액 처리 장치 및 액 처리 방법
    21.
    发明公开
    액 처리 장치 및 액 처리 방법 有权
    液体处理装置和液体处理方法

    公开(公告)号:KR1020060064066A

    公开(公告)日:2006-06-12

    申请号:KR1020067004349

    申请日:2005-03-30

    CPC classification number: H01L21/67086 H01L21/6708

    Abstract: Treatment liquid supply nozzles (10) are individually arranged on both left and right sides of a semiconductor wafer (W) in a treatment vessel (1). A discharge opening of each of the nozzles (10) faces the semiconductor wafer (W). According to a predetermined procedure, a treatment liquid is discharged from one or more selected nozzles (10). To perform chemical liquid treatment, for example, first a chemical liquid is discharged from nozzles (10) on the lowermost positions, and then nozzles (10) for discharging the chemical liquid are sequentially changed to upper ones. To perform rinse treatment while the chemical liquid in the treatment vessel (1) is replaced with a rinse liquid, for example, first the rinse liquid is discharged from the nozzles (10) on the lowermost positions, and then the rinse liquid is discharged from all the nozzles (10). By this, liquid treatment is improved in efficiency and uniformity.

    Abstract translation: 处理液供给喷嘴(10)分别设置在处理容器(1)中的半导体晶片(W)的左右两侧。 每个喷嘴(10)的排出口面向半导体晶片(W)。 根据预定的步骤,从一个或多个选定的喷嘴(10)排出处理液。 为了进行化学液处理,例如首先从最低位置的喷嘴(10)排出化学液,然后将用于排出药液的喷嘴(10)顺序地变更为上方。 为了在处理容器(1)中的化学液体被冲洗液体更换的情况下进行冲洗处理,例如首先将冲洗液从最下方的喷嘴(10)排出,然后将冲洗液从 所有喷嘴(10)。 由此,提高了液体处理的效率和均匀性。

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