公开(公告)号：EP2779812A2

公开(公告)日：2014-09-17

申请号：EP14158391.4

申请日：2014-03-07

Applicant: Intel Corporation

Inventor： Swaminathan, Rajasekaran ,  Tran, Donald T. ,  Stone, Brent, S. ,  Viswanath, Ram

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/11 ,  H01R12/62 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/094 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10378 ,  Y02P70/611

Abstract: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board 106 including a plurality of circuit board contacts. The chip package assembly may include a chip package 102 including a first side 118 and a second side 120, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly 122.

公开(公告)号：EP2568783A4

公开(公告)日：2014-01-22

申请号：EP11777459

申请日：2011-05-02

Applicant: OLYMPUS CORP

Inventor： NAKAMURA MIKIO

IPC: H05K3/40 ,  H01R12/53 ,  H05K1/18 ,  H05K3/32 ,  H05K9/00

CPC classification number: H05K3/403 ,  H05K3/32 ,  H05K2201/10356 ,  Y10T29/49117

公开(公告)号：EP2683225A1

公开(公告)日：2014-01-08

申请号：EP11860278.8

申请日：2011-12-12

Applicant: Olympus Corporation

Inventor： FUJIMORI Noriyuki

IPC: H05K1/11 ,  A61B1/04 ,  G03B17/02 ,  H04N5/225 ,  H05K3/46

CPC classification number: H05K1/181 ,  A61B1/0011 ,  A61B1/051 ,  H04N5/2251 ,  H05K1/18 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0919 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10416 ,  H05K2201/10446 ,  Y10T29/49162

Abstract: A wiring board 10 includes a plurality of wiring layers 22, a plurality of insulating layers 23, and an electrode member 20 made of a conductive material, the electrode member 20 being incorporated in the wiring board 10 in a state in which the electrode member 20 includes exposed sections 20S on side surfaces 13 and 14 that cross the plurality of wiring layers 22 and the plurality of insulating layers 23.

Abstract translation: 布线基板10具有多个布线层22，多个绝缘层23和由导电材料制成的电极构件20，电极构件20在电极构件20的状态下配置在布线基板10中 包括穿过多个布线层22和多个绝缘层23的侧表面13和14上的暴露部分20S。

公开(公告)号：EP2667690A3

公开(公告)日：2013-12-11

申请号：EP12168996.2

申请日：2012-05-23

Applicant: Tyco Electronics Belgium EC BVBA ,  Tyco Electronics Nederland B.V.

Inventor： Decrock, Lieven ,  Smink, Rutger ,  Van het Bolscher, Han ,  Campschroer, Dolf ,  Van Gils, Wijnand

IPC: H05K1/02 ,  H05K1/11 ,  H01R13/6473 ,  H01R12/62

CPC classification number: H05K1/0219 ,  H01R12/721 ,  H01R12/728 ,  H05K1/025 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/4641 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09145 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/10356

Abstract: The invention relates to a three-dimensional circuit board (1), comprising a carrier component (10; 30), carrying at least one circuit path (110, 120) at an outside of a carrier body (100; 300) of the carrier component (10; 30), wherein, for impedance control, the carrier body (100; 300) comprises a deepening (102), wherein the circuit path (110, 120) is at least partially arranged in the deepening (102).

公开(公告)号：EP2516321A2

公开(公告)日：2012-10-31

申请号：EP11817213.9

申请日：2011-10-10

Applicant: Micro-Epsilon Messtechnik GmbH & Co. KG

Inventor： SCHMIDEDER, Sabine ,  THELEMANN, Torsten ,  NAGL, Josef ,  ASCHENBRENNER, Heinrich ,  HOENICKA, Reinhold

IPC: B81B7/00

CPC classification number: H05K1/181 ,  B81B7/0006 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10356 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A sensor comprises a preferably multilayered ceramic substrate (2) and at least one sensor element (1) arranged in, at or on the ceramic substrate (2). Contact can be made with the sensor element (1) via a metallic contact (6), wherein the metallic contact (6) is produced by means of a soldering connection that electrically connects the contact (6) to the sensor element (1) and in the process produces a fixed mechanical connection of the contact (6) relative to the ceramic substrate (2). A method for producing the sensor according to the invention is furthermore claimed.

公开(公告)号：EP2392200A1

公开(公告)日：2011-12-07

申请号：EP10704613.8

申请日：2010-02-01

Applicant: Tyco Electronics Corporation

Inventor： SMEJTEK, Dalibor, J.

IPC: H05K3/36

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly (10) includes a base printed circuit (12) having a printed circuit receiving area (29) and a plurality of electrical contacts provided on the printed circuit receiving area (30). The printed circuit assembly also includes a secondary printed circuit (14) having a secondary substrate (54) including a mating edge (46) and a plurality of secondary contacts (70) provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

公开(公告)号：EP2334156A1

公开(公告)日：2011-06-15

申请号：EP09178552.7

申请日：2009-12-09

Applicant: RESEARCH IN MOTION LIMITED

Inventor： Wong, Joshua Kwan Ho Wong ,  Man, Thomas Ying Tong ,  Qi, Yihong ,  Jarmuszewski, Perry ,  Chan, Antonio

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01P3/08

CPC classification number: H05K1/0219 ,  H01P3/085 ,  H01P3/121 ,  H05K1/0224 ,  H05K1/0393 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10356

Abstract: A flexible cable for carrying RF signals and method of manufacturing same. The cable (170) includes an elongate base substrate including a dielectric layer (176) with an upper metal layer (178) deposited on one side and a lower metal layer (174) deposited on its other side. It further includes two parallel spaced-apart series of vias (180) formed along the length of the base substrate, each via electrically interconnecting the upper metal layer and the lower metal layer, whereby a rectangular cross-sectional waveguide (190) is provided between the upper metal layer, the lower metal layer and the two series of vias.

Abstract translation: 用于承载RF信号的柔性电缆及其制造方法。 电缆（170）包括细长的基底基底，其包括在一侧沉积有上金属层（178）的介电层（176）和沉积在另一侧的下金属层（174）。 它还包括沿着基底衬底的长度形成的两个平行间隔开的​​一系列通孔（180），每个通孔将上部金属层和下部金属层电连接，从而在矩形横截面波导（190）之间提供矩形横截面波导 上金属层，下金属层和两系列通孔。

公开(公告)号：EP2234151A1

公开(公告)日：2010-09-29

申请号：EP10156488.8

申请日：2010-03-15

Applicant: Sony Corporation

Inventor： Amano, Ryosuke

IPC: H01L23/367 ,  H01L27/146 ,  H05K1/02

CPC classification number: H01L27/14618 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/42 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0203 ,  H01L31/024 ,  H01L2023/4056 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/16195 ,  H05K1/021 ,  H05K1/0215 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10356 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00014

Abstract: A semiconductor device (1) includes: a semiconductor element (2) having an imaging function, one surface (2a) of which serves as a light-receiving surface; a package (3) having a recess (3a) containing the semiconductor element (2) with the light-receiving surface (2a) facing outward; a light-transmitting plate (5) closing the recess (3a) of the package (3) containing the semiconductor element (2); a conductor (4) provided at the package (3), electrically connected to the semiconductor element (2), and electrically connected to an external circuit; a heat conductive member (6) provided to protrude from another surface of the semiconductor element (2); and a printed circuit board (7) on which the external circuit is provided, on which the semiconductor element (2) is mounted in electrical connection with the external circuit, and which is formed with an opening (7b) to serve as a clearance for the heat conductive member (6).

Abstract translation: 本发明提供一种半导体装置，其特征在于，具备：具有摄像功能的半导体元件（2），其一面（2a）成为受光面; 具有包含所述半导体元件（2）并且所述受光面（2a）朝向外侧的凹部（3a）的封装（3） 封闭包含半导体元件（2）的封装（3）的凹部（3a）的透光板（5）; 设置在封装（3）处的导体（4），其电连接到半导体元件（2），并电连接到外部电路; 设置成从半导体元件（2）的另一表面突出的导热构件（6）; 和设置有外部电路的印刷电路板（7），半导体元件（2）安装在外部电路上并与外部电路电连接，并且形成有开口（7b）以用作用于 导热构件（6）。

公开(公告)号：EP2139723A2

公开(公告)日：2010-01-06

申请号：EP08799609.6

申请日：2008-03-21

Applicant: Johnson Controls Technology Company

Inventor： HODGSON, Thomas, Scott ,  PACHECO, Kathleen, Marie ,  SPOERRE, Steven, Mark ,  ARENDSEN, Randy ,  VONDERWELL, Art ,  JONES, Bryan, Todd ,  BUSSIS, Mark ,  TINDALL, Rodney, J. ,  HICKS, Theron, J. ,  WERNICKE, Chad ,  THIEME, Bryan

IPC: B60Q3/02 ,  H05B33/08

CPC classification number: B60Q3/66 ,  B60Q3/14 ,  B60Q3/208 ,  B60Q3/225 ,  B60Q3/74 ,  B60Q3/80 ,  H05K1/0284 ,  H05K1/148 ,  H05K2201/0999 ,  H05K2201/10106 ,  H05K2201/10356

Abstract: Lighting devices for a vehicle are dislosed that can include a light emitting diode and control circuitry for the light emitting diode. Also disclosed are circuits for a light emitting diode. Additionally, a method of forming a lighting device is disclosed. The lighting device, circuits, and method can be used, for example, to illuminate the interior of a vehicle.

Abstract translation: 公开了一种被配置为连接到用于安装在车辆内部中的基座的照明子系统，包括： - 光源（510）; - 与基地的物理连接; 和 - 与光源的电连接; 其中所述光源（510）被配置为提供用于所述车辆内部的功能照明和装饰照明中的至少一个; 其中功能照明包括（a）架空照明，（b）仪表板照明，（c）车厢照明和（d）车辆内部的照明中的至少一个; 并且其中装饰照明包括（a）多色照明，（b）环境照明和（c）图形的背光中的至少一种。还公开了一种用于形成照明子系统的方法。

公开(公告)号：EP1721498B1

公开(公告)日：2008-02-13

申请号：EP05716697.7

申请日：2005-02-15

Applicant: BSH Bosch und Siemens Hausgeräte GmbH

Inventor： GRADL, Markus ,  KNOPP, Lothar ,  STEINEGGER, Rolf

IPC: H05K1/18

CPC classification number: H05K3/4046 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2203/1572 ,  Y10T29/4913

Abstract: The invention relates to an electronic module (1) comprising at least one circuit carrier (3) coated on both sides with an electroconductive material and fitted with a first group of electronic components (2, 2') for forming a user interface and a second group of electronic components (4, 4') for forming a computing and control module. The invention also relates to a method for producing one such module (1). According to said method, the components (2, 2', 4, 4') are carefully arranged respectively on the cover side (5) and on the appliance side (7) of the module (1) in such a way that the design and function of the module (1) can be completely unrelated. In order to reduce the production costs of the inventive module, printed circuit boards coated on both sides are used as circuit carriers (3) that are free of STH through-connection points. According to the invention, the signal transmission is carried out via plug-in elements (8), lateral elements (9), and through-connection elements (10).