公开(公告)号：EP0330452A2

公开(公告)日：1989-08-30

申请号：EP89301733.5

申请日：1989-02-22

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Calhoun, Clyde D. c/o Minnesota Mining and ,  Fleming, Maurice J. c/o Minnesota Mining and ,  Foss, George D. c/o Minnesota Mining and ,  Renstrom, Richard L. c/o Minnesota Mining and

IPC: C09J7/02 ,  H01B1/00

CPC classification number: H01B1/22 ,  C09J7/20 ,  C09J9/02 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0278 ,  H05K2203/0338 ,  Y10S428/906 ,  Y10T428/1429 ,  Y10T428/2438 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 µm thick.

Abstract translation: 两个基板上的导电元件可以通过包含以预定图案单独定位在粘合剂层中的导电等轴晶粒的胶带电连接。 每个颗粒比要互连的元件更硬，从而手压使颗粒进入元件，从而产生可靠的电连接。 特别有用的颗粒是具有0.1至2μm厚的金属涂层的玻璃珠。

公开(公告)号：EP0223464A3

公开(公告)日：1989-02-22

申请号：EP86308471.1

申请日：1986-10-30

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. c/o Minnesota Mining and ,  Berg, James G. c/o Minnesota Mining and

IPC: H01R9/09 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/09945 ,  H05K2201/10242 ,  H05K2201/10378 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

Abstract: An anisotropically conductive polymeric matrix comprising a polymeric layer (6) having conductive members (5) extending substantially through the thickness thereof, said conductive members (5) comprising a coating of a conductive material, and a process for making same.

公开(公告)号：EP0180183A3

公开(公告)日：1987-09-23

申请号：EP85113697

申请日：1985-10-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Igarashi, Yutaka ,  Hiraoka, Masaru

IPC: H05K03/46

CPC classification number: H05K1/116 ,  H05K1/0287 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09945 ,  H05K2201/10689

Abstract: A multilayer printed wiring board comprises at least one layer with interlayer connection pattern (200, 300) at the basic grids. The interlayer connection pattern (200, 300) has a clearance (62, 204, 304) when a small diameter through hole (60B) is formed and has a land part (63, 205, 303) contacted to the through hole wall (61A) when a large diameter through hole (60A) is formed. In order to obtain interlayer connection or non-connection, the diameter of a through hole is varied.

公开(公告)号：EP0223464A2

公开(公告)日：1987-05-27

申请号：EP86308471.1

申请日：1986-10-30

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. c/o Minnesota Mining and ,  Berg, James G. c/o Minnesota Mining and

IPC: H01R9/09 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/09945 ,  H05K2201/10242 ,  H05K2201/10378 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

Abstract: An anisotropically conductive polymeric matrix comprising a polymeric layer (6) having conductive members (5) extending substantially through the thickness thereof, said conductive members (5) comprising a coating of a conductive material, and a process for making same.

Abstract translation: 包括具有基本上延伸穿过其厚度的导电构件（5）的聚合物层（6）的各向异性导电聚合物基体，所述导电构件（5）包括导电材料的涂层及其制造方法。

公开(公告)号：US20180092205A1

公开(公告)日：2018-03-29

申请号：US15614469

申请日：2017-06-05

Applicant: MC10, Inc.

Inventor： YUNG-YU HSU ,  JOHN WORK ,  KEVIN J. DOWLING

IPC: H05K1/02 ,  H01L23/538

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

公开(公告)号：US09844133B2

公开(公告)日：2017-12-12

申请号：US15363579

申请日：2016-11-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihiro Tomita ,  Koichi Hirano ,  Susumu Sawada ,  Koji Kawakita ,  Takashi Ichiryu ,  Masanori Nomura

IPC: H05K1/18 ,  H05K1/03

CPC classification number: H05K1/038 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/18 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2201/029 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

公开(公告)号：US20110095419A1

公开(公告)日：2011-04-28

申请号：US12909096

申请日：2010-10-21

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

IPC: H01L23/498 ,  H01L21/768 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K3/3436 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y02P70/613

Abstract: There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.

Abstract translation: 提供导电膜。 导电膜包括：阳极化层，其具有在其厚度方向上延伸穿过其中的多个通孔; 多个线状导体，各自形成在所述通孔中的对应的一个中，并且每个具有从所述阳极氧化层突出的第一和第二突起，其中所述第一突起和所述第二突起中的至少一个被涂覆材料覆盖; 以及形成在所述阳极氧化层上以覆盖所述第一和第二突起中的至少一个的未固化的热固性树脂层。

公开(公告)号：US20100294552A1

公开(公告)日：2010-11-25

申请号：US12777605

申请日：2010-05-11

Applicant: Tsuyoshi KOBAYASHI ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

Inventor： Tsuyoshi KOBAYASHI ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

IPC: H05K1/16

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/305 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.

Abstract translation: 一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底 材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。 芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

公开(公告)号：US20050057906A1

公开(公告)日：2005-03-17

申请号：US10937422

申请日：2004-09-10

Applicant: Seiichi Nakatani ,  Tousaku Nishiyama

Inventor： Seiichi Nakatani ,  Tousaku Nishiyama

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/368 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01R12/523 ,  H05K1/0268 ,  H05K3/20 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4694 ,  H05K2201/09945 ,  H05K2201/09972 ,  H05K2201/10378 ,  Y10T29/49126

Abstract: There is provided a connector sheet which includes an insulation sheet substrate having a front surface and a rear surface opposing to the front surface, and electrically conductive members each passing through the sheet substrate along a thickness direction of the sheet substrate, and the front surface and the rear surface contain a thermoset resin, and have tackiness under a first condition and develop adhesiveness under a second condition which is different from the first condition.

Abstract translation: 提供了一种连接器片，其包括具有与前表面相对的前表面和后表面的绝缘片基片和沿着片基片的厚度方向穿过片基片的导电部件，以及前表面和 后表面含有热固性树脂，并且在第一条件下具有粘性并且在与第一条件不同的第二条件下产生粘附性。

公开(公告)号：US6680534B2

公开(公告)日：2004-01-20

申请号：US97494701

申请日：2001-10-10

Applicant: MICRON TECHNOLOGY INC

Inventor： KINSMAN LARRY D

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/46 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

Abstract translation: 本发明涉及一种用于连接放置在电路板的相对侧上的集成电路的装置和方法，该集成电路通过利用嵌入电路板中的导电元件并从板的一个表面延伸到另一个表面。 导电迹线沿着电路板的表面从导电元件延伸到集成电路。 导电迹线可以由多个导电层形成。