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公开(公告)号：US20230262890A1
公开(公告)日：2023-08-17
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
CPC classification number: H05K1/115 , H05K1/0222 , H05K2201/0195 , H05K2201/09536 , H05K2201/09809
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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公开(公告)号：US11686008B2
公开(公告)日：2023-06-27
申请号：US17745809
申请日：2022-05-16
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Cho-Ying Wu , Shih-Lian Cheng
CPC classification number: C25D5/007 , C25D17/007
Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
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公开(公告)号：US20250056712A1
公开(公告)日：2025-02-13
申请号：US18930988
申请日：2024-10-29
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
Abstract: A manufacturing method of the circuit board includes the following. The third substrate has an opening and includes a first, a second and a third dielectric layers. The opening penetrates the first and the second dielectric layers, and the opening is fully filled with the third dielectric layer. The first, the second and the third substrates are press-fitted so that the second substrate is located between the first and the third substrates. Multiple conductive structures are formed so that the first, the second and the third substrates are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, and the third dielectric layer of the third substrate. The conductive via structure is electrically connected to the first and the third substrates to define a signal path. The ground path surrounds the signal path.
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公开(公告)号：US12177964B2
公开(公告)日：2024-12-24
申请号：US17711027
申请日：2022-04-01
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
IPC: H05K1/02 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/42
Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US12144113B2
公开(公告)日：2024-11-12
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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Patent Agency Ranking
公开(公告)号：US20220232694A1
公开(公告)日：2022-07-21
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US12057381B2
公开(公告)日：2024-08-06
申请号：US17498757
申请日：2021-10-12
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Hsin-Ning Liu , Jun-Rui Huang , Pei-Wei Wang , Ching Sheng Chen , Shih-Lian Cheng
CPC classification number: H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49822 , H05K1/0222 , H05K3/0094 , H05K3/429 , H05K3/4614 , H05K3/4623 , H01L24/16 , H01L2224/16227 , H05K2201/09509 , H05K2201/0959
Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.
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公开(公告)号：US11859302B2
公开(公告)日：2024-01-02
申请号：US17705405
申请日：2022-03-28
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Chih-Kai Chan , Shih-Lian Cheng
Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
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公开(公告)号：US20220240369A1
公开(公告)日：2022-07-28
申请号：US17574551
申请日：2022-01-13
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Ming-Ting Chang
Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.
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公开(公告)号：US20220232695A1
公开(公告)日：2022-07-21
申请号：US17711027
申请日：2022-04-01
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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