Abstract:
Pour vérifier la précision du positionnement d'une liaison par brasage flip-chip entre un substrat (4) et un circuit intégré (2) et/ou un dispositif micro-optique, on forme des rangées de marquesde repère avec les alignements de pastilles métallisées brasables (6, 8) sur les surfaces en coopération du substrat et de la puce de manière à ce qu'une fois que la liaison s'est faite, les marques de repère en rangée constituent ensemble une échelle à vernier permettant de déterminer la précision de la liaison. Lesdites marques de repère peuvent consister en des zones métallisées sur lesquelles sont formées des perles de brasage (1) visibles aux rayons X.
Abstract:
An edge connector (100) is provided, and includes a first row of golden fingers (101) and a second row of golden fingers (102). The first row of golden fingers is adjacent to a plugging end (103) of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end that is close to the plugging end and a second end that is opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of at least two golden fingers in the first row of golden fingers are not aligned with each other. A first end that is of a grounded golden finger in the second row of golden fingers and that is close to the plugging end in the plugging direction of the edge connector is protruded from other golden fingers. The foregoing structure can prolong a life span of the edge connector to some extent.
Abstract:
The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.
Abstract:
Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
Abstract:
Disclosed are electrical connectors and methods of assembling an electrical connector having "standard" (i.e., with electrical contacts having in-line tails), jogged (i.e., with electrical contacts having jogged tails but not connected orthogonally to another connector through a substrate), and/or "orthogonal" (i.e., with electrical contacts having jogged tails that are used in an orthogonal application) leadframe assemblies in the same connector. This provides the flexibility of using some of the available contacts in an orthogonal application and, at the same time, having remaining contacts available for routing on the midplane PCB.; Though this could be done using only orthogonal leadframe assemblies, the combination of standard leadframe assemblies with orthogonal leadframe assemblies creates additional spacing between the PCB vias, so that signal traces can be more easily routed on the midplane PCB.
Abstract:
A connector (12) for connection to terminals (18) of an integrated circuit. The connector consists of a dielectric substrate (40) having a first side and a second side. The connector has wire bond terminals (50) which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals (60), attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls (64) with a second set of the terminals of the integrated circuit.
Abstract:
In accordance with the various embodiments disclosed herein, electrical connector footprints, such as printed circuit boards, is described comprising one or more of signal traces that each include a first section that extends parallel to the linear array direction and a second section extends in a direction that is different than the linear array direction.
Abstract:
A universal serial bus hybrid footprint design is described herein. The design includes an outer row of one or more surface mount technology (SMT) contacts and an inner row of one or more printed through holes (PTH). The hybrid footprint design enables a data through put of at least 10 Gbps.
Abstract:
A circuit board (10) mounted on a marking material receptacle and having a storage device for storing data relating to a marking material for print, said circuit board (10) comprising a plurality of terminals (21-27) arranged on said circuit board (10) in a single direction and connected to the storage device, wherein two of said plurality of terminals (21-27) arranged at two edges of the circuit board (10) are ground terminals (24, 27) used for determining if the marking material receptacle has been installed correctly, wherein one of said ground terminals (24, 27) receives ground potential from a printer when the marking material receptacle is installed on the printer, and another of said ground terminals (24, 27) is connected to the one of said ground terminals (24, 27) on the circuit board (10) and to be connected to a cartridge out detecting pin of the printer when the marking material receptacle is installed on the printer.