公开(公告)号：CA1253660A

公开(公告)日：1989-05-09

申请号：CA498315

申请日：1985-12-20

Applicant: IBM

Inventor： REDDY SRINIVASA S N

IPC: C03C17/06 ,  C03C27/04 ,  C04B37/02 ,  C04B41/51 ,  C04B41/88 ,  H01B1/16 ,  H05K1/09 ,  C03C4/14 ,  H01B1/08

Abstract: PATENT Copper Conductive Composition Capable of Bonding To Ceramic And Glass A Conductive metal paste composition that includes Cu particles which exhibits excellent adhesion to ceramic, glass, or glass-ceramic surfaces. The improved adhesion is achieved by including in the paste Cu particles, an organic vehicle, and a eutectic composition of Cu20 and P205 which bonds to the Cu and the oxides of the ceramic and glass, when fired. The method of forming the metal paste composition includes the steps of forming a particulate material of a eutectic composition of Cu20 and P205, and combining the eutectic material with Cu particles and an organic vehicle. FI9-84-013

公开(公告)号：ES2166506T3

公开(公告)日：2002-04-16

申请号：ES97304018

申请日：1997-06-10

Applicant: IBM

Inventor： REDDY SRINIVASA S N ,  KNICKERBOCKER JOHN ULRICH ,  WALL DONALD RENE

IPC: C23C16/08 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H05K3/24

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces (32, 34) which are capable of receiving nickel or alloys thereof, using an Iodide source (23), preferably an Iodide salt, such as, Copper Iodide.

公开(公告)号：AT209263T

公开(公告)日：2001-12-15

申请号：AT97304018

申请日：1997-06-10

Applicant: IBM

Inventor： REDDY SRINIVASA S N ,  KNICKERBOCKER JOHN ULRICH ,  WALL DONALD RENE

IPC: C23C16/08 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H05K3/24

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces (32, 34) which are capable of receiving nickel or alloys thereof, using an Iodide source (23), preferably an Iodide salt, such as, Copper Iodide.

公开(公告)号：DE68915354T2

公开(公告)日：1994-11-24

申请号：DE68915354

申请日：1989-06-08

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  KNICKERBOCKER SARAH HUFFSMITH ,  KUMAR ANANDA HOSAKERE ,  NMN NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA S N

IPC: C04B35/64 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48 ,  H05K3/46 ,  C04B35/00

Abstract: There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

公开(公告)号：CA2072727A1

公开(公告)日：1993-03-11

申请号：CA2072727

申请日：1992-06-29

Applicant: IBM

Inventor： AOUDE FARID Y ,  DAVID LAWRENCE D ,  DIVAKARUNI RENUKA S ,  FAROOQ SHAJI ,  HERRON LESTER W ,  LASKY HAL M ,  MASTREANI ANTHONY ,  NATARAJAN GOVINDARAJAN ,  REDDY SRINIVASA S N ,  SURA VIVEK M ,  VALLABHANENI RAO V ,  WALL DONALD R

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02

Abstract: FI9-90-027 COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.