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公开(公告)号：KR1020100095308A
公开(公告)日：2010-08-30
申请号：KR1020090014518
申请日：2009-02-20
Applicant: 성균관대학교산학협력단 , 삼성전기주식회사
Abstract: PURPOSE: A thin film embedded resistor prepared using a ceramic-metal nano-composite is provided to increase the integration of a circuit, thereby allowing a user to implement a fine pitch member. CONSTITUTION: An oxidation silicon - platinum nano-composite is deposited on a substrate to distribute platinum particle inside a matrix. The oxidation silicon - platinum nano-composite has an atomic ratio of 67:33 or 42:58 of oxidation silicon and platinum, respectively. The size of the platinum particles distributed within the oxidation silicon matrix is 3-5 nm. The thin film embedded register has 3K at a TCR of 100 ppm.
Abstract translation: 目的：提供使用陶瓷 - 金属纳米复合材料制成的薄膜嵌入式电阻器，以增加电路的集成度，从而允许使用者实现细间距元件。 构成：将氧化硅 - 铂纳米复合材料沉积在基底上以将铂颗粒分布在基体内。 氧化硅 - 铂纳米复合材料的氧化硅和铂的原子比分别为67:33或42:58。 分布在氧化硅基质中的铂颗粒的尺寸为3-5nm。 薄膜嵌入寄存器在TCR为100ppm时具有3K。
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公开(公告)号：KR100924818B1
公开(公告)日：2009-11-03
申请号：KR1020070115693
申请日：2007-11-13
Applicant: 성균관대학교산학협력단
IPC: H01L21/60
Abstract: 본 발명은 반도체 패키징에 이용되는 마이크로 솔더볼 제조방법에 관한 것이며, 보다 상세하게는 제조가 매우 용이할 뿐만 아니라 균일한 사이즈의 솔더볼을 제조할 수 있는 솔더볼 제조방법에 관한 것이다.
이에, 본 발명의 솔더볼 제조방법은, 솔더 및 상기 솔더와의 젖음성이 낮은 기판을 준비하는 단계; 상기 기판 위에 마스크층을 형성하는 마스크층 형성단계; 상기 마스크층을 패터닝하여 홈을 형성하는 단계; 상기 마스크층의 홈에 솔더를 도금하는 솔더 도금단계; 상기 마스크층을 제거하는 마스크층 제거 단계; 상기 솔더를 가열함으로써 솔더볼을 형성하는 단계; 및 상기 솔더볼을 기판에서 분리시키는 솔더볼 분리단계를 포함하여 이루어진다.
반도체패키징, 솔더볼, 젖음성, Sn-Ag-
公开(公告)号：KR1020090021976A
公开(公告)日：2009-03-04
申请号：KR1020070086924
申请日：2007-08-29
Applicant: 성균관대학교산학협력단
IPC: H05K3/06
CPC classification number: H05K3/184 , H05K1/118 , H05K3/0079 , H05K3/188
Abstract: A manufacturing method of flexible printed circuit board is provided to prevent generation of harmful residual product due to etching of a metal film by selectively forming the metal film on a base substrate through a removal of a mask film. A mask film(12) is formed on a base substrate, and is a photosensitive film. A part of the base substrate is exposed. A seed metal film(16) is formed on an exposed base substrate and the mask film by a metal deposition method, and is a composite metal film or an alloy film. A metal film(18) is formed on the seed metal film by a copper electroplating or a copper electroless plating. The mask film is removed. The seed metal film and the metal film of the mask film are removed. A conductive pattern is formed on the base substrate, and is made of the seed metal film and the metal film.
Abstract translation: 提供柔性印刷电路板的制造方法，以通过去除掩模膜在基底基板上选择性地形成金属膜来防止由于金属膜的蚀刻而产生的有害残留物。 掩模膜（12）形成在基底基板上，并且是感光膜。 露出基底衬底的一部分。 通过金属沉积法在暴露的基底基板和掩模膜上形成种子金属膜（16），并且是复合金属膜或合金膜。 通过铜电镀或铜化学镀在种子金属膜上形成金属膜（18）。 去除掩模膜。 除去种子金属膜和掩模膜的金属膜。 在基底基板上形成导电图案，由种子金属膜和金属膜构成。
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公开(公告)号：KR100878947B1
公开(公告)日：2009-01-19
申请号：KR1020070078745
申请日：2007-08-06
Applicant: 삼성전기주식회사 , 성균관대학교산학협력단
CPC classification number: H01L2224/11 , H01L2924/00012
Abstract: A solder bump and manufacturing method thereof are provided to draw crack propagation route by shear stress by expanding contact dimension of copper post and solder. A solder bump includes a metal post(2) of clobber shape having rounding shape formed on a metal layer(6) of electronic component. A solder ball(4) of ball shape totally surrounding the metal post is formed on the metal post. The metal post is formed on the metal layer of the electronic component through an electro-plating process. The metal layer is a circuit pattern formed in a wafer level package or printed circuit board. A gold plating layer(12) is formed on the metal layer to protect the metal layer.
Abstract translation: 提供了一种焊料凸块及其制造方法，通过扩大铜柱和焊料的接触尺寸，通过剪切应力拉伸裂纹扩展路径。 焊料凸块包括形成在电子部件的金属层（6）上的具有圆形形状的金属柱（2）。 在金属柱上形成完全围绕金属柱的球形的焊球（4）。 金属柱通过电镀工艺形成在电子部件的金属层上。 金属层是形成在晶片级封装或印刷电路板中的电路图案。 在金属层上形成镀金层（12）以保护金属层。
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公开(公告)号：KR101013434B1
公开(公告)日：2011-02-14
申请号：KR1020080029203
申请日：2008-03-28
Applicant: 성균관대학교산학협력단
Abstract: 본 발명은 전자파 차폐필터의 제조방법 및 전자파 차폐필터의 구조에 관한 것으로, 본 발명에 따른 전자파 차폐필터의 제조방법은, 절연되는 투명재질을 가지며, 상부면에 일정깊이 및 일정폭으로 메쉬(mesh) 구조의 리세스(recess)가 형성된 베이스 기판을 형성하는 단계와; 상기 베이스 기판의 상부면에 제1도전물질을 증착하여 제1도전막을 형성하는 단계와; 상기 베이스 기판을 일정각도로 기울인 상태에서 회전상태로 드라이 에칭공정을 실시하여, 상기 리세스의 바닥면과 측면 일부, 또는 상기 리세스의 바닥면을 제외한 나머지 부분의 상기 제1도전막을 제거하는 단계와; 상기 리세스의 바닥면에 남아있는 상기 제1도전막을 시드층(seed layer)으로 하여, 제2도전물질이 상기 리세스의 내부를 채우도록 전기도금공정을 수행하는 단계를 구비한다. 본 발명에 따르면, 별도의 포토공정이 없이 베이스 기판을 기울여서 에칭공정을 수행하고 전기도금 공정을 수행함에 의해 간단하면서도 질적으로 우수한 전자파 차폐필터를 제조할 수 있는 효과가 있다.
전자파, 차폐, 필터, 임프린트, 전기도금, 이온에칭-
Patent Agency Ranking
公开(公告)号：KR1020090124700A
公开(公告)日：2009-12-03
申请号：KR1020080051056
申请日：2008-05-30
Applicant: 성균관대학교산학협력단
IPC: H01L21/28
CPC classification number: Y02P80/30 , H01L21/76873 , H01L21/2885 , H01L21/76865
Abstract: PURPOSE: A fabrication method of electrode for selective plating process is provided to selectively form the plating electrode on the groove by removing the seed layer. CONSTITUTION: The metal seed layer(20) is formed in the substrate(10) surface in which groove is formed. The roller(30) is close to the surface of the substrate in which the metal seed layer is formed to remove the metal seed layer. The roller is arranged in the upper side and lower side of the substrate. The distance between the up-down rollers can be controlled. The speed of rotation of roller can be controlled. The material of roller is rubber.
Abstract translation: 目的：提供一种用于选择性电镀工艺的电极的制造方法，通过去除种子层来选择性地在沟槽上形成电镀电极。 构成：金属种子层（20）形成在形成有槽的基板（10）表面中。 辊（30）靠近形成有金属种子层的基板的表面以去除金属种子层。 辊布置在基板的上侧和下侧。 可以控制上下辊之间的距离。 可以控制滚筒的旋转速度。 辊子的材料是橡胶。
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公开(公告)号：KR1020090098538A
公开(公告)日：2009-09-17
申请号：KR1020080023992
申请日：2008-03-14
Applicant: 성균관대학교산학협력단
IPC: C25D3/38
CPC classification number: C25D3/38
Abstract: A method for releasing deposit stress in Cu electroplating and a Cu plating bath using the same are provided to remove electroplating stress generated on a Cu deposition layer by applying an additive to the Cu plating bath for electroplating. A method for releasing deposit stress in Cu electroplating comprises the steps of preparing a cathode and an anode and a Cu plating bath, applying an additive for releasing electroplating stress to the Cu plating bath, dipping the cathode and the anode in the Cu plating bath, applying direct current density of 20mA/cm^2 between the anode and the cathode at the room temperature, and performing Cu electroplating until the thickness of the deposited copper has reached about 5~6mum. The additive includes thiourea of 0.0002~0.0006M. The Cu plating bath is mainly composed of copper sulfate and copper.
Abstract translation: 提供了一种用于释放Cu电镀中的沉积应力的方法和使用其的Cu电镀浴，以通过向用于电镀的Cu电镀浴中施加添加剂来除去在Cu沉积层上产生的电镀应力。 一种用于在Cu电镀中释放沉积应力的方法包括以下步骤：制备阴极和阳极以及镀铜浴，向Cu镀浴施加用于释放电镀应力的添加剂，将阴极和阳极浸入Cu镀浴中， 在室温下在阳极和阴极之间施加20mA / cm 2的直流电流密度，并执行Cu电镀，直到沉积的铜的厚度达到约5〜6μm。 添加剂包括0.0002〜0.0006M的硫脲。 镀铜浴主要由硫酸铜和铜组成。
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公开(公告)号：KR100878916B1
公开(公告)日：2009-01-15
申请号：KR1020070094273
申请日：2007-09-17
Applicant: 삼성전기주식회사 , 성균관대학교산학협력단
CPC classification number: H01L2224/11 , H01L2924/3651
Abstract: A solder bump is provided to prevent mechanical strength of the solder bump from decreasing by sequentially forming a copper post, silver plating layers and tin plating layers, thereby suppressing the production of Ag3Sn that is an intermetallic compound produced on an interface of the copper post and a solder. A solder bump(30) comprises a copper post(2), silver plating layers(4,8), and tin plating layers(6,10). The copper post is formed on a metal layer(12) forming an electronic component through the electroplating process. The silver plating layers and tin plating layers are sequentially formed on the copper post. The metal layer means a circuit pattern formed on a printed circuit board or a wafer level package. The solder bump further comprises a gold plating layer(14) formed between the metal layer and the copper post.
Abstract translation: 提供了一种焊料凸块以通过顺序地形成铜柱，镀银层和镀锡层来防止焊料凸块的机械强度降低，由此抑制作为在铜柱的界面上产生的金属间化合物的Ag 3 Sn的产生 焊锡 焊料凸块（30）包括铜柱（2），镀银层（4,8）和镀锡层（6,10）。 铜柱通过电镀工艺形成在形成电子部件的金属层（12）上。 镀铜层和镀锡层依次形成在铜柱上。 金属层是指形成在印刷电路板或晶片级封装上的电路图案。 焊料凸块还包括形成在金属层和铜柱之间的镀金层（14）。
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公开(公告)号：KR101152266B1
公开(公告)日：2012-06-08
申请号：KR1020100025448
申请日：2010-03-22
Applicant: 성균관대학교산학협력단
IPC: H05K9/00
Abstract: 본발명은동박적층필름상에포토리소그래피공정을통해포토레지스트를사용하여도트형태의패턴을형성하는단계; 상기동박적층필름상에형성된도트형태의패턴에연자성체를도금하는단계; 상기연자성체를도금한후 포토레지스트를제거하는단계; 및상기단계를거쳐도트형태로연자성체가도금된동박적층필름의구리층을에칭액을사용하여에칭하는단계를포함하는동박적층필름을이용한전자파흡수시트의제조방법에관한것이다. 본발명은전자파흡수시트를제조함에있어롤투롤방식을이용한연속제조공정이가능하며, 전자파흡수시트를플렉서블하고현재상용화된제품에비해두께를현저히얇게제조할수 있는동박적층필름을이용한전자파흡수시트의제조방법을제공한다.
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公开(公告)号：KR1020100104484A
公开(公告)日：2010-09-29
申请号：KR1020090022927
申请日：2009-03-18
Applicant: 성균관대학교산학협력단
CPC classification number: H01L2224/11472 , H01L2224/11906 , H01L2224/131 , H01L2224/45 , H01L2224/45147 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/10253 , H01L2224/48 , H01L2924/00012
Abstract: PURPOSE: The manufacturing method of the free lead solder bump in which the mechanical reliability is improved is that solder the front side of the formed copper post is the capping is formed in substrate. The resistance about the shear stress is increased. CONSTITUTION: A copper wire(2) is formed on the substrate(1). The photoresist layer(3) is formed on the copper wire. According to the pattern of the photoresist layer, the copper post(5) is formed on the copper wire. The photoresist layer(4) is formed in order to have the pattern of the same diameter as the diameter of the bottom part of the copper post. The solder(10) is formed so that the frontal face of upper part of the copper post be capped.
Abstract translation: 目的：提高机械可靠性的自由铅焊料凸块的制造方法是在基板上形成形成铜柱的前侧的焊料为封盖。 关于剪切应力的阻力增加。 构成：在基板（1）上形成铜线（2）。 光致抗蚀剂层（3）形成在铜线上。 根据光致抗蚀剂层的图案，铜柱（5）形成在铜线上。 形成光致抗蚀剂层（4）以具有与铜柱的底部的直径相同直径的图案。 焊料（10）被形成为使得铜柱的上部的正面被盖住。
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