公开(公告)号：JPWO2007007861A1

公开(公告)日：2009-01-29

申请号：JP2007524716

申请日：2006-07-07

Applicant: イビデン株式会社

Inventor： 通昌 高橋 ,  通昌 高橋 ,  幸信 三門 ,  幸信 三門 ,  武信 中村 ,  武信 中村 ,  雅一 青山 ,  雅一 青山

IPC: H05K3/46

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: 絶縁層と導体層とが交互に積層され、導体層同士が絶縁層に設けたバイアホールを介して電気的に接続されてなる多層プリント配線板は、そのバイアホールは、少なくともその一部において、絶縁層の厚み方向に対してほぼ垂直な方向に膨らみを有して形成され、落下した際の衝撃力等の外部応力を抑制して、絶縁基板が反りにくくして、導体回路のクラックや、断線等を防止し、実装基板の信頼性や耐落下性の低下を軽減することができる。

公开(公告)号：US09877387B2

公开(公告)日：2018-01-23

申请号：US14779232

申请日：2014-03-26

Applicant: KYOCERA Corporation

Inventor： Satoshi Kajita ,  Mitsuhiro Hagihara ,  Yuuhei Matsumoto

IPC: H05K7/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

公开(公告)号：US09814139B2

公开(公告)日：2017-11-07

申请号：US15124499

申请日：2015-02-27

Applicant: Sony Corporation

Inventor： Toshihiko Watanabe

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K1/03 ,  H01L33/48

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

Abstract: A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

公开(公告)号：US09351081B2

公开(公告)日：2016-05-24

申请号：US13779210

申请日：2013-02-27

Applicant: Texas Instruments Incorporated

Inventor： Peter B Johnson ,  Ira Oaktree Wygant

IPC: H02N1/00 ,  H04R19/00 ,  B06B1/02

CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device includes at least one CMUT cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of the first substrate. The TSV is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate. A membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity. A metal layer is over the top side substrate contact area and over the movable membrane including coupling of the top side substrate contact area to the movable membrane.

Abstract translation: 电容式微加工超声波传感器（CMUT）装置包括至少一个CMUT单元，其包括单晶材料的第一基板，其具有包括厚和薄的电介质区域的在其上的图案化电介质层的顶侧，以及贯穿基板通孔 TSV）延伸第一基板的整个厚度。 TSV由单晶材料形成，通过单晶材料中的隔离区电隔离，并且位于第一基板的顶侧接触区域的下方。 膜层结合到厚电介质区域和薄介电区域上，以在微机电系统（MEMS）腔体上提供可移动膜。 金属层在顶侧基板接触区域上方并且在可移动膜上方，包括顶侧基板接触区域与可动膜的耦合。

公开(公告)号：US09124040B2

公开(公告)日：2015-09-01

申请号：US14248888

申请日：2014-04-09

Applicant: Knuerr GmbH

Inventor： Josef Feigl

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/58 ,  H05K3/40 ,  H01R12/52

CPC classification number: H01R12/7082 ,  H01R12/523 ,  H01R12/585 ,  H05K1/113 ,  H05K1/144 ,  H05K3/368 ,  H05K3/40 ,  H05K2201/042 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: The invention relates to a PCB connector for fastening a first printed circuit board on a second printed circuit board. The PCB connector may have a longitudinal base body with a clamping and fastening device for tool-free fastening of the PCB connector on a printed circuit board. The clamping and fastening device has a put-through body and a spring body which is formed extendable upon putting-through the put-through body through the land. The base body is thus pressed against the printed circuit board by the spring body.

Abstract translation: 本发明涉及一种用于将第一印刷电路板固定在第二印刷电路板上的PCB连接器。 PCB连接器可以具有带有夹紧和紧固装置的纵向基体，用于将PCB连接器无缝地固定在印刷电路板上。 夹紧和紧固装置具有穿透体和弹簧体，弹性体在穿过穿过体穿过脊部时形成为可延伸的。 基体因此被弹簧体压靠在印刷电路板上。

公开(公告)号：US20150216052A1

公开(公告)日：2015-07-30

申请号：US14607199

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jeong Won PARK ,  Hee Beom An ,  Kyu Dong Kang ,  Gyu Ho Park ,  Su Jin Park ,  Sang Hoon Yoon

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0366 ,  H05K2201/09863

Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.

Abstract translation: 印刷电路板包括基板; 以及穿过基板的第一和第二表面的孔。 孔包括形成在基板的内侧的孔的宽度形成为大于形成在第一表面和/或第二表面上的开口的宽度的区域。

公开(公告)号：US20150049447A1

公开(公告)日：2015-02-19

申请号：US14460587

申请日：2014-08-15

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Kyoung Ja Yun

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/0052 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/183 ,  H05K2201/09718 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/10 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.

Abstract translation: 防止在切割过程中产生的毛刺的基底基板包括：相对于基底基板沿一个方向堆叠的多个导电层; 至少一个绝缘层与所述导电层交替堆叠并电分离所述导电层; 以及根据所述芯片基板的预定区域，在切割所述基底基板期间，在所述切割面和所述绝缘层相接触的接触区域处覆盖所述绝缘层的通孔。 制造基底基板的方法包括交替地堆叠导电层和绝缘层并形成通孔。

公开(公告)号：US08148643B2

公开(公告)日：2012-04-03

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K1/03

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07838779B2

公开(公告)日：2010-11-23

申请号：US11452933

申请日：2006-06-15

Applicant: Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

Inventor： Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Kenta Ogawa ,  Jun Tsukano ,  Hirokazu Honda

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/0055 ,  H05K3/20 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/09863 ,  H05K2203/0796 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.

Abstract translation: 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。

公开(公告)号：US07759582B2

公开(公告)日：2010-07-20

申请号：US11480851

申请日：2006-07-06

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.

Abstract translation: 多层印刷布线板包括彼此交替堆叠的绝缘层和导体层。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。