公开(公告)号：EP3229566A1

公开(公告)日：2017-10-11

申请号：EP17165000.5

申请日：2017-04-05

Applicant: BIOTRONIK SE & Co. KG

Inventor： Henschel, Martin

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H01R12/592 ,  H01R4/029 ,  H01R43/0221 ,  H01R43/0256 ,  H01R43/16 ,  H01R2201/12 ,  H05K1/028 ,  H05K1/117 ,  H05K1/118 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/0949 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10962 ,  H05K2203/107

Abstract: Die Erfindung betrifft ein Verbindungselement (1) für eine elektronische Bauelementanordnung, aufweisend einen Träger (2), ein erstes Kontaktpad (3) und ein zweites Kontaktpad (4), eine das erste Kontaktpad (3) und das zweite Kontaktpad (4) elektrisch leitend miteinander verbindende elektrisch leitfähige Struktur (5) und einen ersten Kontaktleiter (6), der mittels einer Lotschicht (11) mit dem ersten Kontaktpad (3) elektrisch leitend verbunden ist und der in einem zweiten Abschnitt der ersten Oberfläche (61) und/oder auf der zweiten Oberfläche (62) zum Ausbilden einer Schweißverbindung ausgestaltet ist. Die Erfindung betrifft ferner eine elektronische Bauelementanordnung mit einem solchen Verbindungselement und mit zumindest einem an den Kontaktleiter geschweißten Bauelement und die Verfahren zum Herstellen des Verbindungselements und der Bauelementanordnung.

Abstract translation: 本发明涉及一种用于电子元件组件，其包括支撑件（2），第一接触垫（3）和第二接触焊盘（4），第一接触垫的连接元件（1）（3）和所述第二接触焊盘（4）导电性 互连导电结构（5）和第一接触导体（6），通过钎焊层的装置（11）导电地连接至所述第一接触垫（3）和在所述第一面的第二部分（61）和/或 第二表面（62）构造成形成焊接接头。 本发明还涉及具有这种连接元件并具有焊接到接触导体的至少一个部件的电子部件装置以及用于制造连接元件和部件装置的方法。

公开(公告)号：EP2600469A3

公开(公告)日：2014-10-22

申请号：EP12192499.7

申请日：2012-11-14

Applicant: DAI-ICHI SEIKO CO., LTD.

Inventor： Takeshi, Hirakawa

IPC: H01R12/73 ,  H01R12/79 ,  H01R12/78 ,  H01R13/627 ,  H05K3/36 ,  H01R12/50 ,  H01R13/639 ,  H05K1/18

CPC classification number: H01R12/73 ,  H01R12/78 ,  H01R12/79 ,  H01R13/627 ,  H01R13/639 ,  H02K7/08 ,  H02K7/09 ,  H02K15/14 ,  H05K1/182 ,  H05K3/361 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A circuit-terminal connecting device comprising a first connector (12) having a first housing (15) fixed to a main circuit board (11) and first contacts (16) supported by the first hous i ng (15) to be connected with first circuit-terminals provided on the main circuit board (11) and a second connector (14; 40) having a second housing (17; 41) attached to a flat circuit member (13) and second contacts (18; 42) supported by the second housing (17; 41) to be connected with second circuit-terminals (20) provided on the flat circuit member (13). The first housing (15) of the first connector (12) fits into a hole (22; 44) formed in the second housing (17; 41) of the second connector (14; 40) so as to create an electrical piling connection between the main circuit board (11) and the flat circuit member (13) wherein the flat circuit member (13) is laid on top of the main circuit board (11) and the first circuit-terminals are electrically connected with the second circuit-terminals (20) through the first and second connectors (12, 14; 40).

Abstract translation: 一种电路端子连接装置，包括：第一连接器（12），其具有固定到主电路板（11）的第一壳体（15）和由第一壳体（15）支撑的第一触点（16），以与第一壳体 设置在主电路板（11）上的电路端子和第二连接器（14; 40），第二连接器（14; 40）具有附接到平坦电路部件（13）的第二壳体（17; 41） 第二壳体（17; 41）与设置在平坦电路构件（13）上的第二电路端子（20）连接。 第一连接器（12）的第一壳体（15）装配在形成在第二连接器（14; 40）的第二壳体（17; 41）中的孔（22; 44）中，以便在第二连接器 主电路板（11）和扁平电路构件（13），其中平面电路构件（13）被放置在主电路板（11）的顶部上，并且第一电路端子与第二电路端子 （20）通过第一和第二连接器（12,14; 40）。

公开(公告)号：EP2091307B1

公开(公告)日：2011-10-19

申请号：EP06823428.5

申请日：2006-11-15

Applicant: Panasonic Corporation

Inventor： SUZUKI, Hiroyuki

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K3/361 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/058 ,  H05K2201/09381 ,  H05K2201/0949 ,  H05K2201/09709

Abstract: A circuit board connection structure and a circuit board in which only the surplus portion of the anisotropic conductive adhesive between connection sections opposed to each other is smoothly and adequately discharged. In the circuit board connection structure (10), first and second connection sections (13A, 14A) are opposed to each other with an anisotropic conductive adhesive (16) interposed between the sections and are interconnected. The line (26) connecting a first end (19A) of a first wiring pattern of a first base and a first end (39A) of a second wiring pattern of the first base crosses at predetermined angle with respect to the arrangement direction parallel to the width directions of the first and second wiring patterns (19, 39) of the first base.

公开(公告)号：EP2048920A2

公开(公告)日：2009-04-15

申请号：EP08164636.6

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Oman, Tood P. ,  Gertiser, Kevin M. ,  Shearer, Ronald M.

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0209 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: A power electronic module (10) includes heat generating power electronic devices (40-52) mounted on a circuit board (12) within a connector outline (34) circumscribing circuit board through-holes (26) for receiving pin terminals (22) of a connector assembly (18). The power electronic devices (40-52) are thermally and electrically coupled to the circuit board through-holes (26) and connector pin terminals (22) to dissipate heat generated by the power electronic devices (40-52).

Abstract translation: 电力电子模块（10）包括安装在外部电路板通孔（26）内的连接器轮廓（34）内的电路板（12）上的发热功率电子器件（40-52），用于接收 连接器组件（18）。 电力电子设备（40-52）热和电耦合到电路板通孔（26）和连接器引脚端子（22），以散发由电力电子设备（40-52）产生的热量。

公开(公告)号：EP1720389A3

公开(公告)日：2008-04-02

申请号：EP06008452.2

申请日：2006-04-24

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Sugahara, Hiroto

IPC: H05K3/40 ,  H05K3/12

CPC classification number: H05K3/125 ,  H01L24/81 ,  H01L2224/10175 ,  H01L2224/81192 ,  H01L2924/12042 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/321 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2203/013 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.

公开(公告)号：EP0860101B1

公开(公告)日：2004-10-20

申请号：EP96938583.0

申请日：1996-11-06

Applicant: Strandberg, Reinhold

Inventor： Strandberg, Reinhold

IPC: H05K3/22 ,  G01R1/073 ,  G01R31/28

CPC classification number: H05K3/4007 ,  G01R1/07378 ,  H05K3/06 ,  H05K3/22 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/098 ,  H05K2203/0346

Abstract: A method for producing contact pads on pattern boards (8) comprises a plating treatment in order to apply electrically conductive material on the board in correspondence to the desired contact pads (31). The electrically conducting material on the contact pads is subjected to a treatment with an agent capable of etching the material in order to provide chamfering or rounding of peripherical edges (34) of the contact pads.

公开(公告)号：EP1382091A2

公开(公告)日：2004-01-21

申请号：EP02732379.9

申请日：2002-04-08

Applicant: Siemens Production and Logistics Systems AG

Inventor： STRIEBEL, Dirk

IPC: H01R13/03 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L23/13 ,  H01L23/055 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15151 ,  H01R13/035 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/0949 ,  H01L2924/00014

Abstract: A connection housing includes a base body with lateral walls, which extend around the base body on top and which enclose the component to be inserted as well as inner contacts that are arranged between the component and at least one lateral wall. Polymer protuberances for forming outer contacts are shaped onto the underside. The connection between the inner contacts of the top and the outer contacts of the underside is effected by micro-boreholes that are located underneath the component in the middle area of the base body. This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.

公开(公告)号：EP0878987A1

公开(公告)日：1998-11-18

申请号：EP98302731.9

申请日：1998-04-08

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Inoue, Yoshitaka

IPC: H05K3/40 ,  H05K3/00

CPC classification number: H01L23/49805 ,  H01L2924/0002 ,  H05K1/116 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/0949 ,  H01L2924/00

Abstract: A printed circuit board comprises, an insulating board (1) having side through holes (3) formed contiguous to divided end faces (2) of the board, land portions (5) formed of copper foil or the like on the surface of the insulating board (1), and conductors (4) of conductive materials formed respectively on the inner peripheral surfaces of the side through holes (3), wherein the land portions (5) are respectively conducted electrically with the conductors on the insulating board (1), and the land portions (5) have side ends (5a) positioned near and away from the divided end faces (2).

Abstract translation: 印刷电路板包括：绝缘板（1），其具有与板的分割端面（2）邻接形成的侧通孔（3），在绝缘层的表面上由铜箔等形成的焊盘部分（5） 分别形成在所述侧通孔（3）的内周面上的导电材料导体（4），其中，所述接地部（5）分别与所述绝缘基板（1）上的导体电连通， ，陆部（5）具有靠近和远离分割端面（2）的侧端（5a）。

公开(公告)号：EP2820926A1

公开(公告)日：2015-01-07

申请号：EP13714320.2

申请日：2013-02-28

Applicant: Novalia Ltd

Inventor： STONE, Kate

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/141 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4038 ,  H05K2201/0949

Abstract: A circuit board assembly is described. The assembly comprises a module (2) which comprises a first substrate (7) having first and second faces (8, 9), a first conductive region (11) disposed on the first face of the first substrate and a hole (14) in or adjacent to the first conductive region and passing through the first substrate between the first and second faces. The assembly also comprises a circuit board (3) which comprises a second substrate (4) having first and second faces (5), a second conductive region (6) disposed on the first face of the second substrate. Conductive ink (15) is disposed in the hole and between the first and second substrates. The module is mounted to the circuit board and is arranged such that the hole lies over or adjacent to the second conductive region and the conductive ink provides an electrical connection between first and second conductive regions.

Abstract translation: 描述电路板组件。 该组件包括模块（2），该模块包括具有第一和第二面（8,9）的第一衬底（7），布置在第一衬底的第一面上的第一导电区域（11）和位于第一衬底 或者与第一导电区域相邻并穿过第一和第二面之间的第一衬底。 该组件还包括电路板（3），该电路板包括具有第一和第二面（5）的第二基板（4），设置在第二基板的第一面上的第二导电区域（6）。 导电油墨（15）设置在孔中并在第一和第二基板之间。 该模块安装在电路板上并且布置成使得孔位于第二导电区域之上或者与第二导电区域相邻，并且导电墨水提供第一导电区域和第二导电区域之间的电连接。

公开(公告)号：EP2726925A2

公开(公告)日：2014-05-07

申请号：EP12803948.4

申请日：2012-06-27

Applicant: Finisar Corporation

Inventor： ZHAO, Yanyang ,  HUEBNER, Bernd ,  DU, Tengda ,  LEE, Yuheng

IPC: G02B6/38 ,  G02B6/46

CPC classification number: G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

Abstract translation: 多通道RF馈通。 在一些示例中，多通道RF馈通包括内部部分和外部部分。 内部部分包括顶面，在该顶面上形成第一和第二组迹线。 每组迹线被配置为电通信信道以传送电数据信号。 外部部分包括其上形成第一组迹线的底表面和其上形成第二组迹线的顶表面。 一组通孔连接内部部分的顶部表面和外部部分的底部表面之间的第一组迹线。