公开(公告)号：US20060042831A1

公开(公告)日：2006-03-02

申请号：US11216813

申请日：2005-08-31

Applicant: Meta Rohde ,  Klaus Schoepf ,  Ajay Poddar ,  Reimund Rebel

Inventor： Meta Rohde ,  Klaus Schoepf ,  Ajay Poddar ,  Reimund Rebel

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K3/3442 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/244 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49165

Abstract: A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.

公开(公告)号：US20050279529A1

公开(公告)日：2005-12-22

申请号：US11054430

申请日：2005-02-10

Applicant: Akihiko Happoya

Inventor： Akihiko Happoya

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/10189 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y10T29/49126

Abstract: Disclosed is a wiring board, comprising: a rigid substrate having a first surface and a second surface, wiring layers on the first surface and the second surface, and through hole's inner wall conductors electrically conducting the wiring layers on the first and the second surface, the wiring layer on the first surface including part mounting lands; a flexible substrate disposed to oppose the second surface of the rigid substrate and having connection lands on its surface which is opposite to the second surface of the rigid substrate, the connection lands being positioned to substantially agree with positions of the through hole's inner wall conductors of the rigid substrate; and a connecting member which electrically and mechanically connects the through hole's inner wall conductors and the connection lands, and a magnetic disc apparatus having the wiring board and a production method of the wiring board are disclosed.

Abstract translation: 公开了一种布线板，包括：具有第一表面和第二表面的刚性基板，在第一表面和第二表面上的布线层，以及导电第一和第二表面上的布线层的通孔内壁导体， 所述第一表面上的所述布线层包括部分安装台面; 柔性基板设置成与刚性基板的第二表面相对并且在其表面上具有与刚性基板的第二表面相对的连接平台，连接平台被定位成基本上与通孔的内壁导体的位置一致 刚性基材; 以及将通孔的内壁导体和连接台电连接并机械连接的连接部件，以及具有布线基板的磁盘装置和布线基板的制造方法。

公开(公告)号：US20050258526A1

公开(公告)日：2005-11-24

申请号：US11168549

申请日：2005-06-29

Applicant: Takashi Noguchi

Inventor： Takashi Noguchi

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H01L23/58 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H01L23/495

CPC classification number: H01L22/32 ,  H01L23/498 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3651 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/0394 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

Abstract translation: 一种可以降低故障发生率的半导体器件的安装方法，可以容易地修复有缺陷的焊点的半导体器件的修复方法以及使这些方法可行的半导体器件。 衬底1上形成有布线层9内衬在内壁上的通孔7，并且焊球6以覆盖通孔7的方式熔合到衬底1上。在安装过程中 或者在维修过程中，加热用探针41穿过通孔7并推入焊球6，从而熔化焊球，并将加热探针从焊球中拉出以使焊球冷却。 在这些处理中，仅可以加热焊球6，从而避免对IC芯片3的不利影响。在修复过程中，焊球6可以恢复到没有金属间化合物的初始条件。

公开(公告)号：US20040231884A1

公开(公告)日：2004-11-25

申请号：US10849478

申请日：2004-05-19

Inventor： Kenneth Daryl Wong ,  Sean L. Bell

IPC: H05K007/20 ,  H05K001/11

CPC classification number: H05K3/44 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/1178 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

Abstract translation: 公开了一种印刷电路板组件，其采用与连接到导电托盘的焊料填充的互连通孔相邻的焊剂通气孔。 焊锡通气孔允许气体在回流焊接过程中从另一个密封的空腔中逸出，减轻正压，从而允许焊料流入其中。 通过为焊膏回流期间产生的被捕获的空气和气体提供逃生路径，熔融焊料的排气压力和重量足以使焊膏流入空腔。

公开(公告)号：US20040211594A1

公开(公告)日：2004-10-28

申请号：US10737412

申请日：2003-12-15

Inventor： Kwun-Yao Ho ,  Moriss Kung

IPC: H05K001/11 ,  H05K003/42

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3468 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/0367 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A vertical routing structure for a multi-layered substrate having a lamination structure therein. The lamination structure has at least a through hole that links up both surfaces of the lamination structure. The vertical routing structure comprises a conductive rod and a conductive layer. The conductive rod is formed inside the through-hole with the ends protruding above the respective upper and lower surface of the lamination structure. The conductive layer is positioned in the space between the interior sidewall of the through-hole and the conductive rod. The vertical routing structure on the substrate is able to reduce the area for laying the required circuits or increase the wiring density in a given area.

Abstract translation: 一种用于其中具有层压结构的多层基板的垂直布线结构。 层压结构至少具有连接层压结构的两个表面的通孔。 垂直布线结构包括导电棒和导电层。 导电杆形成在通孔的内部，端部突出在层叠结构的相应的上表面和下表面的上方。 导电层位于通孔的内侧壁与导电棒之间的空间中。 基板上的垂直布线结构能够减少放置所需电路的面积或增加给定区域中的布线密度。

公开(公告)号：US06801174B2

公开(公告)日：2004-10-05

申请号：US10005960

申请日：2001-12-03

Applicant: Shun Kayama ,  Shunji Amano ,  Motosuke Ohmi ,  Junichi Ohsako ,  Ryota Odake ,  Hiroshi Ozaki

Inventor： Shun Kayama ,  Shunji Amano ,  Motosuke Ohmi ,  Junichi Ohsako ,  Ryota Odake ,  Hiroshi Ozaki

IPC: H01J162

CPC classification number: H05K3/363 ,  H01L27/32 ,  H05K3/305 ,  H05K3/3489 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10128 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/107

Abstract: A display device includes an organic electrroluminescence device provided on a first substrate, conductive metallic films provided on the first substrate at such positions as not to overlap with the organic electroluminescence device, a second substrate having a plurality of holes and conductive connection portions which are provided at peripheral portions forming the holes, and solder portions charged in the holes of the second substrate and, by being melted, electrically connecting the conductive metallic films of the first substrate with the conductive connection portions of the second substrate.

Abstract translation: 显示装置包括设置在第一基板上的有机电致发光器件，设置在不与有机电致发光器件重叠的位置处的第一基板上的导电金属膜，具有多个孔的第二基板和设置有导电连接部的导电连接部 在形成孔的周边部分，以及填充在第二基板的孔中的焊料部分，并且通过熔化将第一基板的导电金属膜与第二基板的导电连接部分电连接。

公开(公告)号：US20040016114A1

公开(公告)日：2004-01-29

申请号：US10202726

申请日：2002-07-25

Applicant: International Business Machines Corporation

Inventor： Michael F. McAllister ,  John G. Torok

IPC: H05K003/20 ,  H05K001/00

CPC classification number: H05K1/141 ,  H05K1/0286 ,  H05K1/162 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10348 ,  H05K2201/10666 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

公开(公告)号：US06560121B1

公开(公告)日：2003-05-06

申请号：US09554595

申请日：2000-05-26

Applicant: Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

Inventor： Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

IPC: H05K702

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2201/10727 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.

Abstract translation: 背板微波封装在印刷电路上的表面安装。 在封装已经精确地定位在印刷电路上之后，通过直接接触导电元件来焊接连接。 芯片被封装在构成屏幕的笼子中，其替代传统的盖子，保持架由分别由包装和印刷电路承载的布局形成，并通过金属连接件连接在一起。 表面安装特别适用于以毫米微波工作的封装。

公开(公告)号：US06468834B1

公开(公告)日：2002-10-22

申请号：US09452851

申请日：1999-12-02

Applicant: Ahmad Hamzehdoost

Inventor： Ahmad Hamzehdoost

IPC: H01L2148

CPC classification number: H01L23/49833 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.

Abstract translation: 裸芯片配置包括刚性电路板，其具有穿过其中形成的导电电镀通孔，以及安装到其上表面的集成电路裸片，柔性绝缘带层固定到刚性电路板的上表面， 具有多个引线接合点。 提供导电通孔或电镀通孔，用于将柔性绝缘带层的上表面上的引线接合位置与形成在柔性绝缘带层的下表面上的接触区域相连接。 提供导体，用于将柔性绝缘带层的下表面上的各个接触区域连接到刚性电路板底部的焊球。

公开(公告)号：US06444924B1

公开(公告)日：2002-09-03

申请号：US09359981

申请日：1999-07-23

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H01R109

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。