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公开(公告)号：KR100759372B1
公开(公告)日：2007-10-04
申请号：KR1020060061960
申请日：2006-07-03
Applicant: 한국과학기술원
CPC classification number: B32B7/02 , B32B25/02 , B32B25/14 , B32B2307/102
Abstract: A multilayer composite material for absorbing underwater sound is provided to lower a surface reflection coefficient under the water and to control sound absorption performance. A multilayer composite material for absorbing underwater sound is composed of a non-reflective surface layer(100) with sound reflectivity within 1% and a sound absorbing layer(200) formed in the surface layer to absorb sound. The surface layer and the sound absorbing layer consist of base rubber powder having sound impedance of 1.46~1.96MRay1 and glass transition temperature of -40~-60 deg.C, a cross-linking agent, and a reinforcing agent mixed with the cross-linking agent and dispersed in the base powder. The volume fraction of the reinforcing agent is gradually increased from the surface of the multi-layer composite material to the inside.
Abstract translation: 提供一种用于吸收水下声音的多层复合材料，以降低水下的表面反射系数并控制吸声性能。 用于吸收水下声音的多层复合材料由声反射率在1％以内的非反射表面层（100）和形成在表层中的吸音层（200）组成，以吸收声音。 表面层和吸声层由声阻抗为1.46〜1.96MRay1，玻璃化转变温度为-40〜-60℃的基础橡胶粉末组成，交联剂和与交联剂混合的增强剂， 交联剂并分散在基础粉末中。 增强剂的体积分数从多层复合材料的表面逐渐增加到内部。
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公开(公告)号：KR1020040069838A
公开(公告)日：2004-08-06
申请号：KR1020030006386
申请日：2003-01-30
Applicant: 한국과학기술원
IPC: G01B21/32
Abstract: PURPOSE: A sensor using a shape memory alloy and intelligent type composite material are provided to be employed for various appliances and various fields requiring fine variation by using one device replacing at least two devices in order to perform measurement and driving at the same time. CONSTITUTION: A sensor using shape memory alloy and intelligent type composite material are capable of calculating variation of an internal resistance value. Although the shape memory alloy is changed by external physical force, the shape memory alloy has an original shape above a predetermined temperature. After the shape memory alloy is changed into a required shape, the required shape is achieved through heating treatment. The shape memory alloy has a plate shape including a strain gauge pattern(200). On the intelligent type composite material(100) a pattern having a strain gauge function on the shape memory alloy is formed. A plate of the shape memory alloy includes nitinol alloy.
Abstract translation: 目的：提供一种使用形状记忆合金和智能型复合材料的传感器，用于各种设备和各种需要精细变化的领域，通过使用一个装置替换至少两个装置，以同时进行测量和驱动。 构成：使用形状记忆合金和智能型复合材料的传感器能够计算内部电阻值的变化。 虽然形状记忆合金由于外部物理力而改变，但形状记忆合金具有高于预定温度的原始形状。 在形状记忆合金变成所需形状之后，通过加热处理实现所需的形状。 形状记忆合金具有包括应变计图案（200）的板状。 在智能型复合材料（100）上，形成了在形状记忆合金上具有应变计功能的图案。 形状记忆合金的板包括镍钛诺合金。
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公开(公告)号：KR1020180117795A
公开(公告)日：2018-10-30
申请号：KR1020170050778
申请日：2017-04-20
Applicant: 한국과학기술원
Abstract: 본발명은기판; 기판상에형성되되개구부를포함하는절연층; 일단부가상기절연층으로각각덮이고타단부가상기개구부에서각각노출되되, 상기개구부에서서로이격되는, 한쌍의제 1 전극패턴; 상기한 쌍의제 1 전극패턴과상기기판사이에개재되되상기절연층내에매립되어배치된제 2 전극패턴; 및상기한 쌍의제 1 전극패턴사이의이격영역을메우도록형성된, CNT 구조체;를포함하는가스센서를제공한다.
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公开(公告)号：KR20180032888A
公开(公告)日：2018-04-02
申请号：KR20160122142
申请日：2016-09-23
Applicant: 한국과학기술원
CPC classification number: G01J5/0853 , G01J3/108 , G01J5/602 , G01J2005/604
Abstract: 본발명은파장선택형적외선센서및 이의제조방법에관한것으로, 보다상세히는입사되는적외선복사파장을선택할수 있도록공진파장을가변할수 있도록제조된파장선택형적외선센서및 이의제조방법에관한것이며, 본발명에의한파장선택형적외선센서는검출회로를포함하는기판(100), 상기기판(100)의상면에형성되는고정반사판(200), 상기기판(100)의상면에형성되되, 상기고정반사판(200)의양측에형성되는금속패드(300), 상기고정반사판(200)의상측에일정거리이격되어형성되는흡수부(400) 및상기고정반사판(200)과흡수부(400) 사이에형성되며, 상기고정반사판(200)과흡수부(400) 사이를상하로이동가능한이동반사판(500)을포함하며, 상기이동반사판(500)은입사되는적외선의파장에따라상하로움직여상기공기층(A)의간격을조절하는것을특징으로한다.
Abstract translation: 本发明涉及产生波长可选择红外线传感器的方法以及它们的，将更加具体地涉及一种波长可选择红外线传感器及其制造方法，以改变落在共振波长被选择的红外辐射波长，这是事件发生后，本发明的一个 在基板100的两侧波长可选择红外传感器中，基板100被固定反射器200和衣服上侧形成100所述基板，所述固定反射器200形成在服饰平面包括所述检测电路 以及形成在固定反射器200和吸收器400之间的吸收器400.吸收器400包括形成在固定反射器200上的金属垫300， 移动反射板500根据红外线的波长向上和向下移动以调节空气层A的间隔 而且，其特征在于。
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Patent Agency Ranking
公开(公告)号：KR1020160017195A
公开(公告)日：2016-02-16
申请号：KR1020140098547
申请日：2014-07-31
Applicant: 한국과학기술원
IPC: H01L21/027 , H01L21/60
CPC classification number: H01L21/0273
Abstract: 본발명은경사진관통구멍을구비한구조체의제조방법에관한것으로서, 더욱상세하게는소프트리소그래피를이용하여경사진관통구멍을구비한구조체를제조하는방법에관한것이다. 본발명에따른경사진관통구멍을구비한구조체의제조방법은, 경사진양각구조를구비한스탬프를준비하는단계와, 금속층이형성된기판상에고분자용액을도포하는단계와, 도포된고분자용액에상기스탬프를가압접촉시켜상기고분자용액에경사진음각구조를형성하는단계와, 상기고분자용액을경화하여경사진음각구조가형성된고분자층을형성하는단계와, 상기스탬프를경화된고분자층으로부터분리하는단계와, 상기고분자층의음각구조를식각하여상기금속층을노출시키는단계와, 노출된상기금속층과고분자층의음각구조에금속구조를형성하는단계와, 상기금속층과고분자층으로부터금속구조를분리하여경사진관통구멍을구비한구조체를얻는단계를포함한다. 본발명에따른경사진관통구멍을구비한구조체의제조방법에따르면, 종래의방법에비해서용이하게경사진관통구멍을구비한구조체를제조할수 있다.
Abstract translation: 本发明涉及一种用于制造包括倾斜通孔的结构的方法，更具体地说，涉及一种使用软光刻技术制造包括倾斜通孔的结构的方法。 根据本发明，用于制造包括倾斜通孔的结构的方法包括以下步骤：制备包括倾斜压花结构的印模; 将聚合物溶液施加到其上形成有金属层的基板上; 通过使施加的聚合物溶液和印模在压力下彼此接触来在聚合物溶液上形成倾斜的雕刻结构; 形成通过硬化聚合物溶液形成倾斜雕刻结构的聚合物层; 将印模与硬化的聚合物层分离; 通过蚀刻聚合物层的雕刻结构来暴露金属层; 在金属层和聚合物层的暴露的雕刻结构上形成金属结构; 以及通过从金属层和聚合物层分离金属结构，获得包括倾斜通孔的结构。 根据用于制造包括倾斜通孔的结构的方法，与常规方法相比，能够容易地制造包括倾斜通孔的结构。
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公开(公告)号：KR1020140106267A
公开(公告)日：2014-09-03
申请号：KR1020130020606
申请日：2013-02-26
Applicant: 한국과학기술원
IPC: H04N5/33
CPC classification number: H04N5/3651 , G01J5/24 , H04N5/33
Abstract: The present invention provides a circuit and a method for processing a signal for the acquisition of infrared image data which can automatically correct an infrared image in an analog circuit terminal without using a memory. The circuit for processing the signal for the acquisition of the infrared image data comprises: an infrared sensing unit of which electrical resistance varies when absorbing infrared rays; a self-heating unit of which one end is electrically connected to the other end of the infrared sensing unit and which applies Joule heat to the infrared sensing unit so that the electrical resistance of the infrared sensing unit can have a predetermined reference resistance value before absorbing the infrared rays; an integrator which integrates a difference between a voltage of the other end of the self-heating unit and a reference voltage, and outputs an integrated value as an infrared signal; and a feedback control unit of which one end is electrically connected to the integrator, and which compares and controls real-time output signals of the integrator to heat or cool the infrared sensing unit so that the electrical resistance of the infrared sensing unit can maintain the predetermined reference resistance value.
Abstract translation: 本发明提供一种用于处理用于获取红外图像数据的信号的电路和方法，该信号可以在不使用存储器的情况下自动校正模拟电路终端中的红外图像。 用于处理用于获取红外图像数据的信号的电路包括：红外感测单元，其在吸收红外线时电阻变化; 一个自身加热单元，其一端电连接到红外感测单元的另一端，并且对红外线感测单元施加焦耳热，使得红外感测单元的电阻在吸收之前可以具有预定的参考电阻值 红外线; 积分器，其将自发热单元的另一端的电压与参考电压的差积分，并输出积分值作为红外信号; 以及反馈控制单元，其一端电连接到积分器，并且比较和控制积分器的实时输出信号以加热或冷却红外感测单元，使得红外感测单元的电阻可以维持 预定参考电阻值。
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公开(公告)号：KR1020130095489A
公开(公告)日：2013-08-28
申请号：KR1020120016964
申请日：2012-02-20
Applicant: 한국과학기술원
Abstract: PURPOSE: A micro electron mechanical systems package is provided to maintain high vacuum and to improve durability. CONSTITUTION: A micro electron mechanical systems package includes a micro electro mechanical systems (MEMS) substrate (10), a capping substrate (20), and a sealing member (30). A MEMS device (11) is mounted on the MEMS substrate. The capping substrate covers the MEMS substrate. The sealing member is formed between the MEMS substrate and the capping substrate, and includes first and second bonding lines.
Abstract translation: 目的：提供微电子机械系统封装以保持高真空度并提高耐久性。 构成：微电子机械系统封装包括微电子机械系统（MEMS）衬底（10），封盖衬底（20）和密封构件（30）。 MEMS器件（11）安装在MEMS衬底上。 封盖基板覆盖MEMS基板。 密封构件形成在MEMS衬底和封盖衬底之间，并且包括第一和第二接合线。
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公开(公告)号：KR101250447B1
公开(公告)日：2013-04-08
申请号：KR1020110132858
申请日：2011-12-12
Applicant: 한국과학기술원
Abstract: PURPOSE: An MEMS device manufacturing method is provided to obtain excellent performance and shape by easily controlling the thickness of a film according to a device and obtain an MEMS device capable of utilizing an existing semiconductor process. CONSTITUTION: An MEMS device manufacturing method comprises; a step for forming a lower structure(12), a step for a chalcogenide carbon layer; a step for forming insulation-supporting layer on the chalcogenide carbon layer; a step for forming via-holes exposing the lower structure by forming an etched protection layer on the insulation-supporting layer and etching the insulation-supporting layer and the chalcogenide carbon layer; a step for forming an upper structure including a sensor(23) on an insulation-supporting layer; a step for forming one or more through-holes penetrating the insulation-supporting layer; a step for removing the chalcogenide carbon layer through the through-holes in order to arrange the upper and lower structure to be spaced.
Abstract translation: 目的：提供一种MEMS器件制造方法，通过根据器件轻松控制膜的厚度来获得优异的性能和形状，并获得能够利用现有半导体工艺的MEMS器件。 构成：MEMS器件制造方法包括： 形成下部结构（12）的步骤，硫族化物碳层的工序; 在硫族化物碳层上形成绝缘支撑层的步骤; 通过在绝缘支撑层上形成蚀刻保护层并蚀刻绝缘层和硫族化物碳层，形成露出下部结构的通孔的步骤; 在绝缘支撑层上形成包括传感器（23）的上部结构的步骤; 形成穿过绝缘支撑层的一个或多个通孔的步骤; 用于通过通孔去除硫族化物碳层以便将上部和下部结构间隔开的步骤。
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公开(公告)号：KR101180647B1
公开(公告)日：2012-09-19
申请号：KR1020110002456
申请日：2011-01-10
Applicant: 한국과학기술원
CPC classification number: G01J5/0225 , G01J5/20
Abstract: 본 발명의 일실시예에 따른 마이크로 볼로미터에서 필 팩터를 높이기 위한 픽셀 디자인은, 기판 상부의 반사 금속층을 포함하는 하부층; 상기 하부층 상부의 공동; 상기 공동 상부의 볼로미터층과 그 위의 투과 금속층을 포함하는 상부층; 상기 하부층 및 상기 상부층의 절연을 위한 절연층; 및 상기 상부층을 지지하는 앵커를 포함하는 각 볼로미터 픽셀들의 배열로 이루어진 볼로미터 어레이에 있어서, 상기 볼로미터 픽셀 네 개가 상기 앵커 하나를 공유하는 것을 특징으로 한다.
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