Abstract:
A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.
Abstract:
A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.
Abstract:
Pin terminals projecting from a side of a switch housing are led out upon being arranged in one direction and in a plane parallel to the side of the switch housing, and distal end portions of the pin terminals are secured to a printed circuit board. This reduces the space needed for mounting the switch, facilitates the mounting of the switch on the printed circuit board and mounts the switch more reliably.
Abstract:
A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.
Abstract:
An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.
Abstract:
A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.
Abstract:
A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.
Abstract:
According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.
Abstract:
A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.
Abstract:
A back light module includes a printed circuit board and a plurality of surface mounting elements mounted on the printed circuit board. Each surface mounting element is an LED lighting element. The printed circuit board has a plurality of pads. Each of the pads includes a first bar and two second bars extending respectively from two ends of the first bar. The surface mounting element includes a plurality of pins. The pins are placed on two sides of the surface mounting element. The pins are soldered on the pads.