公开(公告)号：EP2587533A1

公开(公告)日：2013-05-01

申请号：EP12189184.0

申请日：2012-10-19

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Shimizu, Hiroshi ,  Kimura, Yasuyuki ,  Arai, Tadashi

IPC: H01L23/14 ,  H01L25/075

CPC classification number: H01L23/142 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K2201/09409 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate (1) includes a substrate (10), a first insulating layer (20) formed on the substrate (10), wiring patterns (30) formed on a first surface (R1) of the first insulating layer (20), and a second insulating layer (50) formed on the first surface (R1) of the first insulating layer (20). The second insulating layer (50) covers the wiring patterns (30) and includes a first opening (50X) that partially exposes adjacent wiring patterns (30) as a pad (CA). A projection (70) is formed in an outer portion of the substrate (10) located outward from where the first opening (50X) is arranged. The projection (70) rises in a thickness direction of the substrate (10).

Abstract translation: 的布线基板（1）包括形成在第一表面上的第一绝缘层的（R 1）（20）形成在所述基板的基板（10），一个第一绝缘层（20）（10），配线图案（30）， 和第二绝缘层（50）形成在所述第一表面上的第一绝缘层（20）的（R 1）上。 在第二绝缘层（50）覆盖所述配线图案（30）和包括第一开口（50X）做部分地暴露相邻布线图案（30），其为垫（CA）。 的突出物（70）形成在位于向外从所述第一开口（50X）设置在所述基板（10）的外部部分。 所述突出部（70）升起衬底（10）的厚度方向。

公开(公告)号：EP2360661A4

公开(公告)日：2013-01-02

申请号：EP09827400

申请日：2009-07-01

Applicant: SHARP KK

Inventor： MORIWAKI HIROYUKI

IPC: H05K3/36 ,  H01L23/498 ,  H01L27/02 ,  H01L27/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K3/361 ,  H01L23/49811 ,  H01L27/0203 ,  H01L27/12 ,  H01L27/124 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/025 ,  H05K1/113 ,  H05K3/323 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10128 ,  H01L2924/00

公开(公告)号：EP2529605A1

公开(公告)日：2012-12-05

申请号：EP11736612.0

申请日：2011-01-17

Applicant: BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

Inventor： XIE, Bingbin ,  PANG, Daocheng

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R13/03 ,  H01R13/04 ,  H01R13/113 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A contact piece of a gold finger comprises: a first main body segment; a second main body segment; and a transition segment connected to the first main body segment and the second main body segment, respectively, in a vertical direction, in which an upper edge and a lower edge of the transition segment are inclined with respect to a lateral direction respectively. A gold finger and a connector comprising the same are also provided.

公开(公告)号：EP2046442A2

公开(公告)日：2009-04-15

申请号：EP07809828.2

申请日：2007-06-21

Applicant: Second Sight Medical Products, Inc.

Inventor： GREENBERG, Robert, J. ,  TALBOT, Neil, Hamilton ,  NEYSMITH, Jordan ,  LITTLE, James S. ,  MECH, Brian V.

IPC: A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

公开(公告)号：EP1301062A3

公开(公告)日：2006-08-09

申请号：EP02021878.0

申请日：2002-09-30

Applicant: Sony Computer Entertainment Inc.

Inventor： Oka, Masaaki, Sony Computer Entertainment Inc.

IPC: H05K1/18 ,  H01L25/10 ,  G06F15/80 ,  G06F1/18

CPC classification number: H01L25/165 ,  H01L23/525 ,  H01L25/105 ,  H01L25/18 ,  H01L2225/1005 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

Abstract: To provide an electronic device on which semiconductor packages can be mounted efficiently. The electronic device comprises a board (1) that can receive a plurality of first semiconductor packages (P0-P8) each carrying a processor device and a plurality of second semiconductor packages (M0-M8) each carrying a memory device. Mount regions (3) where the packages are to be mounted and non-mount regions (4) are alternately arranged in rows and columns on the board (1). This ensures approximately equal wiring distances between the packages, allowing processor devices to access to memory devices at the same timing.

Abstract translation: 以提供在其上的半导体封装可被有效地安装电子装置。 该电子设备包括一个板（1）那样可以接收第一半导体封装（P0-P8）每个都带有处理器装置和第二半导体封装有多个（M0-M8）各自携带的存储器装置的复数。 将被安装安装区域（3），其中包和非安装区域（4）以行和列被交替地布置在板（1）。 这确保了包装之间大约等于布线距离，允许处理器设备在相同的定时存取存储器装置。

公开(公告)号：EP1219437B1

公开(公告)日：2005-09-07

申请号：EP01130240.3

申请日：2001-12-19

Applicant: SEIKO EPSON CORPORATION

Inventor： Ishizawa, Taku ,  Fukano, Takakazu ,  Saruta, Toshihisa

IPC: B41J2/175

CPC classification number: B41J2/17546 ,  B41J2/17503 ,  B41J2/17526 ,  B41J2/1753 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10159

公开(公告)号：EP1450405A2

公开(公告)日：2004-08-25

申请号：EP04002985.2

申请日：2004-02-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwang, Seong-Yong ,  Kang, Sung-Chul ,  Oh, Weon-Sik ,  Jeong, Cheol-Yong ,  Lee, Jin-Suk ,  Yoon, Ju-Young ,  Cho, Won-gu

IPC: H01L23/498 ,  H01L23/538

CPC classification number: G02F1/13452 ,  G02F2001/13456 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Abstract translation: 在驱动IC和具有该驱动IC的显示装置中，驱动IC包括设置在驱动IC的下表面上并沿着驱动IC的边缘排成多行的多个凸块。 在不同的行中排列的凸块在垂直于凸块对齐的方向的方向上并列。 因此，当使用各向异性导电膜将驱动IC安装在显示面板上时，各向异性导电膜可以平滑地流过由驱动IC的凸块限定的空间，从而改善驱动IC和显示装置的电特性。

公开(公告)号：EP1219149A1

公开(公告)日：2002-07-03

申请号：EP00951739.2

申请日：2000-08-10

Applicant: Ford Motor Company

Inventor： ACHARI, Achyuta ,  LI, Delin ,  BAKER, Jay, Deavis ,  NATION, Brenda, Joyce ,  TRUBLOWSKI, John

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K1/0293 ,  H05K1/117 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/053 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/4973 ,  Y10T29/49732

Abstract: An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article (10) includes: a flexible dielectric substrate (12) having first and second edges 14/16, and a plurality of conductive circuit traces (18) arranged on or within the substrate, wherein each of the traces extends from proximate the first edge (14) to proximate the second edge (16). Each of the circuit traces (18) includes: a first connection feature (20) disposed proximate the first edge (14); a second connection feature (22) disposed proximate the second edge (16); and at least one third connection feature (24) disposed between the first and second edges (14/16). Each of the first, second, and third connection features (20/22/24) is a plated through hole, a plated blind via, or a mounting pad. This article (10) may be used to connect together the first and second circuits (50/60) using the first and second connection features (20/22), such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article (10) may be cut so as to present a set of third connection features (24) to which a new replacement circuit may be connected.

公开(公告)号：EP0643440A2

公开(公告)日：1995-03-15

申请号：EP94203444.8

申请日：1992-06-03

Applicant: MOD-TAP W CORPORATION

Inventor： White, Rowland Spencer ,  Ivey, David Ernest ,  Jones, Keith Henry

IPC: H01R4/24 ,  H01R9/24

CPC classification number: H01R4/2429 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954

Abstract: An insulation displacement contact (10) comprises first and second contact portions each of which comprises a cantilevered split beam (19). The upper split beam, which receives insulated wires, comprises a pair of tynes (20,22) which are folded about the axis of a slot (25) separating the tynes such that the internal angle between the tynes is approximately 90°. The width of the tynes is larger than that of prior art devices resulting in increased stiffness and the length of the tynes is sufficiently long to receive two wires therebetween.
The contacts (10) are mounted in a housing which includes a plurality of teeth (90) provided with means for retaining lugs (32,34) on the end of the tynes to ensure bowed opening of the tynes on insertion of a wire. The contacts are arranged along the central axis (72) of the housing such that the folded tynes of alternate contacts extend on opposite sides of the central axis.

Abstract translation: 绝缘位移触点（10）包括第一和第二接触部分，每个接触部分包括悬臂分离梁（19）。 接收绝缘电线的上部开口梁包括一对围绕分隔台面的槽（25）的轴线折叠的台面（20,22），使得台面之间的内角约为90°。 台面的宽度大于现有技术装置的宽度，导致刚度增加，并且台面的长度足够长以在其间接收两根线。 触头（10）安装在包括多个齿（90）的壳体中，所述齿设置有用于将突耳（32,34）保持在触头的端部上的装置，以确保在插入电线时弓形打开。 触点沿外壳的中心轴线（72）布置，使得交替触点的折叠式触点在中心轴线的相对侧上延伸。

公开(公告)号：EP0593584A1

公开(公告)日：1994-04-27

申请号：EP92914485.0

申请日：1992-07-06

Applicant: MOD-TAP W CORPORATION

Inventor： WHITE, Rowland Spencer

IPC: H01R4 ,  H01R12 ,  H05K1 ,  H01R31 ,  H05K3

CPC classification number: H01R4/2429 ,  H01R12/721 ,  H01R24/62 ,  H01R31/06 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954 ,  Y10S439/922 ,  Y10S439/951

Abstract: Un système de connexions électriques, par exemple un tableau de connexions à face rabattables, comporte un profilé de support (12) recevant des premiers connecteurs (14) dont les contacts sont orientés vers l'extérieur du profilé (12). Un câble introduit entre le profilé et les connecteurs se divise en conducteurs individuels aboutissant à des contacts (34, 36) via des fentes (30) dans les parois du profilé. Un second connecteur (16) porte des prises de communications vocales ou de données classiques (19) qui sont reliées aux premiers connecteurs par l'intermédiaire de cartes de circuits imprimés (38) qui s'enfichent dans des fentes (40) des premiers connecteurs. Les connecteurs plats des cartes ont une discontinuité sur une surface, et une moitié du contact est reliée au contact sur l'autre face pour permettre une connexion directe entre les rangées de contacts supérieures (34) et inférieures (36) des premiers connecteurs dans une première position des seconds connecteurs, et permettre également un contact entre les rangées de contacts supérieures et inférieures et les prises classiques (19) dans une seconde position.