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    MOTOR
    262.
    发明申请
    MOTOR 失效
    发动机

    公开(公告)号：US20080218010A1

    公开(公告)日：2008-09-11

    申请号：US12030272

    申请日：2008-02-13

    Applicant: Toshifumi Hino ,  Nobuhiko Sato

    Inventor： Toshifumi Hino ,  Nobuhiko Sato

    IPC: H02K11/00

    CPC classification number: H05K3/445 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K3/0061 ,  H05K3/306 ,  H05K3/3421 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10287

    Abstract: The present invention provides a motor that enables a lead of a coil to be appropriately led through holes, while allowing the lead of the coil to be fixed without contacting a wall surface of the hole in a base. Cuts 14b are formed in an insulating sheet or a printed circuit board 14; the cuts 14b extend substantially radially or spirally from a lead lead-out portion 14a as a center. Thus, even if an end of the lead 7a abuts against an area located outside the lead lead-out portion 14a, the abutting area and a nearby area located in the vicinity of the abutting area are pushed open along the cuts 14b extending from the lead lead-out portion 14a and guide the end of the lead 7a toward the lead lead-out portion 14a. The end of the lead 7a is thus appropriately guided into the lead lead-out portion 14a.

    Abstract translation: 本发明提供一种电动机，其能够使线圈的引线适当地引导通孔，同时允许线圈的引线固定而不接触基座中的孔的壁表面。 切口14b形成在绝缘片或印刷电路板14中; 切口14b从作为中心的引线引出部分14a基本上径向或螺旋地延伸。 因此，即使引线7a的一端与位于引出引出部分14a外部的区域邻接，位于邻接区域附近的邻接区域和附近区域沿着延伸的切口14b被推开 从引出引出部分14a引导引线7a的端部朝向引出引出部分14a。 引线7a的端部被适当地引导到引出引出部分14a中。

    DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES
    263.
    发明申请
    DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES 有权
    数字打印板和系统与静电拼接可变形膜

    公开(公告)号：US20080141877A1

    公开(公告)日：2008-06-19

    申请号：US11613159

    申请日：2006-12-19

    Applicant: Dirk De Bruyker ,  JengPing Lu ,  Jurgen H. Daniel ,  Eugene M. Chow ,  Armin R. Volkel

    Inventor： Dirk De Bruyker ,  JengPing Lu ,  Jurgen H. Daniel ,  Eugene M. Chow ,  Armin R. Volkel

    IPC: B41M1/10

    CPC classification number: B41M1/10 ,  B41M1/04 ,  B41M1/06 ,  H05K3/207 ,  H05K2201/091 ,  H05K2203/105

    Abstract: A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.

    Abstract translation: 打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电 区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素 膜受到冲击以返回到未偏转的状态。

    Tabbed circuit board and method for manufacturing same
    264.
    发明授权
    Tabbed circuit board and method for manufacturing same 失效
    标签电路板及其制造方法

    公开(公告)号：US07377787B1

    公开(公告)日：2008-05-27

    申请号：US11626411

    申请日：2007-01-24

    Applicant: Eric O. Eriksson

    Inventor： Eric O. Eriksson

    IPC: H01R12/00

    CPC classification number: H05K1/189 ,  F21S4/20 ,  F21Y2115/10 ,  H05K2201/046 ,  H05K2201/091 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10S362/80

    Abstract: A circuit board for receiving and operably connecting a plurality of electrical components generally comprises: a flexible substrate of a predetermined length and having a first lateral edge and a second lateral edge; a conductive trace applied to the flexible substrate; and a plurality of integral tabs arrayed along the first lateral edge, one or more electrical components being operably connected to the conductive trace at a respective tab, and wherein each tab can be manipulated from a first position in which the tab is aligned with the remainder of the substrate to a second position in which the tab is oriented at an angle relative to the remainder of the substrate.

    Abstract translation: 用于接收和可操作地连接多个电气部件的电路板通常包括：具有预定长度并具有第一侧边缘和第二侧边缘的柔性基板; 施加到柔性基板的导电迹线; 以及沿着所述第一侧边缘排列的多个整体的舌片，一个或多个电气部件在相应的突片处可操作地连接到所述导电迹线，并且其中每个突片可以从所述突片与所述其余部分对准的第一位置被操纵 的基板到第二位置，其中突片相对于基板的其余部分以一定角度取向。

    CONNECTION CONFIGURATION FOR RIGID SUBSTRATES
    267.
    发明申请
    CONNECTION CONFIGURATION FOR RIGID SUBSTRATES 失效
    刚性基板的连接配置

    公开(公告)号：US20070202306A1

    公开(公告)日：2007-08-30

    申请号：US11679733

    申请日：2007-02-27

    Applicant: Shinichi Nikaldo ,  Hiroki Maruo

    Inventor： Shinichi Nikaldo ,  Hiroki Maruo

    IPC: B32B1/00

    CPC classification number: B32B27/38 ,  B32B3/06 ,  B32B3/18 ,  B32B7/045 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/36 ,  B32B2262/062 ,  B32B2262/101 ,  B32B2457/08 ,  H05K1/148 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2203/1572 ,  Y10T428/24802

    Abstract: There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

    Abstract translation: 提供了一种结构，其中刚性基板通过柔性基板连接，该连接结构具有一对刚性基板，每个刚性基板在其前表面和后表面上均具有预定的电路图案，第一柔性基板安装在 一对刚性基板，以便电连接分别在前表面上设置的电路图形，第二柔性基板安装在该对刚性基板的相反表面上，以便电连接分别设置在反面上的电路图案 。 第一和第二基板之间的间隙小于一对刚性基板的厚度。

    Solderless component packaging and mounting
    269.
    发明授权
    Solderless component packaging and mounting 失效
    无焊件组件封装和安装

    公开(公告)号：US07061076B2

    公开(公告)日：2006-06-13

    申请号：US10918679

    申请日：2004-08-12

    Applicant: Stephen R. Shiffer

    Inventor： Stephen R. Shiffer

    IPC: H01L23/58

    CPC classification number: H05K1/184 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09981 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

    Abstract translation: 一种用于提供一个或多个电子部件的三维载体安装的装置和方法。 根据一个实施例，本发明的装置安装装置包括具有至少两个维度的部件安装表面的弹性弹性塑料基板。 至少一个按压配合部件插入腔设置在部件安装表面内，以在压配合到腔中时提供电子部件的压缩保持。 优选地，空腔具有这样的深度，使得当组件被压配合时，其不延伸到空腔的表面平面之上。 插入腔的特征还在于包括设置在所述插入腔的内表面上并定位在插入腔表面上的至少一个导电迹线，使得导电迹线接触保持在插入腔内的电子器件的至少一个引线。

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