Abstract:
본 발명은 커패시터가 없는 SBE 디램 셀 트랜지스터에 관한 것으로서, 보다 구체적으로는 충돌 이온화(Impact Ionization)에 의해 생성되는 홀이 빠져나가는 것을 물리적으로 방해하기 위하여 형성된 이산화실리콘(SiO 2 ) 장벽; 이산화실리콘 장벽의 상단에 형성되는 한 쌍의 실리콘(Si) 소스/드레인 층; 상기 이산화실리콘(SiO 2 ) 장벽에 둘러싸이며, 상기 한 쌍의 실리콘 소스/드레인 층 사이에 인접하여 형성되는, 결정구조의 실리콘(Si) 채널 층; 및 상기 실리콘 채널 층 하단에 이종 접합되며 충돌 이온화에 의해 생성되는 홀을 저장하는 실리콘저마늄(SiGe)층을 포함하는 것을 그 구성상의 특징으로 한다. 본 발명에서 제안하고 있는 커패시터가 없는 SBE 디램 셀 트랜지스터에 따르면, 실리콘 채널 아래에 있는 실리콘저마늄 층이, 실리콘 층과 실리콘저마늄 층 사이의 밴드 오프셋을 이용하여 홀을 가둠으로써 전하 유지 특성을 향상시킬 수 있다. 또한, 반복된 실리콘/실리콘저마늄 구조를 통하여 격자의 불일치로 인한 결함을 줄일 수 있으며, 이산화실리콘으로 만들어진 물리적인 장벽이 홀의 저장 공간과 소스/드레인을 분리시켜 데이터 '1'의 쓰기 동작 동안 생성된 홀들이 빠져 버리는 것과 홀을 저장하는 실리콘저마늄층에서의 SRH 재결합이 발생하는 것 모두를 차단할 수 있다. 뿐만 아니라, 상부 게이트 워드 라인과 하부 게이트 워드 라인을 다른 금속 층으로 구성하고, 셀 배열에서 소스를 한 개의 비트 라인으로 공유하여 결과적으로 셀의 최소 배선 폭을 줄여 4F 2 의 셀 크기를 얻을 수 있다.
Abstract:
PURPOSE: A multi-bit-per cell non-volatile memory cell and a method of operating for the multi-bits cell operation are provided to perform in rapidly at a lower voltage while a recording and erasing operation by using reading a gate induced drain leakage. CONSTITUTION: An active pin for a source and a drain region is patterned at the both sides of a silicon substrate by using a hard mask pattern with a mask. An oxide film is deposited after removing the hard mask pattern. The first oxide film is formed at the active area for resource and drain region. A poly-silicon is deposited. T-shape gate is patterned by using a deposited poly-silicon with the hard mask. A second oxide film is formed on a gate region of T-shape.
Abstract:
Disclosed are a method for extracting the state density in a band gap of an amorphous oxide semiconductor thin film transistor, and a device therefor. The method for extracting the state density in a band gap of an amorphous oxide semiconductor thin film transistor according to an embodiment of the present invention comprises the steps of: measuring capacitance and conductance according to gate voltage relative to predetermined frequencies; calculating local capacitance formed by a local trap in a channel based on the measured capacitance and conductance; and extracting the state density in the band gap based on the calculated local capacitance. When the local capacitance is calculated, channel conductance formed at the channel is calculated using the measured capacitance and conductance. As the local capacitance is calculated based on the calculated channel conductance, entire state density in the band gap can be simply and rapidly extracted using only experimentally measured data without iteration procedures and complicated calculation. And local capacitance and free electrons capacitance can be separated quantitatively according to the gate voltage. [Reference numerals] (AA) Start; (BB) End; (S210) Measuring conductance and capacitance according to gate voltage relative to multiple frequencies; (S220) Calculating channel conductance formed at a channel by using the measured capacitance and conductance; (S230) Calculating local capacitance (C_loc) formed by a local trap in the channel based on the calculated channel conductance; (S240) Extracting state density in a band gap based on the calculated local capacitance
Abstract:
A method for extracting state density inside a band gap of a metal oxide semiconductor field effect transistor using an optical differential body factor and a device thereof are disclosed. The method for extracting the state density inside a band gap of a metal oxide semiconductor field effect transistor according to an embodiment of the present invention includes the steps of: measuring the drain current of a darkroom according to the gate voltage of the metal oxide semiconductor field effect transistor in the darkroom and measuring optical response drain current according to the gate voltage of the metal oxide semiconductor field effect transistor by irradiating the light of a predetermined light source; calculating a darkroom body factor according to the gate voltage using the measured darkroom drain current and calculating an optical response body factor according to the gate voltage using the measured optical response drain current; and extracting the state density inside a band gap of a metal oxide semiconductor field effect transistor based on the calculated darkroom body factor and the optical response body factor. The state density in an independent band of a threshold voltage gap can be extracted without omitting a complicated measurement process and the state density inside the band gap can be simply and rapidly extracted. [Reference numerals] (AA) Start; (BB) End; (S410) Measuring darkroom drain current according to gate voltage in a darkroom; (S420) Measuring optical response drain current according to gate voltage by radiating the light of a light source; (S430) Calculating a darkroom body factor using the darkroom drain current; (S440) Calculating the optical response body factor using the optical response drain current; (S450) Extracting the state density in the band gap based on the differentiation of the darkroom body factor and the optical response body factor
Abstract:
PURPOSE: A method for extracting a parasitic serial resistance element of an amorphous thin film transistor is provided to separate and extract various resistance elements by using structural parameters of a TFT, a current-voltage property, and a capacitance-voltage property. CONSTITUTION: A capacitance between a gate and a source of an amorphous thin film transistor and a capacitance between the gate and a drain thereof are measured(S210). A vertical resistance element is extracted among parasitic serial resistance elements(S220). Each contact resistant element and each bulk resistance element are separated and extracted(S230). A current between the drain and the source of the amorphous thin film transistor is measured(S240). A serial resistance value is extracted based on the current between the drain and the source(S250). A horizontal resistance element is extracted among the parasitic serial resistance element(S260). A transmission resistance element and a channel resistance element are separated and extracted from the horizontal resistance element(S270).