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公开(公告)号：KR1020110015971A
公开(公告)日：2011-02-17
申请号：KR1020090073444
申请日：2009-08-10
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: An EMI noise reduction printed circuit board is provided to easily block the radiation noise radiated from an edge of a substrate by modifying the simple structure of the substrate. CONSTITUTION: A ground layer and a power layer are prepared on the first area. A second area(200) having electromagnetic band gap structure is located on a side of the first area. The second area comprises the electromagnetic band gap structure in order to shield the EMI noise emitting through the side of the first area to outside.
Abstract translation: 目的：提供EMI降噪印刷电路板，通过改变基板的简单结构，容易地阻挡从基板边缘辐射的辐射噪声。 构成：在第一个区域准备接地层和电源层。 具有电磁带隙结构的第二区域（200）位于第一区域的一侧。 第二区域包括电磁带隙结构，以便屏蔽通过第一区域的一侧发射到外部的EMI噪声。
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公开(公告)号：KR100956891B1
公开(公告)日：2010-05-11
申请号：KR1020080062015
申请日：2008-06-27
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01P1/2005 , H01L2223/6688 , H01L2224/16227 , H01L2224/16235 , H01L2924/15313
Abstract: 본 발명의 실시예에 따르면 3개 이상의 도전판; 상기 도전판들 중 어느 하나의 도전판을 기준으로 다른 하나의 도전판 간을 전기적으로 연결하는 제1 스티칭 비아; 및 상기 도전판들 중 상기 어느 하나의 도전판을 기준으로 또다른 하나의 도전판 간을 전기적으로 연결하는 제2 스티칭 비아를 포함하는 전자기 밴드갭 구조물이 제공될 수 있다. 여기서, 본 발명의 실시예에 따른 전자기 밴드갭 구조물은 상기 제1 스티칭 비아는 일부분이 상기 어느 하나의 도전판을 기준으로 상부 방향의 일 평면을 경유함을 통해, 상기 어느 하나의 도전판과 상기 다른 하나의 도전판 간을 전기적으로 연결하고, 상기 제2 스티칭 비아는 일부분이 상기 어느 하나의 도전판을 기준으로 하부 방향의 일 평면을 경유함을 통해, 상기 어느 하나의 도전판과 상기 또다른 하나의 도전판 간을 전기적으로 연결하는 것을 특징으로 할 수 있다.
인쇄회로기판, 전자기 밴드갭 구조, 스티칭 비아, 차등 길이.Abstract translation: 根据本发明的实施例，三个或更多个导电板; 通过将导电板之一电连接到关于导电板之一的另一个导电板的第一缝合; 并且可以提供通过将一个导电板电连接到另一个导电板相对于一个导电板的第二缝合线。 这里，在根据本发明实施例的电磁带隙结构中，第一缝合通路的一部分穿过相对于一个导电板的上方的一个平面， 并且第二缝合过孔电连接到另一个导电板，并且第二缝合过孔部分地相对于一个导电板在向下方向上穿过一个平面， 并且其中一个导电板被电连接。
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公开(公告)号：KR1020090100193A
公开(公告)日：2009-09-23
申请号：KR1020080062015
申请日：2008-06-27
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01P1/2005 , H01L2223/6688 , H01L2224/16227 , H01L2224/16235 , H01L2924/15313
Abstract: PURPOSE: An electromagnetic band gap structure and a printed circuit board are provided to solve conductive noise without using a by-pass capacitor or a decoupling capacitor. CONSTITUTION: An electromagnetic band gap structure is composed of more than 3 conductive plates, a first stitching via(645), and a second stitching via(649). The first and second stitching via electrically connect one conductive plate with another conductive plate respectively with passing one flat above them.
Abstract translation: 目的：提供电磁带隙结构和印刷电路板，以便在不使用旁路电容或去耦电容的情况下解决导电噪声。 构成：电磁带隙结构由多于3个导电板，第一缝合通孔（645）和第二缝合通孔（649）组成。 第一和第二缝合通过一个导电板与另一个导电板分别电连接，使其上的一个平板通过。
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公开(公告)号：KR100871346B1
公开(公告)日：2008-12-01
申请号：KR1020070061829
申请日：2007-06-22
Applicant: 삼성전기주식회사
CPC classification number: H01P1/2005 , H05K1/0236 , H05K1/116 , H05K2201/09627
Abstract: An electromagnetic bandgap structure and a printed circuit board are provided to obtain a low bandgap frequency while having a small size. A first dielectric layer is laminated on a first metal layer(320a). A mush type structure(330) includes a metal plate(332) laminated on the first dielectric layer and a via(334) of which one end is connected to the metal plate. A second dielectric layer(320b) is laminated on the metal plate and the first dielectric layer. The other end(334b) of the via is positioned in a hole(350) formed in the first metal layer and is connected to the first metal layer through the metal line. The other end of via is connected to a via land(360) positioned in the hole. The metal line(340) connects the via land and the first metal layer.
Abstract translation: 提供电磁带隙结构和印刷电路板以获得低带隙频率，同时具有小尺寸。 在第一金属层（320a）上层叠第一电介质层。 糊状结构（330）包括层叠在第一介电层上的金属板（332）和一端连接到金属板的通孔（334）。 第二电介质层（320b）层叠在金属板和第一电介质层上。 通孔的另一端（334b）位于形成在第一金属层中的孔（350）中，并且通过金属线连接到第一金属层。 通孔的另一端连接到定位在孔中的通孔焊盘（360）。 金属线（340）连接通孔焊盘和第一金属层。
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公开(公告)号：KR100851076B1
公开(公告)日：2008-08-12
申请号：KR1020070041989
申请日：2007-04-30
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to reduce a noise level by blocking the noise with a specific frequency. An electromagnetic band gap structure includes first and second metal layers(210-1,210-2), first and second dielectric layers(220a,220b), a metal plate(330), and a via(340). The first dielectric layer is formed on the first metal layer. The metal plate is formed on the first dielectric layer and has a hole(350). The via connects the first metal layer and the metal plate. The second dielectric layer is formed on the metal plate and the first dielectric layer. The second metal layer is formed on the second dielectric layer.
Abstract translation: 提供电磁带隙结构和印刷电路板以通过以特定频率阻挡噪声来降低噪声水平。 电磁带隙结构包括第一和第二金属层（210-1,210-2），第一和第二电介质层（220a，220b），金属板（330）和通孔（340）。 第一介电层形成在第一金属层上。 金属板形成在第一电介质层上并具有孔（350）。 通孔连接第一金属层和金属板。 第二电介质层形成在金属板和第一电介质层上。 第二金属层形成在第二介质层上。
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Patent Agency Ranking
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公开(公告)号：KR101942748B1
公开(公告)日：2019-01-28
申请号：KR1020180012039
申请日：2018-01-31
Applicant: 삼성전기주식회사
IPC: H01L25/065 , H01L23/28 , H01L23/485 , H01L23/64
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公开(公告)号：KR1020180055621A
公开(公告)日：2018-05-25
申请号：KR1020160164516
申请日：2016-12-05
Applicant: 삼성전기주식회사
IPC: H01L25/065 , H01L25/07 , H01L25/11 , H01L23/538 , H01L23/498 , H01L23/525 , H01L23/31
CPC classification number: H01L2224/18 , H01L2224/32145 , H01L2224/48091 , H01L2924/00014 , H01L25/0657 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5226 , H01L23/525 , H01L23/5383 , H01L23/5384 , H01L25/073 , H01L25/117
Abstract: 본개시는관통홀을갖는제1연결부재, 상기관통홀에배치된제1 및제2반도체칩, 상기제1연결부재와상기제1 및제2반도체칩의적어도일부를봉합하는봉합재, 및상기제1연결부재와상기제1 및제2반도체칩의활성면상에배치된제2연결부재를포함하며, 상기제2연결부재의재배선층은제1도체및 제2도체를통해상기제1접속패드및 상기제2접속패드와각각연결되되, 상기제2도체가상기제1도체보다높이가큰, 팬-아웃반도체패키지에관한것이다.
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公开(公告)号：KR1020110032601A
公开(公告)日：2011-03-30
申请号：KR1020090090166
申请日：2009-09-23
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: The printed circuit board equipped with the electromagnetic band gap structure easily reduces the various frequency bands of noises. In that way the power consumption can be reduced. CONSTITUTION: The first and the second electric conductor part are arranged on the each other different plane. The third electric conductor part is arranged on the second electric conductor part and the different plane. The first stitching via part(90) interlinks the first conductor part and the third electric conductor part via the plane in which the second electric conductor part is arranged.
Abstract translation: 目的：配备电磁带隙结构的印刷电路板可以轻松减少各种频段的噪音。 这样可以降低功耗。 构成：第一和第二导电体部分布置在彼此不同的平面上。 第三导体部分布置在第二导电体部分和不同的平面上。 第一缝合通孔部（90）经由配置有第二导电体部的平面将第一导体部和第三导电体部互相连接。
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公开(公告)号：KR1020110029814A
公开(公告)日：2011-03-23
申请号：KR1020090087645
申请日：2009-09-16
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0233 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0236 , H05K1/112 , H05K2201/086 , H05K2201/1003 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board including an electromagnetic bandgap structure is provided to reduce power consumption and manufacturing costs by easily reducing the noises of various frequency bands. CONSTITUTION: A bandgap structure comprises a first conductive plate(10), a second conductive plate(20), a third conductive plate(30), and a first stitching via unit(90). The second conductive plate is arranged on the plane different from the first conductive plate. The third conductive plate is arranged on the plane different from the second conductive plate. The first stitching via unit connects the first conductive plate and the third conductive plate via the second conductive plate. The stitching via unit includes a wiring line unit, a first via, and a second via.
Abstract translation: 目的：提供包括电磁带隙结构的印刷电路板，通过容易地减少各种频带的噪声来降低功耗和制造成本。 构成：带隙结构包括第一导电板（10），第二导电板（20），第三导电板（30）和第一缝合通孔单元（90）。 第二导电板布置在与第一导电板不同的平面上。 第三导电板设置在与第二导电板不同的平面上。 第一缝合通孔单元经由第二导电板连接第一导电板和第三导电板。 缝合通孔单元包括布线单元，第一通孔和第二通孔。
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