公开(公告)号：EP2809135A1

公开(公告)日：2014-12-03

申请号：EP14170461.9

申请日：2014-05-29

Applicant: Mavel S.r.l.

Inventor： Bettoni, Davide ,  Stirano, Giorgio

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/09236 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10166

Abstract: What is described is an electronic device (1) comprising a power component (3) and a printed circuit board (2) . The power component comprises a main body (30) and a lead (31) . The printed circuit board comprises at least two conductive layers (21) parallel to a plane xy, a mounting element (23) and a conductor (24) . The mounting element and the conductor respectively comprise first (23b) and second (24b) conductive tubes, which elongate through a thickness of the printed circuit board along a direction z substantially perpendicular to the plane xy. The main body of the power component is fixed to the mounting element, while the lead thereof is fixed to the conductor.

Abstract translation: 描述的是包括电力部件（3）和印刷电路板（2）的电子设备（1）。 功率部件包括主体（30）和引线（31）。 印刷电路板包括平行于平面xy的至少两个导电层（21），安装元件（23）和导体（24）。 安装元件和导体分别包括第一（23b）和第二（24b）导电管，其沿着基本上垂直于平面xy的方向z延伸穿过印刷电路板的厚度。 功率部件的主体固定在安装元件上，而其引线固定在导体上。

公开(公告)号：EP1832146A1

公开(公告)日：2007-09-12

申请号：EP05813683.9

申请日：2005-11-03

Applicant: Siemens Home and Office Communication Devices GmbH & Co. KG

Inventor： BUSCH, Georg

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H05K1/0287 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09609

Abstract: Disclosed are a semifinished product (2) and a support component (1) which is formed therewith and is used for electrical circuit designs that are placed thereupon and make it possible to produce prototypes or small series in an inexpensive and time-saving manner. In order to be able to do so, the semifinished product (2) comprises a planar, e.g. flexible, basic support material, across the entire area of which through-contacts (7) that are formed with nanovias are disposed in a regular constant pattern. Such a component can be produced using a single exposure template for forming the nanovias while making it possible to produce circuit designs that have any appearance on the surfaces thereof.

公开(公告)号：EP1714531A2

公开(公告)日：2006-10-25

申请号：EP05713419.9

申请日：2005-02-14

Applicant: MOLEX INCORPORATED

Inventor： REGNIER, Kent, E. ,  BRUNKER, David, L. ,  OGBUOKIRI, Martin, U.

IPC: H05K1/11

CPC classification number: H05K1/0245 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09609 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A circuit board (200, 300, 400) design is disclosed that is useful in high speed differential signal applications uses either a via arrangement or a circuit trace exit structure. In the via arrangement, sets of differential signal pair vias (301, 303, 401, 402) and an associated ground (302) are arranged adjacent to each other in a repeating pattern. The differential signal vias (301, 303, 591) of each pair are spaced closer to their associated ground via (302a, 593a) than the spacing between the adjacent differential signal pair associated ground (302b, 593b) so that differential signal vias exhibit a preference for electrically coupling to their associated ground vias. The circuit trace exit structure involves the exit portions of the circuit traces (420, 550) of the differential signal vias (401, 402, 591) to follow a path where the traces then meet with and join to the transmission line portions (552) of the conductive traces.

公开(公告)号：EP1561368A1

公开(公告)日：2005-08-10

申请号：EP03783214.4

申请日：2003-11-07

Applicant: PPG Industries Ohio, Inc.

Inventor： OLSON, Kevin, C. ,  WANG, Alan, E.

IPC: H05K3/44 ,  H01L21/48

CPC classification number: C09D5/4488 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/388 ,  H05K3/426 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0179 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2203/0582 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.

公开(公告)号：EP0834921B1

公开(公告)日：2003-11-26

申请号：EP97203302.1

申请日：1992-12-30

Applicant: TESSERA, INC.

Inventor： Distefano, Thomas H. ,  Khandros, Igor ,  Grube, Gary W. ,  Ehrenberg, Scott G.

IPC: H01L23/538

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

公开(公告)号：EP1028607A1

公开(公告)日：2000-08-16

申请号：EP99917198.6

申请日：1999-04-27

Applicant: NGK INSULATORS, LTD.

Inventor： SUZUKI, Tomio ,  OTAGIRI, Tadashi ,  KAWAI, Satoru ,  ISHIKAWA, Shuhei

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4038 ,  H05K1/0287 ,  H05K1/0298 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/0235 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A substrate material (10) for printed circuit, comprising a sheet-shaped composite material (11) composed of a plastic and a ceramic and conductive metal wires (12) fixed in the composite material (11) at given pitches, wherein the two surfaces of the substrate material (10) have electrical connection to each other via the metal wires (12). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.

Abstract translation: 甲基板材料（10），用于印刷电路，包括固定在按规定节距所述复合材料（11）由塑料与陶瓷和导电金属线（12）构成的片状复合材料（11），worin两个表面 基板材料（10）的具有通过金属线（12）彼此电连接。 一种用于在给定的间距产生基板材料的印刷电路，该方法包括在模具中拉伸，导电金属线，然后浇注，到模具中，塑料与陶瓷组成的复合材料，使复合材料固化，然后过程 垂直于大约的金属线的方向切割的方向上得到的材料。 良好的电连接可以被固定，并且能够防止在使用期间，底物和材料导电层之间以及绝缘材料和金属导线之间的剥离。 高密度和尺寸精度优异的印刷电路板可制得。

公开(公告)号：EP0834921A3

公开(公告)日：1998-08-26

申请号：EP97203302.1

申请日：1992-12-30

Applicant: TESSERA, INC.

Inventor： Distefano, Thomas H. ,  Khandros, Igor ,  Grube, Gary W. ,  Ehrenberg, Scott G.

IPC: H01L23/538

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

Abstract: The invention relates to a method of making a multi-layer circuit assembly. Said method comprises the steps of providing a first circuit panel (544) having a dielectric body with oppositely directed top and bottom surfaces, contacts (538) on its top surface at locations of a first pattern, terminals (530) on its bottom surface, and through-conductors (527) electrically connected to said terminals and extending to the top surface of the panel, and a second circuit panel (562) having a dielectric body with a bottom surface and terminals (530) at locations of said first pattern on the bottom surface of such panel, said providing step including the step of customizing said first circuit panel by selectively treating the top surface of such panel so that less than all of the through conductors of such panel are connected to contacts of such panel; stacking said circuit panels in superposed, top-surface to bottom surface relation so that the top surface of said first circuit panel faces the bottom surface of said second circuit panel at a first interface and said first patterns on said facing surfaces are in registration with one another, with said contacts of said first panel being aligned with said terminals of said second panel at least some locations of said inregistration patterns; and non-selectively connecting all of said aligned contacts and terminals at said interface, whereby less than all of said through conductors of said customized panel are connected to terminals of said adjacent panel. The invention also relates to a multi-layer circuit assembly.

公开(公告)号：EP0600052B1

公开(公告)日：1996-04-17

申请号：EP93909756.4

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H05K3/40

CPC classification number: H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.

公开(公告)号：EP0575292B1

公开(公告)日：1996-03-13

申请号：EP93810414.8

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter, Dr. ,  Martinelli, Marco

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/42 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

公开(公告)号：EP0436848B1

公开(公告)日：1995-05-24

申请号：EP90123638.0

申请日：1990-12-08

Applicant: International Business Machines Corporation

Inventor： Chance, Dudley Augustus

IPC: H01L23/64 ,  H01L23/538 ,  H01L23/66

CPC classification number: H01L23/66 ,  H01L23/5384 ,  H01L23/64 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0289 ,  H05K1/115 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2201/09718 ,  H01L2924/00