基底的一部分处引导流体的射流（12），其中所述表面图案（14）限定至少一个通道（19），并且所述射流 与图案（14）对准，使得至少一部分射流入射在通道（19）的至少一部分上，使得来自射流的流体流随后被通道（19）限制。 该装置有助于最大限度地提高流体在给定区域的基底上的冷却效果。

    Method and apparatus for controlling the flow resistance of a fluid on nanostructured or microstructured surfaces
    9.
    发明公开
    Method and apparatus for controlling the flow resistance of a fluid on nanostructured or microstructured surfaces 有权
    用于控制与纳米或微米结构表面的流体的流动阻力的方法和装置

    公开(公告)号：EP1520622A1

    公开(公告)日：2005-04-06

    申请号：EP04255627.4

    申请日：2004-09-16

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Hodes, Marc Scott ,  Kolodner, Paul Robert ,  Kroupenkine, Timofei Nikita ,  Lyons, Alan Michael ,  Mandich, Mary Louise ,  Taylor, Joseph Ashley

    IPC: B01L3/00

    CPC classification number: B01L3/5088 ,  B01L2300/16 ,  B01L2400/0442 ,  B82Y20/00 ,  Y10T137/0396 ,  Y10T436/2575

    Abstract: A method and apparatus is disclosed wherein the flow resistance of a droplet disposed on a nanostructured or microstructured surface is controlled. A closed-cell feature is used in a way such that, when the pressure of at least a first fluid within one or more of the cells of said surface is decreased to or below a desired level, a droplet disposed on that surface is caused to at least partially penetrate the surface. In another illustrative embodiment, the pressure within one or more of the cells is increased to or above a desired level in a way such that the droplet of liquid is returned at least partially to its original, unpenetrated position. In yet another embodiment, a closed-cell structure feature pattern is used to prevent penetration of the nanostructured or microstructured surface, even when the pressure of the fluid disposed on the surface is relatively high.

    Abstract translation: 的方法和设备是游离缺失盘worin设置在纳米结构化或微结构化表面上的液滴的流动阻力被控制。 闭孔特征以这样的方式寻求的是，当至少一个或多个所述表面的细胞内的第一流体的压力被降低到或低于所需的水平使用时，处理完毕做表面上的液滴被导致 至少部分地渗入表面上。 在另一说明性实施例中，一个或多个小区内的压力增加至或高于期望水平在寻求做返回至少部分到它的原始，unpenetrated位置的液体微滴的方法。 在又一实施方式中，一个封闭的单元结构特征图案用于防止纳米结构或微结构化表面的渗透，甚至当设置在表面上的流体的压力相对较高。

    Multilayer printed circuit board with reduced signal losses at via holes
    10.
    发明公开
    Multilayer printed circuit board with reduced signal losses at via holes 有权
    Mehrlagige Leiterplatte mit an denKontaktlöchernverringerten Verlusten

    公开(公告)号：EP1463387A1

    公开(公告)日：2004-09-29

    申请号：EP04250909.1

    申请日：2004-02-20

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Baras, Torben ,  Lyons, Alan Michael ,  Metz, Carsten

    IPC: H05K1/02

    CPC classification number: H05K1/0248 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09627 ,  H05K2201/0979

    Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

    Abstract translation: 公开了一种设备，其基本上减少或消除了在通过将电路板中的第一传输线（704）电耦合到电路板中的第二传输线（705）的连接印刷电路板的层的通孔中发生的共振 通过具有基本上相同电长度的两个电路径（706,707）。 通过将第一传输线连接到第一通孔而产生两个电路径，第一通孔又连接到第二通孔，第二通孔具有在两个通孔之间具有多个连接电路径的第二传输线。 在一个说明性实施例中，使用电迹线将第一通孔的顶部连接到第二通孔的顶部和第一通孔的底部到第二通孔的底部。

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