公开(公告)号：DE102004048202B4

公开(公告)日：2008-05-21

申请号：DE102004048202

申请日：2004-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  GROENINGER HORST

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/66 ,  H01L21/78

Abstract: Methods for singulating surface-mountable semiconductor devices and for fitting external contact areas to the devices are described herein. Semiconductor device components are applied to a metallic carrier in rows and columns in corresponding semiconductor device positions of the metallic carrier. Thereafter, a plurality of components, situated in the device positions, is embedded into a plastic housing composition, thereby producing a composite board. The composite board is subsequently separated into individual semiconductor devices by laser ablation, the semiconductor devices being inscribed on their top sides via the laser technique. The top sides with the inscription can then be adhesively bonded to an adhesive film, so that the undersides of the devices can be uncovered while maintaining the semiconductor device positions.

公开(公告)号：DE102005046280B4

公开(公告)日：2007-11-08

申请号：DE102005046280

申请日：2005-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  BAUER MICHAEL

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/50 ,  H01L23/16

公开(公告)号：DE102006009789B3

公开(公告)日：2007-10-04

申请号：DE102006009789

申请日：2006-03-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  BRUNNBAUER MARKUS ,  BELONIO JESUS MENNEN ,  FUERGUT EDWARD

IPC: H01L21/58 ,  H01L21/56 ,  H01L23/29

公开(公告)号：DE102005046280A1

公开(公告)日：2007-04-05

申请号：DE102005046280

申请日：2005-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  BAUER MICHAEL

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/50 ,  H01L23/16

Abstract: An electronic semiconductor component (1) has a semiconductor chip (2) whose active surface has flip chip contacts (6), and a passive surface. The flip chip contacts are surrounded by an insulating layer (12) with UV B stage-capable material (13) applied to the semiconductor wafer surface (5). An independent claim is also included for a commensurate manufacturing process.

公开(公告)号：DE102005043808A1

公开(公告)日：2007-03-29

申请号：DE102005043808

申请日：2005-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD ,  STROBEL PETER ,  RAKOW BERND

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/60

公开(公告)号：DE10304777B4

公开(公告)日：2006-11-23

申请号：DE10304777

申请日：2003-02-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  FUERGUT EDWARD

IPC: H01L21/58 ,  G06K19/077 ,  H01L20060101 ,  H01L21/00 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31

Abstract: The invention relates to a method for producing a chip panel or composite wafer by means of a heating and pressing process, and also to a device for carrying out the method. For carrying out the method, a chip carrier sheet and a transfer sheet are provided in the device. The method comprises loading the chip carrier sheet with semiconductor chips and heating the sheets. As this happens, one of the sheets remains dimensionally stable, while the semiconductor chips are pressed into the other, deformable sheet.

公开(公告)号：DE502004001120D1

公开(公告)日：2006-09-14

申请号：DE502004001120

申请日：2004-06-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  JEREBIC SIMON ,  POHL JENS ,  STROBEL PETER ,  WOERNER HOLGER

IPC: H01L31/0203 ,  G01J1/02 ,  H01L23/48 ,  H01L23/538 ,  H04N5/225

Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

公开(公告)号：DE102004048202A1

公开(公告)日：2006-04-06

申请号：DE102004048202

申请日：2004-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  GROENINGER HORST

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/66

Abstract: Methods for singulating surface-mountable semiconductor devices and for fitting external contact areas to the devices are described herein. Semiconductor device components are applied to a metallic carrier in rows and columns in corresponding semiconductor device positions of the metallic carrier. Thereafter, a plurality of components, situated in the device positions, is embedded into a plastic housing composition, thereby producing a composite board. The composite board is subsequently separated into individual semiconductor devices by laser ablation, the semiconductor devices being inscribed on their top sides via the laser technique. The top sides with the inscription can then be adhesively bonded to an adhesive film, so that the undersides of the devices can be uncovered while maintaining the semiconductor device positions.

公开(公告)号：DE10334578A1

公开(公告)日：2005-03-10

申请号：DE10334578

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：DE10308855A1

公开(公告)日：2004-09-16

申请号：DE10308855

申请日：2003-02-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  OFNER GERALD ,  FUERGUT EDWARD ,  JEREBIC SIMON ,  BEMMERL THOMAS ,  FINK MARKUS ,  VILSMEIER HERMANN

IPC: H01L21/60 ,  H01L21/78 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L23/50

Abstract: Semiconductor wafer for electronic components (2) has on its top surface integrated circuits for semiconductor chips (6) in lines and columns. Between integrated circuits are located strip-shaped dividing regions for chips, which contain through contacts with perforations, extending to rear side of wafer. Walls (11) of perforation contain metal film (12), or insulating layer (30) coated with metal film. Preferably through contacts contain meltable solder material. Integrated circuits are located on top side (14), while rims (15-18), at least one including rim contacts (19). Independent claims are included for semiconductor chip, electronic component and method for producing semiconductor wafer.