公开(公告)号：EP2667449A1

公开(公告)日：2013-11-27

申请号：EP12169025.9

申请日：2012-05-23

Applicant: NXP B.V.

Inventor： Spella, Maristella ,  De Graauw, Antonius Johannes Matheus

IPC: H01Q9/40 ,  H01Q19/10 ,  H01Q5/00

CPC classification number: H01Q1/2283 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01Q9/40 ,  H01Q21/08 ,  H01Q23/00 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/113 ,  H05K1/116 ,  H05K2201/09718 ,  H05K2201/10098 ,  H05K2201/10674 ,  H05K2203/041

Abstract: An antenna design is based on a ball grid array ball or set of balls. This enables integration of an active die and a monopole antenna in a standard BGA (ball grid array) package.

Abstract translation: 天线设计基于球栅阵列球或球。 这使得能够将标准BGA（球栅阵列）封装中的有源管芯和单极天线集成。

公开(公告)号：EP1831970A4

公开(公告)日：2013-04-24

申请号：EP05855654

申请日：2005-12-23

Applicant: AMPHENOL CORP

Inventor： COHEN THOMAS S ,  CARTIER JR MARC B ,  GAILUS MARK W

IPC: H01R13/648

CPC classification number: H05K7/1445 ,  H01R13/514 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

公开(公告)号：EP2091311B1

公开(公告)日：2013-03-06

申请号：EP07831157.8

申请日：2007-11-02

Applicant: IBIDEN CO., LTD.

Inventor： YOSHIKAWA, Kazuhiro

IPC: H05K3/46 ,  H05K1/16

CPC classification number: H05K1/162 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10515 ,  H05K2201/10712

公开(公告)号：EP2451254A1

公开(公告)日：2012-05-09

申请号：EP12151874.0

申请日：2005-02-24

Applicant: BelAir Networks Inc.

Inventor： Brunette, Gilbert P. ,  Johnson, Eric ,  Rayment, Stephen G. ,  Soul, Colin

IPC: H05K1/02

CPC classification number: H05K1/0251 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2924/1903 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A multilayer printed circuit board (100) comprising a first and a second conductive layer and an interconnection structure. The conductive layers have respective conductive traces formed thereon terminating at respective via pads (120). The interconnection structure comprises a centre signal conductor via (130) and a plurality of ground vias (132, 134, 136, 138). The centre signal conductor via is connected to the conductive traces propagating electrical signals there between. The multilayer circuit board further comprises a grounded metal layer (150). The grounded metal layer has a ground pullback section (140) cut away in a region surrounding the signal conductor via. The grounded metal layer comprises first and second ground extension sections protruding into the cut away ground pullback section. The first and second ground extension sections correspond to sections (118) of the conductive traces not having the grounded metal layer underneath and above, respectively.

Abstract translation: 一种包括第一和第二导电层和互连结构的多层印刷电路板（100）。 导电层具有形成在其上的相应的导电迹线，其终止于相应的通孔焊盘（120）。 互连结构包括中心信号导体通孔（130）和多个接地通孔（132,134,136,138）。 中心信号导体通孔连接到导电迹线之间传播电信号。 多层电路板还包括接地金属层（150）。 接地的金属层具有在围绕信号导体通孔的区域中切除的接地回拉部分（140）。 接地的金属层包括突出到切除的接地回拉部分中的第一和第二接地延伸段。 第一和第二接地延伸部分分别对应于不具有下方和上方的接地金属层的导电迹线的部分（118）。

公开(公告)号：EP2141971A4

公开(公告)日：2011-01-05

申请号：EP07829842

申请日：2007-10-15

Applicant: IBIDEN CO LTD

Inventor： TANAKA HIRONORI ,  SHIMIZU KEISUKE

IPC: H05K3/46 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/4913

公开(公告)号：EP2141971A1

公开(公告)日：2010-01-06

申请号：EP07829842.9

申请日：2007-10-15

Applicant: Ibiden Co., Ltd.

Inventor： TANAKA, Hironori ,  SHIMIZU, Keisuke

IPC: H05K3/46

CPC classification number: H05K1/162 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/4913

Abstract: Multilayer printed wiring board (10) comprises core substrate (20), insulation layer (26) on the core substrate laminated on core substrate (20) and capacitor section (40) formed on the insulation layer (26) on the core substrate. Capacitor section (40) is structured by sandwiching high dielectric layer (43) with lower electrode (41) that accumulates negative charges and upper electrode (42) that accumulates positive charges. The ionization tendency of a metal to form lower electrode (41) is larger than that of a metal to form upper electrode (42). For example, a metal to form lower electrode (41) is nickel and a metal to form upper electrode (42) is copper.

Abstract translation: 多层印刷线路板10包括核心基板20，层压在核心基板20上的核心基板上的绝缘层26和形成在核心基板上的绝缘层26上的电容器部分40。 电容器部40通过在高介电层43中夹持积蓄负电荷的下部电极41和积蓄正电荷的上部电极42而构成。 形成下部电极（41）的金属的电离倾向大于形成上部电极（42）的金属的离子化倾向。 例如，形成下部电极（41）的金属是镍，形成上部电极（42）的金属是铜。

公开(公告)号：EP1862040A4

公开(公告)日：2009-11-04

申请号：EP06738633

申请日：2006-03-15

Applicant: STABLCORE INC

Inventor： VASOYA KALU K

IPC: H05K3/30

CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

公开(公告)号：EP1427061A3

公开(公告)日：2009-07-15

申请号：EP04002034.9

申请日：1999-11-24

Applicant: Teradyne, Inc.

Inventor： Cohen, Thomas S. ,  Gailus, Mark W. ,  Stokoe, Philip T.

IPC: H01R12/16

CPC classification number: H01R12/724 ,  H01R12/727 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6587 ,  H01R24/44 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189

Abstract: An electrical connector for transferring a plurality of differential signals between electrical components (14, 16). The connector is made of modules (18) that have a plurality of pairs (104) of signal conductors (102) with a first signal path and a second signal path. Each signal path has a pair of contact sections (116) extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

公开(公告)号：EP2070159A1

公开(公告)日：2009-06-17

申请号：EP07813572.0

申请日：2007-07-31

Applicant: Raytheon Company

Inventor： PUZELLA, Angelo M. ,  CROWDER, Joseph M. ,  DUPUIS, Patricia S. ,  FALLICA, Michael C. ,  FRANCIS, John B. ,  LICCIARDELLO, Joseph A.

IPC: H01Q21/00

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A tile subarray includes an upper multi-layer assembly (UMLA) provided from a first plurality of printed circuit boards and a lower multi-layer assembly (LMLA) provided from a second plurality of printed circuit boards. Each of the UMLA and LMLA includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the UMLA and LMLA. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the UMLA and LMLA.

公开(公告)号：EP2037723A2

公开(公告)日：2009-03-18

申请号：EP08164448.6

申请日：2008-09-16

Applicant: TridonicAtco Deutschland GmbH

Inventor： Schubert, Gisbert

IPC: H05K3/32

CPC classification number: H05K3/326 ,  F21K9/00 ,  F21Y2115/10 ,  H01R4/2487 ,  H01R25/147 ,  H05K3/308 ,  H05K3/4046 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10106 ,  H05K2201/10409

Abstract: Eine Basisplatte (21) für ein Leuchtelement (26) insbesondere für die Lichtwerbung weist
- eine erste leitfähige Schicht (23) mit einer ersten Öffnung (32) und eine zweite leitfähige Schicht (24) mit einer zweiten Öffnung (33), und
- eine Isolierschicht (22) zwischen der ersten und der zweiten leitfähigen Schicht (23, 24) auf,

wobei ein erstes Befestigungselement (40) durch die erste Öffnung (32) bzw. ein zweites Befestigungselement (41) durch die zweite Öffnung (33) in die Basisplatte (21) derart einfügbar sind, dass das erste Befestigungselement (40) nur an die zweite leitfähige Schicht (24) bzw. das zweite Befestigungselement (41) nur an die erste leitfähige Schicht (24) elektrisch anschließbar sind.

Abstract translation: 基板（21），用于照明元件（26）具有，尤其是用于照明广告 - 具有第一开口（32）和第二导电层（24）具有第二开口（33）的第一导电层（23），以及 - 一个 第一和第二导电层（23,24）之间的绝缘层（22），其中第一紧固元件（40）通过穿过所述第二开口（33）的第一开口（32）和第二紧固元件（41） 底板（21）是这样被插入的，只有在该第二导电层（24）和第二紧固元件（41）的第一紧固元件（40）电连接到仅在第一导电层（24）。