公开(公告)号：KR1020130127903A

公开(公告)日：2013-11-25

申请号：KR1020120144645

申请日：2012-12-12

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  김동원

IPC: A47L9/28 ,  A47L9/10 ,  A47L5/38

CPC classification number: A47L9/2873 ,  A47L5/38 ,  A47L9/0063 ,  A47L9/106 ,  A47L2201/022 ,  A47L2201/024

Abstract: A maintenance system and a cleaning system having the same by the present invention comprises a maintenance station with a robot cleaner having a first dust container to be seated in an indoor space; an intake port to absorb dust from the first dust container; and a dust removal device placed in an outdoor space and connected to the intake port. According to this, the present invention maintains the performance regardless of dust inside the dust container and improves space utilization for an indoor space.

Abstract translation: 具有本发明的维护系统和清洁系统包括具有机器人清洁器的维护站，该机器人清洁器具有第一灰尘容器，其位于室内空间中; 用于吸收来自第一灰尘容器的灰尘的进气口; 以及放置在室外空间并连接到进气口的除尘装置。 因此，本发明保持了灰尘储存器内的灰尘的性能，并提高了室内空间利用率。

公开(公告)号：KR1020130096990A

公开(公告)日：2013-09-02

申请号：KR1020120018652

申请日：2012-02-23

Applicant: 삼성전자주식회사

Inventor： 황선관 ,  박병률 ,  정현수 ,  천진호 ,  최길현

IPC: H01L21/60

CPC classification number: H01L23/49811 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2924/15311

Abstract: PURPOSE: A semiconductor device is provided to improve reliability by making uniform the height of a dummy solder bump. CONSTITUTION: A substrate (110) includes an integrated circuit part (112). A main solder bump (180a) is electrically connected to the integrated circuit part on the substrate. A dummy solder bump (180b) is electrically disconnected from the integrated circuit part on the substrate. The width of the dummy solder bump is narrower than the width of a line pattern formed in a lower part. The lower part of the dummy solder bump is actually flat.

Abstract translation: 目的：提供半导体器件以通过使虚拟焊料凸块的高度均匀化来提高可靠性。 构成：衬底（110）包括集成电路部分（112）。 主焊料凸块（180a）电连接到衬底上的集成电路部分。 虚拟焊料凸块（180b）与基板上的集成电路部分电气断开。 虚拟焊料凸块的宽度比形成在下部的线图案的宽度窄。 虚拟焊料凸块的下部实际上是平的。

公开(公告)号：KR1020130064482A

公开(公告)日：2013-06-18

申请号：KR1020110131114

申请日：2011-12-08

Applicant: 삼성전자주식회사

Inventor： 피재현 ,  최주일 ,  최길현 ,  박병률 ,  정현수

IPC: H01L21/768

CPC classification number: H01L21/67346 ,  H01L21/76898

Abstract: PURPOSE: A method for manufacturing a semiconductor device is provided to prevent a swelling phenomenon due to the penetration of a chemical solution and to improve process yield. CONSTITUTION: A via is formed in the first surface of a semiconductor wafer(S10). The first surface of the semiconductor wafer is adhered to a support carrier(S20). A thinning process is performed on the second surface of the semiconductor wafer(S30). A protection member is mounted to the support carrier in order to surround the semiconductor wafer(S40). A connection member connected to the via is formed in the second surface of the semiconductor wafer(S50). The protection member is separated from the support carrier(S60). The semiconductor wafer is divided into each semiconductor device(S70). [Reference numerals] (AA) Start; (BB) End; (S10) Provide a semiconductor wafer with a via on a first surface; (S20) Attach the semiconductor wafer so that the first surface faces a support carrier; (S30) Thin a second surface of the semiconductor wafer; (S40) Attach a protective member to surround the semiconductor wafer to the support carrier; (S50) Form a connection member connected to the second surface of the semiconductor wafer; (S60) Separate the protective member from the support carrier; (S70) Divide the semiconductor wafer into each semiconductor device

Abstract translation: 目的：提供一种制造半导体器件的方法，以防止由于化学溶液的渗透引起的溶胀现象并提高工艺成品率。 构成：在半导体晶片的第一表面形成通孔（S10）。 半导体晶片的第一表面粘附到支撑载体上（S20）。 在半导体晶片的第二表面上进行薄化处理（S30）。 为了包围半导体晶片，保护构件安装到支撑载体上（S40）。 连接到通孔的连接构件形成在半导体晶片的第二表面中（S50）。 保护构件与支撑托架分离（S60）。 半导体晶片被分成各个半导体器件（S70）。 （附图标记）（AA）开始; （BB）结束; （S10）在第一表面上提供具有通孔的半导体晶片; （S20）安装半导体晶片使得第一表面面向支撑载体; （S30）使半导体晶片的第二表面变薄; （S40）将保护构件附接到半导体晶片以将其固定到支撑载体上; （S50）形成连接到半导体晶片的第二表面的连接构件; （S60）将保护构件与支撑载体分开; （S70）将半导体晶片分割成各半导体器件

公开(公告)号：KR1020130021211A

公开(公告)日：2013-03-05

申请号：KR1020110083597

申请日：2011-08-22

Applicant: 삼성전자주식회사

Inventor： 장휘찬 ,  김동원 ,  정현수 ,  한승일 ,  이준화

IPC: A47L9/28 ,  G05D1/02 ,  B25J13/08

CPC classification number: G05D1/0227 ,  A47L2201/04 ,  G05D2201/0203

Abstract: PURPOSE: A robot cleaner and a method for controlling the same are provided to perform cleaning work without ceasing due to obstacles by changing the driving path of a main body after determining whether a displacement stays within a predetermined criteria range or not. CONSTITUTION: A robot cleaner comprises a driving wheel(120) which drives a main body; and a driving wheel assembly(100) including the driving wheel. A controlling method of the robot cleaner comprises: a step of detecting the displacement of the driving wheel from a reference position by sensing a sensing target which is prepared in the driving wheel assembly, a step of determining whether the displacement stays within the predetermined criteria range or not, and a step of changing the driving path of the main body if the displacement is off the predetermined criteria range. The driving wheel assembly comprises the detector sensing the sensing target. The detector senses the separation distance between the detector and the sensing target. The driving wheel assembly comprises a driving motor rotating the driving wheel. The detector senses an angle in which the sensing target moves around a rotary shaft of the driving motor.

Abstract translation: 目的：提供一种机器人清洁器及其控制方法，用于通过在确定位移是否在预定标准范围内变化来改变主体的驱动路径，由于障碍物而不停止地执行清洁工作。 构成：机器人清洁器包括驱动主体的驱动轮（120）; 以及包括所述驱动轮的驱动轮组件（100）。 机器人清洁器的控制方法包括：通过感测在驱动轮组件中准备的感测对象来检测驱动轮从参考位置的位移的步骤，确定位移是否保持在预定标准范围内的步骤 以及如果位移偏离预定标准范围，则改变主体的驱动路径的步骤。 驱动轮组件包括检测感测目标的检测器。 探测器感测探测器与感测目标之间的距离。 驱动轮组件包括旋转驱动轮的驱动马达。 检测器感测感测对象围绕驱动电动机的旋转轴移动的角度。

公开(公告)号：KR1020130001841A

公开(公告)日：2013-01-07

申请号：KR1020110062726

申请日：2011-06-28

Applicant: 삼성전자주식회사

Inventor： 김동원 ,  장휘찬 ,  이준화 ,  정현수

IPC: B25J19/00 ,  B25J13/00 ,  A47L11/00

CPC classification number: A47L9/009 ,  A47L2201/022 ,  A47L2201/04

Abstract: PURPOSE: A climbing device for a mobile robot, a robot climbing system, and a climbing method of the robot are provided to use the climbing device as a charging station by mounting a charging terminal in the climbing device. CONSTITUTION: A step climbing device(20) for a movable robot is placed at a step formed between first and second bottom sides at different heights. The upper surface of a climbing guide(21) is a inclined plane(21a) so that the movable robot climbs the first bottom side and the second bottom side.

Abstract translation: 目的：提供用于移动机器人的攀登装置，机器人爬梯系统和机器人的爬坡方法，通过在攀爬装置上安装充电终端来使用攀爬装置作为充电站。 构成：用于可移动机器人的踏板装置（20）被放置在不同高度处的第一和第二底面之间形成的台阶上。 爬坡导向件（21）的上表面是倾斜平面（21a），使得可移动机器人爬上第一底侧和第二底侧。

公开(公告)号：KR1020120046928A

公开(公告)日：2012-05-11

申请号：KR1020100108480

申请日：2010-11-03

Applicant: 삼성전자주식회사

Inventor： 장휘찬 ,  김동원 ,  정현수 ,  이준화

IPC: A47L9/28 ,  A47L9/16 ,  A47L11/20

CPC classification number: A47L11/33 ,  A47L9/1463 ,  A47L9/149 ,  A47L11/4025 ,  A47L11/4072 ,  A47L2201/00 ,  A47L2201/024

Abstract: PURPOSE: A robot cleaner, an automatic exhaust station, and a robot cleaner system therewith are provided to prevent dust from getting split to the outside using a first shutter which opens the inlet of a dust container when the dust container is installed in a main body and closes the inlet of the dust container when the dust container is separated from the main body. CONSTITUTION: A robot cleaner comprises a main body, a dust container(5), a second shutter(12), and a first shutter(11). The dust container is detachably installed in the main body and has a dust inlet. The second shutter is rotatably coupled to the dust container to open and close a part of the dust container. The first shutter is rotatably coupled to the dust container to open and close the other part of the dust container and is opened when the main body is pressed.

Abstract translation: 目的：提供机器人清洁器，自动排气站和机器人清洁器系统，以防止灰尘分解到外部时，使用第一挡板，当将贮尘容器安装在主体中时，打开灰尘容器的入口 当灰尘容器与主体分离时，关闭集尘器的入口。 构成：机器人清洁器包括主体，灰尘容器（5），第二挡板（12）和第一挡板（11）。 防尘容器可拆卸地安装在主体中并具有灰尘入口。 第二挡板可旋转地联接到贮尘容器以打开和关闭一部分灰尘容器。 第一挡板可旋转地联接到防尘容器上，以打开和关闭灰尘容器的另一部分，并且当主体被按压时打开。

公开(公告)号：KR101030769B1

公开(公告)日：2011-04-27

申请号：KR1020070007253

申请日：2007-01-23

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  장동현 ,  정태경 ,  김남석 ,  유승관

IPC: H01L23/12

CPC classification number: H01L24/19 ,  H01L23/13 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/18 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/30105 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: 스택 패키지 및 스택 패키징 방법이 개시된다. 본 발명의 스택 패키지는 본딩 패드를 구비하는 반도체 칩이 삽입되며 상기 반도체 칩이 삽입되는 캐비티와 상기 반도체 칩의 면적 차이에 의하여 연결 단자 홈이 형성되고 상기 본딩 패드와 연결되는 연결 단자가 상기 연결 단자 홈에 형성되는 인터포우저를 적어도 하나 이상 포함하며, 상기 인터포우저를 스택하고 상기 연결 단자를 연결함으로써 반도체 칩이 스택된다.

Abstract translation: 提供了堆叠包及其制造方法。 堆叠封装包括一个或多个插入件，其中插入具有焊盘的半导体芯片，由于半导体芯片和插入半导体芯片的空腔之间的区域的差异而形成互连端子槽，并且 连接到接合焊盘的互连端子形成在互连端子槽中。 在堆叠封装中，插入物彼此堆叠，并且互连端子彼此连接，使得一个或多个半导体芯片被堆叠并电连接。

公开(公告)号：KR1020090128102A

公开(公告)日：2009-12-15

申请号：KR1020080054120

申请日：2008-06-10

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  이동호 ,  장동현 ,  안은철 ,  이건구 ,  신창우

IPC: H01L21/82

CPC classification number: H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: A fuse structure of a semiconductor device and a method of forming the same are provided to prevent infiltration of moisture by covering a fuse with a protective pattern after laser repair. CONSTITUTION: In a device, an insulating layer pattern structure is formed on a semiconductor substrate and has an opening. A fuse(130) is arranged within the opening. A passivation layer pattern is formed within the opening of the insulating layer pattern in order to cover fuse. A first interlayer dielectric film pattern(120) is formed on the semiconductor substrate and has a first opening accepting the fuse. A second interlayer dielectric film pattern(140) is formed on the first interlayer dielectric film pattern. A second interlayer dielectric film pattern has the second opening which accepts the passivation layer pattern while being communicated with the first opening.

Abstract translation: 目的：提供半导体器件的熔丝结构及其形成方法，以在激光修复之后通过用保护图案覆盖保险丝来防止湿气渗透。 构成：在器件中，在半导体衬底上形成绝缘层图案结构并具有开口。 保险丝（130）布置在开口内。 在绝缘层图案的开口内形成钝化层图案以覆盖保险丝。 第一层间电介质膜图案（120）形成在半导体衬底上并且具有接受保险丝的第一开口。 在第一层间电介质膜图案上形成第二层间电介质膜图案（140）。 第二层间电介质膜图案具有第二开口，其接受钝化层图案同时与第一开口连通。

公开(公告)号：KR1020090042574A

公开(公告)日：2009-04-30

申请号：KR1020070108414

申请日：2007-10-26

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  이동호 ,  황성덕 ,  강선원 ,  김기혁

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H05K1/0271 ,  H01L23/498 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/12044 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2203/1572

Abstract: A semiconductor module and an electronic device are provided to prevent cracks of solder balls, thereby improving reliability of a product. A semiconductor module(100) comprises a semiconductor chip(140) and a module substrate(110). Semiconductor chips have solder balls(142). The semiconductor chips are arranged on the module substrate. The module substrate has a buffer layer(114). The buffer layers are arranged on the module substrate corresponding to the semiconductor chips. And an electronic device comprises the semiconductor module. The electronic device is a computer, a portable multimedia player or a memory card.

Abstract translation: 提供半导体模块和电子装置以防止焊球的裂纹，从而提高产品的可靠性。 半导体模块（100）包括半导体芯片（140）和模块基板（110）。 半导体芯片具有焊球（142）。 半导体芯片布置在模块基板上。 模块衬底具有缓冲层（114）。 缓冲层布置在对应于半导体芯片的模块衬底上。 并且电子设备包括半导体模块。 电子设备是计算机，便携式多媒体播放器或存储卡。

公开(公告)号：KR100871709B1

公开(公告)日：2008-12-08

申请号：KR1020070035176

申请日：2007-04-10

Applicant: 삼성전자주식회사

Inventor： 정현수 ,  이동호 ,  김남석 ,  황선관

IPC: H01L23/12

CPC classification number: H01L23/525 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01049

Abstract: 본 발명은 재배선공정을 통해 스크라이브 라인에 패드를 배열하여 서로 다른 크기를 갖는 반도체 칩들을 적층시켜 줌으로써 패키지 두께를 감소시켜 줄 수 있는 칩 스택 패키지 및 그 제조방법을 개시한다.
본 발명의 칩 스택 패키지는 기판의 일면에 다수의 회로 패턴들이 배열되고, 단위 반도체칩이 실장된다. 상기 단위 반도체 칩은 상기 기판의 일면상에 순차 적층되고, 그의 활성면에 각각 다수의 패드들을 구비하는 다수의 반도체 칩을 구비한다. 상기 단위 반도체 칩의 반도체 칩들은 서로 다른 다이 사이즈를 갖는다. 상기 반도체 칩들중 하나의 반도체 칩은 제1칩 영역에 배열되는 다수의 제1패드들을 구비하고, 나머지 반도체 칩들은 스크라이브 영역에 의해 한정되는 제2칩 영역을 벗어나 상기 스크라이브 영역에 배열되는 다수의 제2패드들을 각각 구비한다. 상기 단위 반도체 칩의 상기 반도체 칩들과 상기 기판의 상기 회로 패턴들은 다수의 연결부재를 통해 전기적으로 연결된다. 상기 단위 반도체 칩과 상기 연결부재들은 봉지부에 의해 피복된다.