公开(公告)号：US4774634A

公开(公告)日：1988-09-27

申请号：US820239

申请日：1986-01-21

Applicant: Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

Inventor： Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/321 ,  H05K1/095 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/09472 ,  H05K2201/09772 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2203/1453 ,  H05K3/28 ,  H05K3/4664 ,  H05K3/4685 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A printed circuit assembly includes surface mounted circuit components held in place on a printed circuit board by a rigid connection. The outwardly extending leads of the circuit component are bonded to conductive areas of the board by an electrically conducting flexible adhesive. The combination of a rigid mechanical connection between the body portion of the circuit component and the board and a flexible, electrically conductive connection between each lead end and the board provides an arrangement capable of withstanding shock loading, as well as vibrational and bending forces to which the assembly might be subjected. The assembly lends itself to relatively inexpensive circuit boards produced by printing techniques, typically including applied metal buses that serve as low resistance shunts to the power connections of the circuit components.

Abstract translation: 印刷电路组件包括通过刚性连接保持在印刷电路板上的适当位置的表面安装电路部件。 电路部件的向外延伸的引线通过导电柔性粘合剂粘合到板的导电区域。 电路部件的本体部分与电路板之间的刚性机械连接与每个引线端与电路板之间的柔性导电连接的组合提供了能够承受冲击载荷以及振动和弯曲力的装置， 装配可能会受到影响。 该组件本身适用于通过印刷技术生产的相对便宜的电路板，通常包括用作电路部件的电源连接的低电阻分流器的应用金属总线。

公开(公告)号：US4772762A

公开(公告)日：1988-09-20

申请号：US939815

申请日：1986-12-09

Applicant: Masahiro Fukino

Inventor： Masahiro Fukino

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/09772 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed board capable of permitting the passage of at least two wiring patterns between two adjacent mounting lands on the surface of the printed board even if a clearance between the adjacent mounting lands is limited. Mounted on the printed board is an electrical component having a plurality of leads extending in a parallel relation with each other with limited clearances formed between adjacent leads. The printed board has a plurality of mounting lands to which the respective leads of the electrical component are secured as by soldering, there being a limited clearance defined between adjacent ones of the lands such that only one wiring pattern printed on the printed board can run through the clearance in the direction parallel to that in which the leads extend. The adjacent two lands have two facing parallel sides which are disposed in parallel with each other at an angle relative to the direction in which the leads extend, so that at least two wiring patterns, printed on the surface of the printed board, can run through the clearance between the facing sides of the adjacent lands in a parallel relation therewith.

Abstract translation: 即使相邻的安装台面之间的间隙受到限制，印刷电路板能够允许在印刷电路板的表面上的两个相邻的安装焊盘之间通过至少两个布线图案。 安装在印刷电路板上的是具有彼此平行关系延伸的多个引线的电气部件，并且在相邻导线之间形成有限的间隙。 印刷电路板具有多个安装平台，通过焊接固定电气部件的各个引线，在相邻的焊盘之间限定间隙，使印刷在印刷电路板上的仅一个布线图案可以穿过 在与引线延伸的方向平行的方向上的间隙。 相邻的两个平台具有相对于引线延伸的方向成一角度彼此平行设置的两个相对的平行侧，使得印刷在印刷电路板表面上的至少两个布线图案可以穿过 相邻焊盘的​​相对侧之间的间隙与其平行关系。

公开(公告)号：EP2706829A2

公开(公告)日：2014-03-12

申请号：EP13179343.2

申请日：2013-08-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ohira, Masaharu

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0207 ,  H05K1/113 ,  H05K13/0465 ,  H05K2201/09772

Abstract: Provided is a printed wiring board including a first heat dissipation pattern placed in one surface layer on which a semiconductor package is to be mounted, a second heat dissipation pattern placed in the other surface layer, and an inner layer conductor pattern placed in an inner layer, in which through holes are formed in the printed wiring board; the first heat dissipation pattern has a joint portion which is placed in an opposed region opposed to a heat sink of the semiconductor package and which is joined to the heat sink with solder; at least one of the through holes is placed in the opposed region; and the second heat dissipation pattern is formed in a pattern in which an end portion of a conductor film in the one of the through holes on the other surface layer side is separated.

Abstract translation: 本发明提供一种印刷线路板，该印刷线路板包括放置在其上要安装半导体封装件的一个表面层中的第一散热图案，放置在另一个表面层中的第二散热图案以及放置在内层中的内层导体图案 其中在印刷线路板中形成通孔; 所述第一散热图案具有接合部分，所述接合部分放置在与所述半导体封装的散热器相对的相对区域中并且通过焊料接合到所述散热器; 至少一个通孔被放置在相对区域中; 并且第二散热图案形成为其中表面层侧上的一个通孔中的导体膜的端部分离的图案。

公开(公告)号：EP1698033A4

公开(公告)日：2010-07-21

申请号：EP04817915

申请日：2004-12-22

Applicant: X2Y ATTENUATORS LLC

Inventor： ANTHONY DAVID ,  ANTHONY ANTHONY ,  ANTHONY WILLIAM M ,  MUCCIOLI JAMES ,  NEIFELD RICHARD A

IPC: H02H9/00 ,  H05K1/02

CPC classification number: H01G4/35 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/203 ,  H05K1/0233 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1006 ,  H05K2201/10454 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

公开(公告)号：EP1255300A3

公开(公告)日：2006-06-07

申请号：EP02009036.1

申请日：2002-04-23

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Kei, Murayama

IPC: H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2224/0401

Abstract: A semiconductor package provided with an interconnection layer including an interconnection pattern and pad formed on an insulating substrate or insulating layer, a protective layer covering the interconnection layer except at the portion of the pad and the insulating substrate or insulating layer, and an external connection terminal bonded with the pad exposed from the protective layer, the pad to which the external connection terminal is bonded being comprised of a plurality of pad segments, sufficient space being opened for passing an interconnection between pad segments, and the pad segments being comprised of at least one pad segment connected to an interconnection and other pad segments not connected to interconnections.

Abstract translation: 一种半导体封装，其具备：布线层，其形成于绝缘基板或绝缘层上;布线层，其覆盖除了所述焊盘以及绝缘基板或绝缘层的一部分之外的布线层;以及外部连接端子 与从所述保护层露出的所述焊盘接合，所述外部连接端子所接合的所述焊盘由多个焊盘片段组成，所述焊盘片段之间具有足够的空间以通过所述互连，并且所述焊盘片段至少包括 一个焊盘片段连接到互连和其他没有连接到互连的焊盘片段。

公开(公告)号：EP0926930B1

公开(公告)日：2004-11-24

申请号：EP98309866.6

申请日：1998-12-02

Applicant: Hewlett-Packard Company, A Delaware Corporation

Inventor： Wharton, Robert J. ,  Daniel, Eric R. ,  Brown, Joseph D.

IPC: H05K1/11 ,  H05K1/02 ,  H05K13/08 ,  G01R31/28

CPC classification number: G01R31/316 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K13/08 ,  H05K2201/0761 ,  H05K2201/09345 ,  H05K2201/09772 ,  H05K2201/10106 ,  H05K2201/10734 ,  Y02P70/611

公开(公告)号：EP1317168A1

公开(公告)日：2003-06-04

申请号：EP01403063.9

申请日：2001-11-29

Applicant: Thomson Licensing S.A.

Inventor： Li, Hua ,  Chin, Yuan Fuat

IPC: H05K1/00

CPC classification number: H05K1/181 ,  H05K2201/09236 ,  H05K2201/09772 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A data bus of a DVD+RW recorder between a DSP and a SDRAM usually needs a multilayer wiring board. In order to simplify the layout of the wiring board of the data bus there is provided a method for connecting at least a first and a second integrated circuit by providing the first integrated circuit having a plurality of first logical I/O ports physically arranged in a first order at the periphery, and providing the second integrated circuit having a plurality of second logical I/O ports physically arranged in a second order at the periphery, wherein each first I/O port is to be connected to one of said second I/O ports. The first and second I/O logical ports are connected independently from the first and/or second physical order, so that connection lines do not cross each other.

Abstract translation: DSP与SDRAM之间的DVD + RW刻录机的数据总线通常需要多层布线板。 为了简化数据总线的布线板的布局，提供了一种通过提供具有物理地布置在第一和第二集成电路中的多个第一逻辑I / O端口的第一集成电路来连接至少第一和第二集成电路的方法 并且提供第二集成电路，该第二集成电路具有多个第二逻辑I / O端口，该第二逻辑I / O端口在外围以二级物理排列，其中每个第一I / O端口将被连接到所述第二I / O端口 第一和第二I / O逻辑端口独立于第一和/或第二物理顺序连接，使得连接线不互相交叉。

公开(公告)号：EP1141887A1

公开(公告)日：2001-10-10

申请号：EP99973502.0

申请日：1999-11-29

Applicant: Gemplus

Inventor： ODDOU, Laurent ,  AYALA, Stéphane ,  ZAFRANY, Micha[l

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L24/24 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/09772 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention concerns a method for making a contactless chip card comprising an electronic module (600), and connected to said module, an antenna (200). The inventive method comprises the following steps: producing, on a first support sheet (100), the antenna (200) provided at its ends, with connection terminals (250); producing an insulating bridge (300) partly covering the antenna (200) coils except for the connection terminals (250); depositing a drop of filling material (500) on the insulating bridge; transferring the electronic module (600), its connection pads (610) being oriented towards the insulating bridge (300); then providing an electric connection between the module (600) contact pads and the antenna (200) connection terminals (250).

公开(公告)号：EP0995346A1

公开(公告)日：2000-04-26

申请号：EP99922215.1

申请日：1999-05-04

Applicant: Nokia Networks Oy

Inventor： ISOKOSKI, Arto ,  MARJAKANGAS, Jari

IPC: H05K7/20

CPC classification number: H05K1/0212 ,  H01L23/345 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09645 ,  H05K2201/0969 ,  H05K2201/09772 ,  H05K2201/09781 ,  H01L2924/00

Abstract: The present invention relates to a heating method and a printed circuit board comprising a heating element (90) which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor (40) between the heating element (90) and the component to be heated, the heat conductor receiving heat generated by the heating element (90) and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts (15, 70) which are narrower than the heat conductor (40), or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor (40) to a component other than the one to be heated when the heat conductor (40) functions as a ground plane or a signal path.

公开(公告)号：EP0970522A1

公开(公告)日：2000-01-12

申请号：EP98964132.9

申请日：1998-12-18

Applicant: MOLEX INCORPORATED

Inventor： NODA, Atsuhito ,  OKANO, Masato ,  FUJII, Hiroyuki

IPC: H01L23/498 ,  H05K3/34

CPC classification number: H05K1/0212 ,  G01R1/07307 ,  G01R31/2886 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/167 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/0949 ,  H05K2201/09772 ,  H05K2201/10378 ,  H05K2203/1115 ,  H05K2203/162 ,  Y02P70/613

Abstract: An improved connector assembly (1) particularly useful for testing semiconductor devices of ball grid array ('BGA') structure (10) with a plurality of solder balls (11) formed on the surface thereof. The balls (11) are placed into contact with opposing conductive portions (3a) of the connector assembly. A heat generating member (7), such as a wire, is disposed proximate to the connector assembly conductive portions (3a) and may be selectively energized to generate heat to partially melt the solder balls (11). Reliable connections are effected in this manner.