公开(公告)号：DE102009029870A1

公开(公告)日：2010-02-18

申请号：DE102009029870

申请日：2009-06-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  ESCHER-POEPPEL IRMGARD

IPC: H01L21/60 ,  H01L23/50

公开(公告)号：DE10232788B4

公开(公告)日：2010-01-14

申请号：DE10232788

申请日：2002-07-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  BERGMANN ROBERT ,  HONG HENG WAN JENNY

IPC: H01L23/06 ,  H01L21/50 ,  H01L23/057 ,  H01L23/16 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50

Abstract: The device has at least one semiconducting chip, flat conductors, a heat conducting block for a system carrier and a housing of a synthetic material, whereby the chip is mounted on the heat conducting block by its passive rear side. Inner flat conductor ends are arranged in the block region to overlap and the electronic component has an organoceramic insulation, adhesive and heat conducting coating between the ends and the block in the overlap region. The device has at least one semiconducting chip, flat conductors, a heat conducting block for a system carrier and a housing of a synthetic material, whereby the chip is mounted on the heat conducting block by its passive rear side. Inner flat conductor ends are arranged in the block region to overlap and the electronic component has an organoceramic insulation, adhesive and heat conducting coating (6) between the ends and the block in the overlap region. Independent claims are also included for the following: (a) a system carrier (b) a method of manufacturing a system carrier (c) and a method of manufacturing an inventive electronic component with semiconducting chip.

公开(公告)号：DE102009004451A1

公开(公告)日：2009-08-13

申请号：DE102009004451

申请日：2009-01-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  EWE HENRIK ,  MENGEL MANFRED ,  NIKITIN IVAN

IPC: H01L21/60 ,  H01L23/50

Abstract: This application relates to a method of manufacturing an electronic device comprising placing a first chip on a carrier; applying an insulating layer over the first chip and the carrier; applying a metal ions containing solution to the insulating layer for producing a first metal layer of a first thickness; and producing a second metal layer of a second thickness on the insulating layer wherein at least one of the first metal layer and the second metal layer comprises at least a portion that is laterally spaced apart from the respective other metal layer.

公开(公告)号：DE102007040149A1

公开(公告)日：2009-02-19

申请号：DE102007040149

申请日：2007-08-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  ESCHER-POEPPEL IRMGARD

IPC: H01L25/00

Abstract: A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.

公开(公告)号：DE10042839B4

公开(公告)日：2009-01-29

申请号：DE10042839

申请日：2000-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SPITZLSPERGER WOLFGANG

IPC: H01L23/36 ,  H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  H01L23/433 ,  H01L23/50 ,  H01L25/04

Abstract: The chip(s) (12-14) are arranged on a system substrate (2) with metallic track conductors (3). The substrate is located on a metal section (4) forming a heat sink (5). Its outer surface is exposed to the surrounding atmosphere (7). Its inner surface (8) supports the substrate. The inner surface of the metal section is electrically insulated from the tracks of the substrate by a metal oxide bonding layer. An Independent claim is included for the method of manufacture. The heat sink is oxidized, and the substrate is bonded to it. Chips are fixed to the substrate and bonded using wire or ball-grid array technology. The result is encapsulated, leaving the heat sink areas clear.

公开(公告)号：DE102004035368B4

公开(公告)日：2007-10-18

申请号：DE102004035368

申请日：2004-07-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAIMERL ALFRED ,  BEER GOTTFRIED ,  DANGELMAIER JOCHEN ,  MUELLER KLAUS ,  PRESSEL KLAUS ,  MENGEL MANFRED

IPC: H01L23/50 ,  B82B1/00 ,  B82B3/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

公开(公告)号：DE102005045767A1

公开(公告)日：2007-05-24

申请号：DE102005045767

申请日：2005-09-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  FUERGUT EDWARD

IPC: H01L23/28 ,  C25B11/12 ,  H01L23/36

公开(公告)号：DE102006001429A1

公开(公告)日：2007-03-22

申请号：DE102006001429

申请日：2006-01-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  BRUNNBAUER MARKUS ,  ROGALLI MICHAEL

IPC: H01L23/50 ,  H01L21/50 ,  H01L23/28 ,  H01L23/498

Abstract: A functional unit comprises rows and columns of semiconductor chips (3) on a connection plate with at least one chip at each position having an active upper side (8) and rear (10) and edge (12,14) sides. The active side and connection plate are coplanar and the rear and edge sides are embedded in a housing of plastic mass (4). A single or multi-layer wiring structure of conductive leads (17,18) on the plate has dielectric layers (16) to mutually insulate the leads and the dielectric comprises and organic/inorganic hybrid polymer. An independent claim is also included for the following: (A) a semiconductor component as above; and (B) a production process for the above.

公开(公告)号：DE102004027788A1

公开(公告)日：2006-01-05

申请号：DE102004027788

申请日：2004-06-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  BEER GOTTFRIED ,  ZUHR BERNHARD

IPC: H01L21/60 ,  H01L23/50 ,  H01L25/065

Abstract: The component has a semiconductor chip (7) arranged between a re-wiring substrate (5) and an intermediate distribution plate (6). Boundary regions of the substrate surrounding the chip, has an elastic contact unit (9) which is electrically connected with the boundary regions (10) of the distribution plate. A top side of the plate ahs external contact surfaces whose size corresponds to the size of contact surfaces in the unit. Independent claims are also included for the following: (A) a method for the production of a semiconductor base component (B) a method for producing an elastic contact unit.

公开(公告)号：DE10332015A1

公开(公告)日：2005-03-03

申请号：DE10332015

申请日：2003-07-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SCHUNK NIKOLAUS

IPC: G02B6/42 ,  H01L25/16

Abstract: An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.