Aluminum electrolytic capacitor package with stabilizing third lead
    92.
    发明授权
    Aluminum electrolytic capacitor package with stabilizing third lead 失效
    铝电解电容器封装具有稳定的第三引线

    公开(公告)号:US4763227A

    公开(公告)日:1988-08-09

    申请号:US80937

    申请日:1987-08-03

    Abstract: A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.

    Abstract translation: 具有沿一个方向延伸的轴向阳极和阴极引线的低成本铝电解电容器封装能够在水平位置连接到印刷电路板而不滚动,这种不希望的滚动可能导致一个引线的退出 可能不会接收到焊料。 封装的另一端连接一个虚拟引线,以便在焊接安装后稳定电容器。 三条线之一有一个牛弓弯,倾向于阻止不必要的滚动。

    COMPOSITE ELECTRONIC COMPONENT
    96.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号:US20140313682A1

    公开(公告)日:2014-10-23

    申请号:US14257006

    申请日:2014-04-21

    Inventor: HIROYUKI MITOME

    Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

    Abstract translation: 复合电子部件包括具有宽表面端子的金属部件,具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度,该宽度被配置为:减小在栅极阻焊堤一侧的截面区域中发生的气泡,与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

    Electronic component, mounted structure, and inverter device therewith
    99.
    发明授权
    Electronic component, mounted structure, and inverter device therewith 有权
    电子部件,安装结构和逆变器装置

    公开(公告)号:US07839621B2

    公开(公告)日:2010-11-23

    申请号:US12039284

    申请日:2008-02-28

    Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

    Abstract translation: 表面安装型电子部件具有电介质元件主体,电极,引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上,另一个电极形成在另一个主面上,电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

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