公开(公告)号：EP3275295A1

公开(公告)日：2018-01-31

申请号：EP16714303.1

申请日：2016-03-21

Applicant: Sivantos Pte. Ltd.

Inventor： BEYFUSS, Stefanie ,  KRAL, Holger ,  FREELS, Björn ,  KUHN, Johannes

IPC: H05K3/28 ,  H01R25/00

CPC classification number: H05K3/341 ,  H04R25/00 ,  H04R25/60 ,  H05K3/0076 ,  H05K3/284 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2203/0228 ,  H05K2203/0557 ,  H05K2203/107

Abstract: The invention relates to a method (2) for manufacturing a circuit (4), in particular of a hearing aid (6), in which method (2) a printed circuit board (10) is made available with a first region (14) and with a second region (12) which are separated by means of a boundary (18). A component (24) is mounted on the printed circuit board (10), wherein the component (24) is positioned on the boundary (18). The first region (14) is covered by means of a mask (38) which has an edge (42), wherein the edge (42) is positioned on the component (24), and the printed circuit board (10) is provided with a coating (46). The coating (46) is cut away in the region of the component (24) and the mask (38) is removed.

公开(公告)号：EP3085211A1

公开(公告)日：2016-10-26

申请号：EP14795651.0

申请日：2014-11-10

Applicant: Robert Bosch GmbH

Inventor： LISKOW, Uwe

IPC: H05K3/34

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: For an electronic control module (1), in particular for a transmission controller, comprising a printed circuit board (5) with a component side (17), on which at least one contact area (13a) is arranged, and comprising at least one electrical component (20) with at least one electrical connection element (24) having a connection section (25) which runs parallel to the component side (17) of the printed circuit board (5) and is electrically connected to the at least one contact area (13a), it is proposed to arrange at least one adapter (30) on the printed circuit board (5), which adapter is independent of the at least one electrical component (20), is arranged as a separate part on the printed circuit board (5) and has a holding body (31) fastened to the printed circuit board (5) outside the at least one contact area (13a) and at least one metal web (34) which is arranged on the holding body (31) and has a contact section (35) running parallel to the component side of the printed circuit board, wherein the contact section (35) of the at least one metal web (34) and the connection section (25) of the at least one connection element (24) are arranged lying on top of one another in a covering area (50), as seen in a direction perpendicular to the printed circuit board, and are welded to one another in the covering area (50), and the at least one metal web (34) or the at least one connection element (24) makes electrical contact with the at least one contact area (13a) by means of an electrically conductive material (42) applied to the at least one contact area (13a).

Abstract translation: 电子控制模块包括印刷电路板和在电气部件。 电路板具有设置在元件侧的接触面积。 电气部件具有与平行于所述组件侧的连接部的运行的电连接元件，并电连接到接触区域。 一个适配器被布置在电气部件的电路基板unabhängig并且具有固定于所述电路板的接触面积和金属网以外的保持体。 幅材被设置在所述保持体，并且具有一个平行于元件侧面延伸的接触部。 接触部和连接部谎言在另一个顶上并且被焊接到彼此的覆盖区域。 网络或连接元件与通过在导电材料施加到所述接触区域的接触区域电接触。

公开(公告)号：EP3063697A1

公开(公告)日：2016-09-07

申请号：EP14789264.0

申请日：2014-10-24

Applicant: Ingenico Group

Inventor： PAVAGEAU, Stéphane ,  LAMBERT, Xavier

IPC: G06K7/00 ,  H05K1/02 ,  H05K3/12

CPC classification number: H05K1/0284 ,  B23K1/0016 ,  B23K2201/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

Abstract: The technique described relates to a support (38) entering into the fabrication of an electronic device, said support comprising at least one component to be protected (21) and at least one three-dimensional element (34, 35, 36) of height at least equal to the height of an electronic component, said three-dimensional element being disposed laterally opposite said at least one component to be protected (21). According to the technique described, said three-dimensional element (34, 35, 36) is chiefly constituted of a permanent assembling material (51).

公开(公告)号：EP2894953A1

公开(公告)日：2015-07-15

申请号：EP12884029.5

申请日：2012-09-10

Applicant: Meiko Electronics Co., Ltd.

Inventor： MATSUMOTO, Tohru ,  AOKI, Kentaro ,  TODA, Mitsuaki

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/03 ,  B32B37/02 ,  B32B37/06 ,  B32B38/004 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/188 ,  H05K3/0097 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T156/1052 ,  Y10T428/22

Abstract: The present invention provides a component-embedded substrate (1) formed by dividing a laminate which is formed by bonding a component (12) onto a conductive material (10) placed on a support (8); sequentially laminating an insulation material (18, 28) and a core substrate (20) each having a component avoiding hole (32) which avoids the component; and hot-pressing the laminate to allow the melted insulation material to flow into the component avoiding hole to thereby form an integrated laminate (2, 36), wherein the component-embedded substrate includes regulation means (16, 34, 32, 38) which limits the displacement of the core substrate slipping on the insulation material melted during the hot pressing.

Abstract translation: 本发明提供了一种通过将通过将部件（12）粘合到放置在支撑件（8）上的导电材料（10）而形成的层压体的方式形成的部件嵌入式基板（1）。 依次层叠绝缘材料（18,28）和芯基板（20），所述绝缘材料和芯基板（20）具有避免所述部件的部件避开孔（32）; 并且对所述层压体进行热压以使所述熔融绝缘材料流入所述部件避开孔，从而形成一体的层叠体（2,36），其中所述部件嵌入基板包括调节装置（16,34,32,38），所述调节装置 限制了在热压期间熔化的绝缘材料上的芯基板滑动的位移。

公开(公告)号：EP2280593B1

公开(公告)日：2012-09-12

申请号：EP10171258.6

申请日：2010-07-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Peterson, Corey A.

IPC: H05K3/34

CPC classification number: H05K3/3489 ,  B23K3/082 ,  H05K2201/10204 ,  H05K2203/0169 ,  H05K2203/162

公开(公告)号：EP2019574B1

公开(公告)日：2011-07-13

申请号：EP08013360.6

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Ohkawa, Hiroshige ,  Kawabata, Kenichi

IPC: H05K3/28

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.

公开(公告)号：EP1565045B1

公开(公告)日：2010-08-25

申请号：EP04425094.2

申请日：2004-02-12

Applicant: Askoll Holding S.r.l.

Inventor： Marioni, Elio

IPC: H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L23/40

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

公开(公告)号：EP1182919B1

公开(公告)日：2007-04-11

申请号：EP01119985.8

申请日：2001-08-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Uchiyama, Hiroshi ,  Hachimura, Tetsutarou ,  Okuda, Osamu ,  Yoshida, Noriaki

IPC: H05K13/08

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/09918 ,  H05K2201/10204

公开(公告)号：EP1558064A1

公开(公告)日：2005-07-27

申请号：EP03809438.9

申请日：2003-09-26

Applicant: Matsushita Electric Works, Ltd.

Inventor： KUMAGAI, Jun, MATSUSHITA ELECTRIC WORKS LTD. ,  KISHIMOTO, Akihiro, MATSUSHITA ELECTRIC WORKS LTD. ,  KONISHI, Hirofumi, MATSUSHITA ELECTRIC WORKS LTD.

IPC: H05B41/24 ,  H05B41/231 ,  H02M7/48 ,  H01F38/08 ,  H05K1/14 ,  F21V23/00

CPC classification number: H02M1/4208 ,  H02M7/53871 ,  H05B41/2883 ,  H05B41/2888 ,  H05K1/0254 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09972 ,  H05K2201/10196 ,  H05K2201/10204 ,  Y02B20/202 ,  Y02B20/204 ,  Y02B70/126

Abstract: A full bridge circuit including four switching elements (Q1 to Q4) is alternated with a high switching frequency and a series-connected resonance circuit (5) including an inductor (L2) and a capacitor (C2) is made to resonate at a switching frequency of the full bridge circuit multiplied by an integer (for example, frequency multiplied by three), thereby generating a high voltage pulse for start up. After a high-pressure discharge lamp (DL) is started up, the full bridge circuit is alternated with a low switching frequency so as to operate as a step-down chopper for inverting the output polarity, thereby stably supplying rectangular wave voltage of low frequency to the high-pressure discharge lamp (DL) via a filter circuit including an inductor (L1) and a capacitor (C1).

Abstract translation: 包括四个开关元件（Q1至Q4）的全桥电路以高开关频率交替，并且使包括电感器（L2）和电容器（C2）的串联谐振电路（5）以开关频率谐振 的全桥电路乘以整数（例如，频率乘以3），从而产生用于启动的高电压脉冲。 在高压放电灯（DL）启动之后，全桥电路以低开关频率交替运行，作为降压斩波器来反相输出极性，从而稳定地提供低频的矩形波电压 通过包括电感器（L1）和电容器（C1）的滤波器电路连接到高压放电灯（DL）。

公开(公告)号：EP1534052A2

公开(公告)日：2005-05-25

申请号：EP04078154.4

申请日：2004-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Ihms, David W. ,  Myers, Bruce A.

IPC: H05K1/02 ,  H01L23/00

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly (10) comprising a laminate substrate (12) and a surface mount device (18) having a CTE less than that of the laminate substrate (12) and attached with at least one solder joint (20) to a first surface (14) of the laminate substrate (12). The assembly (10) further includes a localized stiffener (24,124,224) attached to a second surface (16) of the laminate substrate (12) so as to be directly opposite the circuit device (18). The localized stiffener (24,124,224) is formed of a material and is shaped so that, when attached to the laminate substrate (12), the stiffener (24,124,224) is capable of increasing the thermal cycle fatigue life of the one or more solder joints (20) that attach the device (18) to the substrate (12).

Abstract translation: 一种电路板组件（10），包括一个层叠体的基材（12）和一个表面安装具有CTE小于层压基材（12）的装置（18）和与至少一个焊接接头（20）附连到第一表面 层叠基板（14）（12）。 该组件（10）包括附连到层压基材（12）的第二表面（16），以便直接在该电路装置（18）相对的局部此外加强件（24124224）。 局部加强件（24124224）形成的材料制成并且被成形为使得，当附连到层压基材（12），所述加强件（24124224）能够增加所述一个或多个焊接点的热循环疲劳寿命（20 ）那样附加装置（18）与基板（12）。