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    CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME
    241.
    发明申请
    CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
    导电聚合物装置及其制造方法

    公开(公告)号：WO2004053899A1

    公开(公告)日：2004-06-24

    申请号：PCT/US2003/007875

    申请日：2003-03-14

    Applicant: BOURNS, INC. ,  BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

    Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

    IPC: H01C1/14

    CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

    Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

    Abstract translation: 使用印刷电路板制造工艺制造电子设备。 特别地，层状器件包括第一金属层（12），第二金属层（14），夹在第一和第二金属层之间的至少一层器件材料。 第一层绝缘材料（40）基本上覆盖第一金属层（12）。 第三金属层（48）设置在第一绝缘材料层（40）上。 该第三金属层（48）被分割以提供第一端子（90）和第二端子（92）。 第一端子（90）通过通过所述第一绝缘材料层（40）形成的导电互连（84）与第一金属层（12）电连接，并且第二端子（92）电连接到所述第二金属 层（14）由包括绝缘导电通道的导电路径（68）穿过并与所述第一金属层（12）和所述至少一层装置材料（16）绝缘。 使用绝缘通道提供了一种成本有效的制造方法，并使所使用的器件材料的有效面积最大化。 通过此方法构建PTC组件。

    PROCESS FOR FABRICATING CIRCUIT ASSEMBLIES USING ELECTRODEPOSITABLE DIELECTRIC COATING COMPOSITIONS
    243.
    发明申请
    PROCESS FOR FABRICATING CIRCUIT ASSEMBLIES USING ELECTRODEPOSITABLE DIELECTRIC COATING COMPOSITIONS 审中-公开
    使用电沉积电介质涂料组合物制作电路组件的方法

    公开(公告)号：WO2004004428A1

    公开(公告)日：2004-01-08

    申请号：PCT/US2003/020357

    申请日：2003-06-27

    Applicant: PPG INDUSTRIES OHIO, INC.

    Inventor： MCCOLLUM, Gregory J. ,  MORIARITY, Thomas C. ,  OLSON, Kevin C. ,  SANDALA, Michael G. ,  WANG, Alan E. ,  ZAWACKY, Steven R.

    IPC: H05K1/05

    CPC classification number: H05K3/44 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/445 ,  H05K2201/09554 ,  H05K2203/0582 ,  H05K2203/135 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: Provided is a process for forming metallized vias in a substrate including the steps of (I) applying to an electroconductive substrate an electrodepositable coating composition onto all exposed surfaces of the substrate to form a conformal dielectric coating; (II) ablating a surface of the dielectric coating to expose a section of the substrate; (III) applying a layer of metal to all surfaces to form metallized vias in the substrate. Also disclosed are processes for fabricating a circuit assembly which include the application of an electrodoepositable coating composition onto exposed surfaces of the substrate/core to form a conformal dielectric coating thereon. The electrodepositable coating composition includes a resinous phase dispersed in an aqueous phase, where the resinous phase has a covalently bonded halogen content of at least 1 percent by weight. The dielectric coating derived therefrom has a low dielectric constant and low dielectric loss factor.

    Abstract translation: 提供了一种用于在基底中形成金属化通孔的方法，包括以下步骤：（I）将可电沉积涂料组合物施加到导电基底上，以在基底的所有暴露表面上形成共形绝缘涂层; （II）烧蚀所述电介质涂层的表面以暴露所述衬底的一部分; （III）将金属层施加到所有表面以在基底中形成金属化通孔。 还公开了用于制造电路组件的方法，其包括将电沉积涂料组合物施加到基材/芯的暴露表面上以在其上形成共形绝缘涂层。 电沉积涂料组合物包括分散在水相中的树脂相，其中树脂相具有至少1重量％的共价键合的卤素含量。 由此得到的电介质涂层具有低介电常数和低介电损耗因子。

    FEEDTHROUGH VIA CONNECTION METHOD AND APPARATUS
    245.
    发明申请
    FEEDTHROUGH VIA CONNECTION METHOD AND APPARATUS 审中-公开
    通过连接方法和装置进行

    公开(公告)号：WO1994021098A1

    公开(公告)日：1994-09-15

    申请号：PCT/US1994000648

    申请日：1994-01-18

    Applicant: MOTOROLA INC.

    Inventor： MOTOROLA INC. ,  OSTREM, Fred, E. ,  OCKEN, Alfred, G.

    IPC: H05K01/02

    CPC classification number: H05K3/44 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K3/4038 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977

    Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101). A solderable contact area (103), is located on the plate (101). Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109) is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. A quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

    Abstract translation: 通过连接构造馈通方法和相应的装置包括金属板（101）。 可焊接接触区域（103）位于板（101）上。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，在粘合剂层（105）上设置基板（109）。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 将一定数量的焊料（113）设置在可焊接区域（111）上，并加热组件（100），使得焊料（113）流入通孔（106）和（110），从而提供电连接，包括 通路（110）的可焊接区域（111），焊料（113）和接触区域（103）。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。

    METAL CORE WIRING BOARD
    247.
    发明申请
    METAL CORE WIRING BOARD 审中-公开
    金属核心接线板

    公开(公告)号：WO1990007857A1

    公开(公告)日：1990-07-12

    申请号：PCT/JP1986000386

    申请日：1986-07-22

    Applicant: ENDOH, Satoru ,  OHNISHI, Katsuya;

    IPC: H05K01/05

    CPC classification number: H05K3/0061 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/321 ,  H05K3/386 ,  H05K3/4092 ,  H05K3/4623 ,  H05K3/4635 ,  H05K3/4641 ,  H05K2201/056 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10924

    Abstract: A metal core printed wiring board in which a large number of lead terminal such as of an IC or an LSI are formed by etching or the like method at an edge of at least one end of a conductive substrate that serves as a core, the core and the terminals are bonded together with an insulating bonding material maintaining electrical insulation, a conductive circuit pattern is formed directly on the surface of the insulating bonding material, or a printed board on which the wiring has been printed is adhered onto the surface of the insulating bonding material, in order to increase the density of mounting, to facilitate the connection to other circuit substrates such as mother boards, and to decrease the volume of circuit.

    Abstract translation: 在作为核心的导电性基材的至少一端的边缘，通过蚀刻或类似方法形成诸如IC或LSI等大量引线端子的金属芯印刷电路板，芯 并且端子通过保持电绝缘的绝缘接合材料接合在一起，直接在绝缘接合材料的表面上形成导电电路图案，或者已经印刷有布线的印刷电路板粘附到绝缘体的表面上 接合材料，以增加安装密度，以便于连接到诸如母板的其它电路基板，并且减小电路的体积。

    Ground via reinforcing preamplifier heat release in the hard disk drive
    250.
    发明专利
    Ground via reinforcing preamplifier heat release in the hard disk drive 有权

    公开(公告)号：JP5271557B2

    公开(公告)日：2013-08-21

    申请号：JP2008026940

    申请日：2008-02-06

    Applicant: 日東電工株式会社

    Inventor： カヤバン アレックス ,  ホゥ スズゥー−ハン ,  恭也 大薮 ,  ジョン マッカスリン マーティン

    IPC: H05K1/02

    CPC classification number: G11B33/1426 ,  G11B33/123 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09509 ,  H05K2201/09554

    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.

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