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公开(公告)号:DE102004010902B4
公开(公告)日:2007-01-11
申请号:DE102004010902
申请日:2004-03-05
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NOELSCHER CHRISTOPH , KIESLICH ALBRECHT , PFORR RAINER , HENNIG MARIO
Abstract: A mask level layout has an arrangement of lines and spaces with the spaces interconnected by a further space. The spaces are alternately acted upon with a phase deviation with respect to the spaces, where a phase edge between spaces acted upon differently arises in the region of the further space. Alternatively, the connecting space within the layout may be filled with dark regions. An additional space is inserted in a second layout representing a further mask of the same mask set. The additional space enables formation of an insulating region on a semiconductor substrate at the location where formation of a continuous isolation trench is not possible due to the phase edges or dark regions within originally connecting spaces of the first mask. The first mask can be embodied as a hybrid mask with structures according to the principle of alternating phase masks with a large process window.
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公开(公告)号:DE102005003184A1
公开(公告)日:2006-07-27
申请号:DE102005003184
申请日:2005-01-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MOUKARA MOLELA , WINKLER THORSTEN , ZEILER KARSTEN , KOEHLE RODERICK , THIELE JOERG , DETTMANN WOLFGANG , MITTERMEIER ARMELLE BENEDICTE , HENNIG MARIO , KOESTLER WOLFRAM
IPC: G03F1/00 , H01L21/8242
Abstract: The mask has a mask structure (30) in a chromium layer (3), a halftone layer (4) or a glass layer (5) of the tri-tone mask. The structure is surrounded by a strip of the halftone layer with a predetermined width. The strip creates a sharp contrast between a passage from the opaque layer to the glass layer. The width of the strip is constant and parallel to an edge of the structure and amounts between 50 and 200 nanometers. Independent claims are also included for the following: (A) a method of manufacture of a tri-tone mask (B) utilization of a tri-tone mask for the lithographic manufacture of a semiconductor device.
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公开(公告)号:DE102004033350A1
公开(公告)日:2006-02-09
申请号:DE102004033350
申请日:2004-07-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HENNIG MARIO , PFORR RAINER
Abstract: A correction of systematic line width fluctuations during the transmission of a pattern onto a substrate (10) is made possible in an exposure apparatus with an aperture (40) through a local variation of the width and/or of the transparency of the aperture along one direction. By means of a further variation of the radiation dose along another line during the scanning process an overall correction on the substrate can be achieved. An independent claim is included for an exposure apparatus for the exposing of substrates through the passing over of a surface of the substrate by means of an illuminated aperture.
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公开(公告)号:DE102004010902A1
公开(公告)日:2005-09-22
申请号:DE102004010902
申请日:2004-03-05
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NOELSCHER CHRISTOPH , KIESLICH ALBRECHT , PFORR RAINER , HENNIG MARIO
Abstract: A mask level layout has an arrangement of lines and spaces with the spaces interconnected by a further space. The spaces are alternately acted upon with a phase deviation with respect to the spaces, where a phase edge between spaces acted upon differently arises in the region of the further space. Alternatively, the connecting space within the layout may be filled with dark regions. An additional space is inserted in a second layout representing a further mask of the same mask set. The additional space enables formation of an insulating region on a semiconductor substrate at the location where formation of a continuous isolation trench is not possible due to the phase edges or dark regions within originally connecting spaces of the first mask. The first mask can be embodied as a hybrid mask with structures according to the principle of alternating phase masks with a large process window.
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公开(公告)号:DE10310137A1
公开(公告)日:2004-10-07
申请号:DE10310137
申请日:2003-03-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , THIELE JOERG , HENNIG MARIO , DETTMANN WOLFGANG , ZEILER KARSTEN
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公开(公告)号:DE102006004230A1
公开(公告)日:2007-08-09
申请号:DE102006004230
申请日:2006-01-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HENNIG MARIO , PFORR RAINER , UNGER GERD
Abstract: A layout is decomposed into partial patterns. An intermediate mask is drawn for each of the partial patterns. The intermediate masks are used in a mask stepper or scanner progressively for projection again into a common pattern on a test mask. A line width distribution LB(x,y) is determined from the test mask or from a test wafer exposed using the mask, and is converted into a distribution of dose corrections. The transmission T(x,y) of the respective intermediate masks is adapted based upon the calculated dose correction. This can be achieved using additional optical elements which are assigned to the intermediate masks and have shading structure elements, or by laser-induced rear-side introduction of shading elements in the quartz substrate of the intermediate masks themselves.
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公开(公告)号:DE102005003905A1
公开(公告)日:2006-10-12
申请号:DE102005003905
申请日:2005-01-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PFORR RAINER , MOUKARA MOLELA , MUELDERS THOMAS , HENNIG MARIO , ZEILER KARSTEN
Abstract: An improvement of the imaging quality with simultaneous transfer of line-space gratings and peripheral structures including a MUX space is achieved using a quadrupole illumination whose poles are formed in elongate fashion and whose longitudinal axes are arranged perpendicular to the orientation of the lines of the line-space grating arranged on a mask. The structure imaging of the line-space grating is improved with regard to contrast, MEEF, and process window, while the geometrical fidelity of the peripheral structure, in particular of the MUX space, is stabilized over a wide depth of field range.
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公开(公告)号:DE10359200A1
公开(公告)日:2005-04-28
申请号:DE10359200
申请日:2003-12-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HOFMANN DETLEF , HENNIG MARIO , THIELSCHER GUIDO , GRUSS STEFAN , PFORR RAINER , FROEHLICH HANS-GEORG
IPC: H01L23/544 , G03F9/00 , G03F7/20
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公开(公告)号:DE10160458A1
公开(公告)日:2003-06-26
申请号:DE10160458
申请日:2001-11-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: DETTMANN WOLFGANG , ANTESBERGER GUNTER , HEUMANN JAN , HENNIG MARIO
Abstract: Product mask comprises: a quartz layer; and a masking layer on the quartz layer for masking predetermined regions of the quartz layer to project the semiconductor layers. The mask surface has one or more predetermined defects, each of which is masked by a mark on the mask surface. Independent claims are also included for the following: (i) a phase shift mask comprising the above product mask with a number of trenches formed in the quartz layer; and (ii) a process for the production of the phase shift mask. Preferred Features: Each mark comprises a number of markers each assigned a marker type with a predetermined defect parameter. The markers are rectangular and are formed by a quartz protrusion or quartz hole on or in the quartz layer.
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公开(公告)号:DE102005003185A1
公开(公告)日:2006-07-27
申请号:DE102005003185
申请日:2005-01-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MOUKARA MOLELA , WINKLER THORSTEN , ZEILER KARSTEN , THIELE JOERG , KOESTLER WOLFRAM , HENNIG MARIO
IPC: G03F7/20
Abstract: The system has a mask (25) for manufacturing of semiconductor structures on a wafer by transformation of the mask on the wafer. The mask has main mask structures (20) parallel to a transformation axis (x) that is running perpendicular to a dipole axis (y). A connection mask structure (23) that is transversely aligned in sections to the dipole axis is formed on the mask and connects the main mask structures with each other. Independent claims are also included for the following: (A) a method of manufacturing a semiconductor circuit with a transformation system (B) an application of a transformation system for manufacturing of a semiconductor circuit.
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