公开(公告)号：KR1020130089544A

公开(公告)日：2013-08-12

申请号：KR1020120010983

申请日：2012-02-02

Applicant: 삼성전자주식회사

Inventor： 이호진 ,  강필규 ,  이규하 ,  최길현 ,  박병률 ,  정현수

IPC: H01L21/768 ,  H01L21/28

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/525 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PURPOSE: A via connection structure, a semiconductor device including the same, and manufacturing methods thereof are provided to prevent a contact failure by including a wiring barrier layer. CONSTITUTION: A substrate has a first side and a second side. The second side faces the first side. A through via structure (45a) includes a first end and a second end. An insulation layer (30) has a rewiring groove. A rewiring structure (50) includes a rewiring barrier layer and a rewiring part.

Abstract translation: 目的：提供通孔连接结构，包括其的半导体器件及其制造方法，以通过包括布线阻挡层来防止接触故障。 构成：衬底具有第一面和第二面。 第二面朝向第一面。 通孔结构（45a）包括第一端和第二端。 绝缘层（30）具有重新布线槽。 重新布线结构（50）包括重新布线阻挡层和重新布线部分。

公开(公告)号：KR1020130025320A

公开(公告)日：2013-03-11

申请号：KR1020120011834

申请日：2012-02-06

Applicant: 삼성전자주식회사

Inventor： 이병인 ,  김동원 ,  정현수

IPC: A47L9/00 ,  A47L9/28

CPC classification number: A47L11/4025 ,  A47L11/33 ,  A47L2201/00 ,  A47L2201/024

Abstract: PURPOSE: A cleaning system and a maintenance station thereof are provided to improve durability of product and to improve cleaning performance by preventing temperature rise due to a fan motor. CONSTITUTION: A cleaning system comprises an opening part, a robot cleaner, and a maintenance station. The robot cleaner includes a first dust bin which is connected to the opening part. In the maintenance station, the robot cleaner is docked in order to discharge the dust which is stored in the first dust bin. The maintenance station comprises a first inlet, a fist outlet, a circulation flow passage, a second dust bin(44), a blower(41), a second outlet. The first inlet is formed in order to inhale the dust from the first dust bin through the opening part of the robot cleaner. The blower includes a ventilation fan and a fan motor which drives the ventilation fan. Air flows through the circulation flow passage.

Abstract translation: 目的：提供一种清洁系统及其维护站，以提高产品的耐用性，并通过防止由风扇电动机引起的温升来提高清洁性能。 构成：清洁系统包括开口部分，机器人清洁器和维护站。 机器人清洁器包括连接到开口部分的第一灰尘盒。 在维护站中，将机器人清洁器对接以排出存储在第一集尘箱中的灰尘。 维护站包括第一入口，第一出口，循环流动通道，第二垃圾箱（44），鼓风机（41），第二出口。 形成第一入口以便通过机器人清洁器的开口部分吸入来自第一垃圾箱的灰尘。 鼓风机包括通风扇和驱动通风扇的风扇马达。 空气流过循环流动通道。

公开(公告)号：KR1020130025309A

公开(公告)日：2013-03-11

申请号：KR1020110100467

申请日：2011-10-04

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  이병인 ,  장휘찬 ,  김동원

IPC: A47L9/00 ,  A47L9/04 ,  A47L9/28

CPC classification number: A47L9/009 ,  A47L2201/06

Abstract: PURPOSE: A robot cleaner and a control method thereof are provided to prevent a main body from colliding with obstacles. CONSTITUTION: A robot cleaner comprises a main body, a brush unit, and a brush cleaning member. The brush unit is rotatably installed in the main body and sweeps dusts on the floor into the brush unit. The brush cleaning member protrudes to the bush unit for touching the brush unit. The brush cleaning member comprises a fist brush cleaning protrusion(42a) and a second brush cleaning protrusion(42b) which removes foreign substance from the brush unit. The first brush cleaning protrusion and the second brush cleaning protrusion incline to the different direction. When the brush unit rotates to the first direction, the first brush cleaning protrusion removes the foreign substances which are wound in the brush unit. When the brush unit rotates the second direction, the second brush cleaning protrusion removes the foreign substances which are wound the brush unit.

Abstract translation: 目的：提供机器人清洁器及其控制方法，以防止主体与障碍物碰撞。 构成：机器人清洁器包括主体，刷子单元和刷子清洁构件。 刷子单元可旋转地安装在主体中，并将​​地板上的灰尘扫到刷子单元中。 刷清洁部件突出到用于接触刷子单元的衬套单元。 刷清洁部件包括从刷毛单元除去异物的第一刷清洁突起（42a）和第二刷清洁突起（42b）。 第一刷清洁突起和第二刷清洁突起朝不同方向倾斜。 当刷子单元向第一方向旋转时，第一刷清洁突起去除卷绕在刷单元中的异物。 当刷单元旋转第二方向时，第二刷清洁突起去除卷绕在刷单元上的异物。

公开(公告)号：KR1020120007943A

公开(公告)日：2012-01-25

申请号：KR1020100108235

申请日：2010-11-02

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  김동원 ,  이준화

IPC: A47L9/28 ,  A47L11/20 ,  A47L9/19

CPC classification number: A47L9/2805 ,  A47L9/106 ,  A47L9/28 ,  A47L9/2815 ,  A47L9/30 ,  A47L2201/00 ,  A47L2201/024 ,  A47L2201/028 ,  A47L2201/04 ,  A47L2201/06

Abstract: PURPOSE: An automatic cleaning device, a maintenance station and a cleaning system with the same are provided to reduce energy consumption and a material cost by circulating air between an automatic cleaning device and a maintenance station. CONSTITUTION: An automatic cleaning device comprises a body(21), a dust tank(43), and a brush unit(41). The body comprises an opening(21a). The dust tank is prepared on the body to store dust. The brush unit is prepared on the opening of the body. The brush unit sweeps and sends dust on the floor to the dust tank. The dust stored in the dust tank floats by air flowing into through the opening of the body. The floating dust is externally emitted through the opening of the body. When the dust is emitted, the roller of the brush unit changes a rotating direction at least one time.

Abstract translation: 目的：提供自动清洁装置，维护站和具有该清洁装置的清洁系统，以通过在自动清洁装置和维护站之间循环空气来减少能量消耗和材料成本。 构成：自动清洁装置包括主体（21），灰尘箱（43）和刷子单元（41）。 主体包括开口（21a）。 灰尘箱在身上准备存放灰尘。 刷子单元准备在身体的开口上。 刷子单元扫地并将灰尘放在地板上的灰尘箱中。 储存在灰尘箱中的灰尘通过穿过身体开口的空气漂浮。 浮尘通过身体的开口从外部排出。 当灰尘发生时，刷子单元的辊至少一次改变旋转方向。

公开(公告)号：KR1020110047755A

公开(公告)日：2011-05-09

申请号：KR1020090104503

申请日：2009-10-30

Applicant: 삼성전자주식회사

Inventor： 김기혁 ,  김남석 ,  정현수 ,  김석호 ,  박명순 ,  신창우

IPC: H01L23/12

CPC classification number: H01L21/76813 ,  H01L21/561 ,  H01L21/76879 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02317 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PURPOSE: A semiconductor device with a rewiring structure, a semiconductor package including the same, a package laminate structure, a semiconductor module, an electronic circuit board, an electronic system, and manufacturing methods thereof are provided to improve yield through simple manufacturing processes. CONSTITUTION: Chip pads are formed on the upper side of a semiconductor chip. A protection layer(730) is formed on the semiconductor chip. A rewiring insulation layer is formed on the protection layer. Rewiring via plugs(760v) are connected to a chip pad by vertically passing through the protection layer and the rewiring insulation layer. A rewiring structure(760) includes rewiring electrically connected to the rewiring via plugs. The upper surface height of the rewiring via plugs is equal to the upper surface height of the rewiring. At least one rewiring via plug is integrated to the rewiring using the same materials.

Abstract translation: 目的：提供一种具有重新布线结构的半导体器件，包括该半导体封装的半导体封装，封装叠层结构，半导体模块，电子电路板，电子系统及其制造方法，以通过简单的制造工艺提高产量。 构成：芯片焊盘形成在半导体芯片的上侧。 在半导体芯片上形成保护层（730）。 在保护层上形成再布线绝缘层。 通过插头（760v）重新连接通过垂直穿过保护层和重新布线绝缘层连接到芯片焊盘。 重新布线结构（760）包括通过插头电连接到重新布线的重新布线。 通过插头重新布线的上表面高度等于重新布线的上表面高度。 使用相同的材​​料将至少一个通过插头重新布线整合到重新布线。

公开(公告)号：KR1020100087564A

公开(公告)日：2010-08-05

申请号：KR1020090006655

申请日：2009-01-28

Applicant: 삼성전자주식회사

Inventor： 박명순 ,  안은철 ,  정현수 ,  김석호 ,  최도연 ,  천진호

IPC: H01L21/60

CPC classification number: H01L24/11 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13014 ,  H01L2224/13076 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: PURPOSE: A method for forming a connection terminal including a solder unit and a solder unit supporter is provided to efficiently reduce an external impact by changing the propagation direction of a crack. CONSTITUTION: A substrate with a UBM(Under Bump Metallurgy)(116) is prepared. A solder unit(141) comprised of a lower side of a cylindrical shape and an upper side of a sphere shape is formed. The lower side is combined with the UBM. A solder unit supporter(130) is formed on the substrate and surrounds the lower side. The solder unit supporter is arranged on the UBM.

Abstract translation: 目的：提供一种用于形成包括焊料单元和焊料单元支撑件的连接端子的方法，以通过改变裂纹的传播方向来有效地减少外部冲击。 构成：制备了具有UBM（Under Bump Metallurgy）（116）的底物。 形成由圆柱形的下侧和球形的上侧构成的焊接单元（141）。 下侧与UBM组合。 焊料单元支撑件（130）形成在基板上并且围绕下侧。 焊接单元支架安装在UBM上。

公开(公告)号：KR1020100045857A

公开(公告)日：2010-05-04

申请号：KR1020080104986

申请日：2008-10-24

Applicant: 삼성전자주식회사

Inventor： 이호진 ,  정현수 ,  전창성 ,  박상식 ,  피재현

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L23/48 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941

Abstract: PURPOSE: A semiconductor chip, a stack module, and a manufacturing method of the semiconductor chip and memory card each other securely connect the semiconductor chip through the latch bond of the conductive bump and spike portion. The connection reliability between the semiconductor chips is enhanced. CONSTITUTION: One or more conductive pad(130) is formed on the semiconductor substrate(110). One or more via electrode(150) is electrically connected to one or more conductive pad. A via electrode is extended toward the above semiconductor inside substrate. Electrode it empties comprises the spike portion, and the body part and protrusion.

Abstract translation: 目的：通过半导体芯片和存储卡的半导体芯片，堆叠模块和制造方法，通过导电凸块和尖峰部分的锁定键将半导体芯片牢固地连接。 提高了半导体芯片之间的连接可靠性。 构成：在半导体衬底（110）上形成一个或多个导电焊盘（130）。 一个或多个通孔电极（150）电连接到一个或多个导电焊盘。 通孔电极朝向上述半导体内部基板延伸。 它被清空的电极包括尖峰部分，以及身体部分和突起。

公开(公告)号：KR1020090002644A

公开(公告)日：2009-01-09

申请号：KR1020070066168

申请日：2007-07-02

Applicant: 삼성전자주식회사

Inventor： 이호진 ,  김남석 ,  권용재 ,  정현수 ,  이인영 ,  황선관

IPC: H01L23/12

CPC classification number: H01L24/05 ,  H01L23/481 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/034 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05011 ,  H01L2224/05552 ,  H01L2224/05559 ,  H01L2224/05561 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/08146 ,  H01L2224/32145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/00014

Abstract: A semiconductor device including a through electrode and a method for manufacturing the same are provided to minimize the process failure by simplifying the fabrication of through electrode which is arranged around the metal layer. A semiconductor device including a through electrode comprises a semiconductor substrate(101), a first insulating layer(110), a wiring(115), a second insulating layer(120), a conductive pad(125), the penetration hole and a through electrode(150). The first insulating layer is formed on the semiconductor substrate. The wire is located on the surface of the first insulating layer and has an opening to expose the first insulating layer. The second insulating layer is formed on the first insulating layer and the wiring while filling up the first opening. The conductive pad is formed on the second insulating layer and includes the second opening for exposing the second insulating layer. The penetration hole is formed through the semiconductor substrate, the first insulating layer, and the second insulating layer.

Abstract translation: 提供一种包括通孔的半导体器件及其制造方法，其通过简化布置在金属层周围的贯通电极的制造来最小化工艺故障。 包括通孔的半导体器件包括半导体衬底（101），第一绝缘层（110），布线（115），第二绝缘层（120），导电焊盘（125），穿透孔和贯通孔 电极（150）。 第一绝缘层形成在半导体衬底上。 导线位于第一绝缘层的表面上，并且具有露出第一绝缘层的开口。 第二绝缘层在填充第一开口时形成在第一绝缘层和布线上。 导电焊盘形成在第二绝缘层上，并且包括用于暴露第二绝缘层的第二开口。 穿透孔通过半导体衬底，第一绝缘层和第二绝缘层形成。

公开(公告)号：KR100858242B1

公开(公告)日：2008-09-12

申请号：KR1020070033394

申请日：2007-04-04

Applicant: 삼성전자주식회사

Inventor： 백승덕 ,  강선원 ,  정현수

IPC: H01L23/12

CPC classification number: H01L23/525 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L2224/02233 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor device including a re-wiring structure and a forming method thereof are provided to minimize warpage of a wafer due to a thermal expansion coefficient difference between a wafer and multi-insulating layer patterns. A semiconductor chip(210) includes an active surface on which pads are arranged. A protective layer pattern(214) is formed to cover the active surface of the semiconductor chip and to expose the pads. A first insulating layer pattern(216) is arranged on the protective layer pattern. A second insulating layer pattern(218) is arranged on the first insulating layer pattern. A plurality of re-wiring patterns(220) are electrically connected to the pads and are extended to the second insulating layer pattern. The second insulating layer pattern is locally arranged on the first insulating layer pattern around a lower part of the re-wiring patterns.

Abstract translation: 提供了包括重新布线结构及其形成方法的半导体器件，以使由于晶片和多层绝缘层图案之间的热膨胀系数差导致的晶片翘曲最小化。 半导体芯片（210）包括其上布置有焊盘的有源表面。 形成保护层图案（214）以覆盖半导体芯片的有源表面并露出焊盘。 第一绝缘层图案（216）布置在保护层图案上。 在第一绝缘层图案上布置有第二绝缘层图案（218）。 多个重新布线图案（220）电连接到焊盘并延伸到第二绝缘层图案。 第二绝缘层图案在重新布线图案的下部周围局部布置在第一绝缘层图案上。

公开(公告)号：KR100837269B1

公开(公告)日：2008-06-11

申请号：KR1020060045802

申请日：2006-05-22

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  이인영 ,  황선관 ,  이동호 ,  황성덕

IPC: H01L23/12

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01093 ,  H01L2224/11 ,  H01L2224/05552

Abstract: 웨이퍼 레벨 패키지 및 그 제조 방법을 제공한다. 이 방법은 웨이퍼 상에 연결 패드를 갖는 반도체 칩들을 형성하고, 웨이퍼의 하부면을 패터닝하여 연결 패드 아래에 트렌치를 형성하고, 트렌치의 바닥면을 패터닝하여 연결 패드의 하부면을 노출시키는 비아홀을 형성한 후, 비아홀을 통해 연결 패드에 접속하는 연결 소자를 형성하는 단계를 포함한다.