公开(公告)号：US4872937A

公开(公告)日：1989-10-10

申请号：US220857

申请日：1988-07-14

Applicant: Thomas E. Gouldy

Inventor： Thomas E. Gouldy

IPC: C09J7/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: C09J7/0289 ,  C09J7/0242 ,  H05K3/305 ,  H05K3/306 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2201/61 ,  H05K2201/0133 ,  H05K2201/10068 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K3/301 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T428/249983

Abstract: A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.

Abstract translation: 安装实体分层包含压敏粘合剂，泡沫隔离物，第二压敏粘合剂，填料和热敏粘合剂。 第一压敏粘合剂附接到电气部件，然后将电子部件安装在印刷电路上，其中热敏粘合剂与其接触。 板上通过焊波将板的顶表面加热到足够高的温度以激活热敏粘合剂并将该部件粘附到板上。 中间泡沫层可抑制冲击和振动。

公开(公告)号：US4763227A

公开(公告)日：1988-08-09

申请号：US80937

申请日：1987-08-03

Applicant: William G. Novacek

Inventor： William G. Novacek

IPC: B32B15/08 ,  H01G9/00 ,  H01G9/008 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G9/008 ,  H05K3/308 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2203/168 ,  H05K3/3447

Abstract: A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.

Abstract translation: 具有沿一个方向延伸的轴向阳极和阴极引线的低成本铝电解电容器封装能够在水平位置连接到印刷电路板而不滚动，这种不希望的滚动可能导致一个引线的退出 可能不会接收到焊料。 封装的另一端连接一个虚拟引线，以便在焊接安装后稳定电容器。 三条线之一有一个牛弓弯，倾向于阻止不必要的滚动。

公开(公告)号：US4739139A

公开(公告)日：1988-04-19

申请号：US915584

申请日：1986-10-06

Applicant: Hiroshi Ikeda

Inventor： Hiroshi Ikeda

IPC: H01H1/58 ,  H01H9/00 ,  H01H11/00 ,  H01H23/00 ,  H01H23/08 ,  H05K1/11 ,  H05K3/30 ,  H02B1/08

CPC classification number: H01H23/006 ,  H05K3/308 ,  H01H11/0031 ,  H05K1/115 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10696 ,  H05K2201/10757

Abstract: Pin terminals projecting from a side of a switch housing are led out upon being arranged in one direction and in a plane parallel to the side of the switch housing, and distal end portions of the pin terminals are secured to a printed circuit board. This reduces the space needed for mounting the switch, facilitates the mounting of the switch on the printed circuit board and mounts the switch more reliably.

Abstract translation: 从开关壳体的一侧突出的销端子沿着一个方向并且平行于开关壳体的一侧的平面被引出，并且销端子的远端部固定到印刷电路板。 这减少了安装开关所需的空间，便于将开关安装在印刷电路板上，并更加可靠地安装开关。

公开(公告)号：US4118757A

公开(公告)日：1978-10-03

申请号：US793705

申请日：1977-05-04

Applicant: Kenneth D. Rinaldo

Inventor： Kenneth D. Rinaldo

IPC: H01R12/55 ,  H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K1/04

CPC classification number: H05K7/1053 ,  H05K3/301 ,  H05K3/308 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10295 ,  H05K2201/10446 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10696 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K3/3447

Abstract: A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.

Abstract translation: 提供了一种安装装置，借此通过连接在各个接触针之间的多个细长的针延伸元件将一个具有可在一侧接触的接触销的电子显示装置安装在印刷电路板上， 印刷电路板上的导电引线，元件具有用于接收引脚并且相对于所述印刷电路板以非正交角度定向的销接收装置，并且扩展器元件形成用于显示装置的三角形结构支撑。

公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US20140313682A1

公开(公告)日：2014-10-23

申请号：US14257006

申请日：2014-04-21

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： HIROYUKI MITOME

IPC: H05K1/02

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

公开(公告)号：US08169286B2

公开(公告)日：2012-05-01

申请号：US12071256

申请日：2008-02-19

Applicant: Minoru Hasegawa ,  Masao Kuroda

Inventor： Minoru Hasegawa ,  Masao Kuroda

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/02

CPC classification number: H05K1/182 ,  H01F27/22 ,  H01F27/2871 ,  H01F27/292 ,  H01F27/306 ,  H01F38/14 ,  H01F41/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/1311 ,  Y10T29/49078

Abstract: A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.

Abstract translation: 线圈单元包括平面线圈，印刷电路板，其包括容纳平面线圈的平面线圈放置部，设置在平面线圈的发送侧并保护平面线圈的保护片，以及​​保护片， 设置在平面线圈的非发送侧。 平面线圈被放置在平面线圈放置部分中并且电连接到印刷电路板。 平面线圈放置部具有与平面线圈的外形对应的形状。

公开(公告)号：US08064191B2

公开(公告)日：2011-11-22

申请号：US12280692

申请日：2007-03-13

Applicant: Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

Inventor： Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

IPC: H01G2/20 ,  H01G5/38 ,  H05K7/18

CPC classification number: H01G2/06 ,  H01G2/106 ,  H01G2/12 ,  H01G9/008 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10962 ,  H05K2203/1361

Abstract: According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.

Abstract translation: 根据在电容器连接引脚沿垂直方向焊接到电路基板之后，在电路基板的两面上形成防潮剂的结构和制造方法，并且将电容器电连接到与 在电路基板的上部空间处的电容器连接针的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率 并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

公开(公告)号：US07839621B2

公开(公告)日：2010-11-23

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko Shirakawa ,  Iwao Miura

Inventor： Yukihiko Shirakawa ,  Iwao Miura

IPC: H01G4/228 ,  H01G4/248 ,  H01G4/06

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20100232179A1

公开(公告)日：2010-09-16

申请号：US12713178

申请日：2010-02-26

Applicant: JIAN-SHIHN TSANG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

Inventor： JIAN-SHIHN TSANG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

IPC: F21V7/04 ,  H05K1/00 ,  H05K1/16 ,  F21V19/00

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10651 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A back light module includes a printed circuit board and a plurality of surface mounting elements mounted on the printed circuit board. Each surface mounting element is an LED lighting element. The printed circuit board has a plurality of pads. Each of the pads includes a first bar and two second bars extending respectively from two ends of the first bar. The surface mounting element includes a plurality of pins. The pins are placed on two sides of the surface mounting element. The pins are soldered on the pads.

Abstract translation: 背光模块包括印刷电路板和安装在印刷电路板上的多个表面安装元件。 每个表面安装元件是LED照明元件。 印刷电路板具有多个焊盘。 每个垫包括分别从第一杆的两端延伸的第一杆和两个第二杆。 表面安装元件包括多个销。 销被放置在表面安装元件的两侧。 引脚焊接在焊盘上。