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公开(公告)号：KR1020090103434A
公开(公告)日：2009-10-01
申请号：KR1020080029048
申请日：2008-03-28
Applicant: 제일모직주식회사
IPC: C09J7/00
CPC classification number: C09J201/06 , C08L63/00 , C09J9/00 , C09J11/04 , C09J11/06 , C09J11/08 , C09J161/06 , C09J201/08 , C09J2203/326
Abstract: PURPOSE: An adhesive film composition for a semiconductor assembly is provided to suppress the generation of burr in dicing by controlling storage modulus before hardening and to prevent damage of products caused by chip crack generated by chipping. CONSTITUTION: An adhesive film composition for a semiconductor assembly includes an elastomeric resin, a film-forming resin, an epoxy-based resin, a phenol hardener, a curing catalyst, a silane coupling agent and inorganic filler. The elastomeric resin contains a hydroxyl group or carboxy group, and an epoxy group. The adhesive film is formed by the composition. A Dicing Die Bonding Film is such that a tackifier layer(2) and an adhesive layer(3) on a base film.
Abstract translation: 目的：提供一种用于半导体组件的粘合膜组合物，用于通过控制硬化前的储能模量来抑制切割中的毛刺产生，并且防止由于碎裂而产生的切屑产生的产品损坏。 构成：用于半导体组件的粘合膜组合物包括弹性体树脂，成膜树脂，环氧基树脂，酚固化剂，固化催化剂，硅烷偶联剂和无机填料。 弹性体树脂含有羟基或羧基，和环氧基。 粘合膜由该组合物形成。 切割片接合膜是使基底膜上的增粘剂层（2）和粘合剂层（3）。
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公开(公告)号：KR1020090065669A
公开(公告)日：2009-06-23
申请号：KR1020070133086
申请日：2007-12-18
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J7/38 , C09J163/00 , C09J183/04 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L21/6836 , H01L24/28
Abstract: An adhesive film composition for the assembly of a semiconductor is provided to increase the releasing of an adhesive film for preventing the fixation between films and to lower peel strength. An adhesive film composition for the assembly of a semiconductor comprises the modified silicone oil represented by the formula 1, an elastomeric resin containing a hydroxyl group or a carboxy group, a thermoplastic resin, an epoxy-based resin, a phenol curing agent, a curing catalyst, a silane coupling agent and a filler.
Abstract translation: 提供了用于组装半导体的粘合膜组合物以增加用于防止膜之间的固定的粘合剂膜的释放并降低剥离强度。 用于组装半导体的粘合膜组合物包含由式1表示的改性硅油，含有羟基或羧基的弹性体树脂，热塑性树脂，环氧基树脂，酚固化剂，固化 催化剂，硅烷偶联剂和填料。
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公开(公告)号：KR100831153B1
公开(公告)日：2008-05-20
申请号：KR1020060104450
申请日：2006-10-26
Applicant: 제일모직주식회사
IPC: C09J183/04 , C09J183/00 , C09J163/00 , C09J7/00
CPC classification number: B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
Abstract: 본 발명은 수산기, 카르복시기, 에폭시기를 함유하는 엘라스토머 수지; 0~200 ℃범위의 유리전이온도(Tg)를 갖는 필름형성 수지; 에폭시 수지; 화학식 1로 표시되는 페놀 수지; 경화촉진제; 실란 커플링제; 및 무기 충진제를 포함하는 것을 특징으로 하는 반도체 조립용 접착필름 조성물에 관한 것으로, 이를 이용하여 제조한 접착필름은 고신뢰성과 장기 보존안정성을 제공한다.
반도체 조립용 접착필름, 고 신뢰성, 경화촉진제, 에폭시수지, 내리플로우성, 내온도사이클성, 내습성, 다이쉐어강도, 저장성-
公开(公告)号：KR100800214B1
公开(公告)日：2008-02-01
申请号：KR1020060127293
申请日：2006-12-13
Applicant: 제일모직주식회사
IPC: C09J123/00 , C09J163/00 , C09J7/02
CPC classification number: H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083 , C09J167/02 , C09J7/00 , C09J163/00 , C09J2203/326
Abstract: An adhesive film composition for the assembly of semiconductor, an adhesive film formed form the composition, and an adhesive containing the film are provided to improve adhesive strength to a wafer and to minimize the generation of bubble during attaching process. An adhesive film composition comprises a polyester-based adhesion improving resin; an elastomer resin containing a hydroxyl group, a carboxyl group or an epoxy group; an epoxy group; a phenolic epoxy resin curing agent; at least one material selected from the group consisting of a latent catalytic curing agent and a curing catalyst; a silane coupling agent; and a filler. Preferably the polyester-based adhesion improving resin has a softening point of 0-200 deg.C and a weight average molecular weight of 200-1,000,000; and the elastomer has a weight average molecular weight of 500-5,000,000.
Abstract translation: 提供用于组装半导体的粘合剂膜组合物，由组合物形成的粘合剂膜和包含该膜的粘合剂，以提高对晶片的粘合强度并且在附着过程中最小化气泡的产生。 粘合膜组合物包含聚酯类粘合改善树脂; 含有羟基，羧基或环氧基的弹性体树脂; 环氧基; 酚醛环氧树脂固化剂; 选自由潜催化固化剂和固化催化剂组成的组中的至少一种材料; 硅烷偶联剂; 和填料。 优选地，聚酯类粘合改进树脂的软化点为0-200℃，重均分子量为200-1,000,000; 弹性体的重均分子量为500〜500,000。
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公开(公告)号：KR1020140140839A
公开(公告)日：2014-12-10
申请号：KR1020130061739
申请日：2013-05-30
Applicant: 제일모직주식회사
CPC classification number: H01L23/3737 , H01L21/4882 , H01L23/3121 , H01L23/36 , H01L25/0657 , H01L2224/16145 , H01L2224/45139 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2924/181 , Y10T428/2848 , H01L2924/00 , H01L2224/45099 , H01L2924/01049 , H01L2924/01004 , H01L2924/00012 , C09J7/38 , C09J7/22 , C09J9/00 , C09J2201/602 , C09J2201/606 , C09J2201/622 , C09J2203/326 , H01L21/6836 , H01L24/26 , H01L2021/60015 , H01L2221/68327
Abstract: 본 발명은 열전도성 입자를 포함하고, 반도체 소자를 몰딩하는 보호층 및 상기 보호층 상에 형성된 방열 금속층 사이에 위치하여 상기 보호층과 방열 금속층을 접착시키고, 상기 보호층 및 상기 방열 금속층과의 접착력이 각각 3kgf/25mm
2
이상인 방열 접착 필름, 이를 포함하는 반도체 장치 및 상기 반도체 장치의 제조 방법에 관한 것이다.Abstract translation: 本发明涉及一种用于辐射热量的粘合膜，其包括导热颗粒，其位于模制半导体器件的保护层和形成在保护层上的散热金属层之间，以将保护层和散热金属层 ，并且具有对保护层和散热金属层的粘合力分别为3kgf / 25mm ^ 2或更大的粘合剂，包括其的半导体器件及其制造方法。
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Patent Agency Ranking
公开(公告)号：KR1020140084829A
公开(公告)日：2014-07-07
申请号：KR1020120154761
申请日：2012-12-27
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J133/04 , C09J163/00 , H01L21/02
CPC classification number: C09J7/35 , C09J7/22 , C09J7/30 , C09J133/04 , C09J163/00 , C09J2201/61 , C09J2203/326 , H01L21/0201 , H01L21/6836
Abstract: The present invention relates to an adhesive film for semiconductor which has low contents of non-reactive small molecules and high heat resistance, thereby thermal decomposition of compositions at high temperature is inhibited; and has enhanced reliability, thereby being used under high temperature bonding condition. Specifically, the present invention relates to an adhesive film for semiconductor which comprises an acryl binder, an epoxy resin, a phenol resin and poly(phenylene ether), and includes an adhesive layer which has 1% or less of weight reduction rate by thermogravimetric analysis at 300°C; and to a semiconductor device with enhanced reliability using the adhesive film.
Abstract translation: 本发明涉及一种低反应性小分子含量低，耐热性高的半导体用粘合膜，能够抑制高温下的组合物的热分解。 并且具有增强的可靠性，从而在高温接合条件下使用。 具体而言，本发明涉及一种包含丙烯酸粘合剂，环氧树脂，酚醛树脂和聚（苯醚）的半导体用粘合膜，并且包括通过热重分析法具有1重量％以下的重量减少率的粘合剂层 在300℃; 以及使用粘合膜的具有增强的可靠性的半导体器件。
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公开(公告)号：KR101033045B1
公开(公告)日：2011-05-09
申请号：KR1020090134713
申请日：2009-12-30
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J7/02 , H01L21/58
CPC classification number: C09J163/00 , C08L33/04 , C08L61/06 , C08L2205/03 , Y10T428/31515 , C09J7/00 , C09J2203/326
Abstract: PURPOSE: A bonding film composition for a semiconductor assembly is provided to improve void removal ability and to enable stable wire bonding by controlling a curing reaction heat generation start temperature and the viscosity after curing. CONSTITUTION: A bonding film composition for a semiconductor assembly includes a polymer binder resin, epoxy-based resin, phenol type epoxy hardener, curing catalyst, silane coupling agent and inorganic filler. The curing reaction heat generation start temperature is 300 °C or greater. The melting point at 175 °C after curing at 150 °C for 1 hour and the melting point at 175 °C after curing at °C for 2 hours is 1.0×10^5 - 5.0×10^6 poise.
Abstract translation: 目的：提供一种用于半导体组件的接合膜组合物，以通过控制固化反应发热开始温度和固化后的粘度来提高空隙去除能力并实现稳定的引线接合。 构成：用于半导体组合物的接合膜组合物包括聚合物粘合剂树脂，环氧基树脂，酚型环氧固化剂，固化催化剂，硅烷偶联剂和无机填料。 固化反应发热开始温度为300℃以上。 在150℃下固化1小时后，175℃下的熔点为175℃，在2℃下固化2小时后的熔点为1.0×10 ^ 5〜5.0×10 ^ 6泊。
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公开(公告)号：KR100996349B1
公开(公告)日：2010-11-23
申请号：KR1020070078527
申请日：2007-08-06
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
Abstract: 본 발명은 페녹시수지; 수산기, 에폭시기를 함유하는 엘라스토머 수지; 에폭시계 수지; 페놀형 에폭시 수지 경화제 또는 방향족 아민계 경화제; 잠재성 촉매형 경화제 및 경화촉매로 이루어진 군으로부터 선택된 1종 이상의 물질; 실란 커플링제;및 충진제를 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물에 관한 것으로서, 본 발명의 반도체 조립용 접착 필름 조성물은 페녹시 수지를 함유함으로써 웨이퍼와 웨이퍼 혹은 PCB와의 부착력이 우수하고, 인장 모듈러스 향상으로 점착층과의 픽업성을 유리하게 하고, 열가소성 성질로 인하여 다이 어태치 공정시 발생하는 기포를 최소화할 뿐만 아니라 PCB 기판과 같은 거친 표면을 메우는 효과가 우수하기 때문에높은 신뢰성을 확보할 수 있는 반도체 조립용 접착 필름을 제공할 수 있다.
반도체 조립용 접착 필름, 에폭시기 함유형 엘라스토머 수지, 에폭시계 수지, 페놀계 혹은 아민형 경화제, 이미다졸계 경화촉매, 실란 커플링제.-
公开(公告)号：KR1020100066789A
公开(公告)日：2010-06-18
申请号：KR1020080125261
申请日：2008-12-10
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J11/00
CPC classification number: C09J11/06 , C09J9/00 , C09J11/00 , C09J133/00 , C09J161/06 , C09J163/00 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for a semiconductor device is provided to prevent the reliability of a semiconductor chip from getting fallen due to transition metal or transition metal ions and to enhance the reliability by increasing the tensile strength of a film. CONSTITUTION: An adhesive composition for a semiconductor device comprises: a polymer binder including a monomer with a transition metal-capturing group; an epoxy resin; a phenolic curable resin; a curing catalyst; a silane coupling agent; and a filler. The transition metal-capturing group oxidizes or reduces transition metal or hinders the mobility of the transition metal. The transition metal-capturing group includes one or more which are selected from -CN, -COOH, -NCO, -SH, or -NH.
Abstract translation: 目的：提供一种用于半导体器件的粘合剂组合物，以防止半导体芯片由于过渡金属或过渡金属离子而导致的可靠性降低，并且通过增加膜的拉伸强度来提高可靠性。 构成：用于半导体器件的粘合剂组合物包括：包含具有过渡金属捕获基团的单体的聚合物粘合剂; 环氧树脂; 酚醛树脂; 固化催化剂; 硅烷偶联剂; 和填料。 过渡金属捕获基团氧化或还原过渡金属或阻碍过渡金属的迁移率。 过渡金属捕获基团包括选自-CN，-COOH，-NCO，-SH或-NH中的一种或多种。
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公开(公告)号：KR1020090057697A
公开(公告)日：2009-06-08
申请号：KR1020070124393
申请日：2007-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J163/00 , C09J183/04 , C09J2203/326
Abstract: A bonding film composition for a semiconductor assembly is provided to prevent separation or curling of an adhesive film caused by frictional heat generating in a dicing process of a semiconductor. A bonding film composition for a semiconductor assembly comprises, based on whole solid 100.0 parts by weight of the composition, an elastomer resin -60 parts by weight containing a hydroxyl group, carboxyl group or epoxy group; a film-forming resin 5-60 parts by weight; an epoxy resin 5-40 parts by weight; a phenol type epoxy hardener 10-30 parts by weight; a curing catalyst 0.01-10 parts by weight; a silane coupling agent 0.01-10 parts by weight; filler 3-60 parts by weight; and thermal stabilizer 0.01-5 parts by weight.
Abstract translation: 提供了一种用于半导体组件的接合膜组合物，用于防止在半导体的切割工艺中由摩擦发热引起的粘合膜的分离或卷曲。 用于半导体组合物的粘合膜组合物包含基于100.0重量份组合物的全固体，含有羟基，羧基或环氧基的-60重量份弹性体树脂; 5-60重量份的成膜树脂; 环氧树脂5-40重量份; 酚类环氧固化剂10-30重量份; 固化催化剂0.01-10重量份; 硅烷偶联剂0.01-10重量份; 填料3-60重量份; 和热稳定剂0.01-5重量份。
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