公开(公告)号：US20150123152A1

公开(公告)日：2015-05-07

申请号：US14533549

申请日：2014-11-05

Applicant: EPISTAR CORPORATION

Inventor： CHI-NAN LIN ,  CHIEN-FU SHEN ,  YU-CHEN YANG ,  Ching-Tung Tseng ,  Cheng-Hsiang Ho ,  Chun-Wei Chang ,  Chen Ou

IPC: H01L33/00 ,  H01L33/44 ,  H01L33/42 ,  H01L33/14 ,  H01L33/22

CPC classification number: H01L33/002 ,  H01L33/145 ,  H01L33/22 ,  H01L33/36 ,  H01L33/42 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2924/00014

Abstract: A light-emitting element includes a light-emitting stacked layer including an upper surface, wherein the upper surface includes a first flat region; a protective layer including a current blocking region on the first flat region; and a cap region on the upper surface, wherein the current blocking region is spatially separate from the cap region; and a first electrode covering the current blocking region.

Abstract translation: 发光元件包括包括上表面的发光层叠层，其中上表面包括第一平坦区域; 在第一平坦区域上包括电流阻挡区域的保护层; 以及在上表面上的盖区域，其中电流阻挡区域在空间上与盖区域分离; 以及覆盖电流阻挡区域的第一电极。

公开(公告)号：US09011638B2

公开(公告)日：2015-04-21

申请号：US14220060

申请日：2014-03-19

Applicant: Epistar Corporation

Inventor： Chen-Ke Hsu ,  Liang Sheng Chi ,  Chun-Chang Chen ,  Win-Jim Su ,  Hsu-Cheng Lin ,  Mei-Ling Tsai ,  Yi Lung Liu ,  Chen Ou

IPC: B32B38/10 ,  H01L21/66 ,  H01L21/67

CPC classification number: H01L22/20 ,  H01L21/67005 ,  H01L21/67132 ,  H01L21/67271 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1195 ,  Y10T156/1917 ,  Y10T156/1933 ,  Y10T156/1983

Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.

Abstract translation: 一种芯片分选方法包括：提供具有第一表面的芯片保持器; 在第一表面上提供多个芯片; 提供具有第二表面的芯片接收器，其中所述第二表面面向所述第一表面; 将多个芯片附接到第二表面; 降低多个芯片和第一表面之间的粘合力; 以及在减少所述多个芯片与所述第一表面之间的粘合力的步骤之后，从所述第一表面分离所述多个芯片。

公开(公告)号：US20140319559A1

公开(公告)日：2014-10-30

申请号：US13870008

申请日：2013-04-25

Applicant: EPISTAR CORPORATION

Inventor： Yi-Lin Guo ,  Chen Ou ,  Chi-Ling Lee ,  Wei-Han Wang ,  Hui-Tang Shen ,  Chi-Hung Wu ,  Hung-Chih Yang

IPC: H01L33/22 ,  H01L33/12

CPC classification number: H01L33/22 ,  H01L33/0079 ,  H01L33/12

Abstract: A light-emitting device includes: a light-emitting stack having an upper surface having a first surface roughness less than 0.2 nm; and an as-cut wafer comprising an irregularly uneven surface facing the light-emitting stack and having a second surface roughness greater than 0.5 μm.

Abstract translation: 发光装置包括：具有第一表面粗糙度小于0.2nm的上表面的发光叠层; 以及包括面向发光叠层的不规则凹凸表面并具有大于0.5μm的第二表面粗糙度的切割晶片。

公开(公告)号：US20140103376A1

公开(公告)日：2014-04-17

申请号：US14132819

申请日：2013-12-18

Applicant: EPISTAR CORPORATION

Inventor： Chen Ou ,  Chiu-Lin Yao

IPC: H01L33/22 ,  H01L33/24

CPC classification number: H01L33/20 ,  H01L33/12 ,  H01L33/22 ,  H01L33/24 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0091

Abstract: The disclosure provides a light-emitting device. The light-emitting device comprises: a substrate having a first patterned unit; and a light-emitting stack on the substrate and having an active layer with a first surface; wherein the first patterned unit, protruding in a direction from the substrate to the light-emitting stack, has side surfaces abutting with each other and substantially non-parallel to the first surface in cross-sectional view, and has a non-polygon shape in top view.

Abstract translation: 本发明提供一种发光装置。 发光器件包括：具有第一图案化单元的衬底; 以及在所述基板上的发光叠层，并且具有带有第一表面的有源层; 其中所述第一图案化单元在从所述基板到所述发光叠层的方向上突出，具有彼此邻接并且在横截面图中基本上不平行于所述第一表面的侧表面，并且具有非多边形形状 顶视图。

公开(公告)号：US08562738B2

公开(公告)日：2013-10-22

申请号：US13776312

申请日：2013-02-25

Applicant: Epistar Corporation

Inventor： Chen Ou ,  Wen-Hsiang Lin ,  Shih-Kuo Lai

IPC: C30B25/02

CPC classification number: H01L21/0262 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L33/007 ,  H01L33/12

Abstract: A nitride-based light-emitting device includes a substrate and a plurality of layers formed over the substrate in the following sequence: a nitride-based buffer layer formed by nitrogen, a first group III element, and optionally, a second group III element, a first nitride-based semiconductor layer, a light-emitting layer, and a second nitride-based semiconductor layer.

公开(公告)号：US20130240923A1

公开(公告)日：2013-09-19

申请号：US13836681

申请日：2013-03-15

Applicant: EPISTAR CORPORATION

Inventor： CHIA-LIANG HSU ,  Chen Ou ,  Chun-Hsiang Tu ,  De-Shan Kuo ,  Ting-Chia Ko ,  Po-Shun Chiu

IPC: H01L33/46 ,  H01L33/00

CPC classification number: H01L33/46 ,  H01L33/002 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode structure comprising: a substrate; a light-emitting semiconductor stack on the substrate, wherein the light-emitting semiconductor stack comprises a first semiconductor layer, a second semiconductor layer with different polarity from the first semiconductor layer, and a light-emitting layer between the first semiconductor layer and the second semiconductor layer; a first electrical pad on the substrate, wherein the first electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the first semiconductor layer; and a second electrical pad on the substrate, wherein the second electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the second semiconductor layer, wherein the first electrical pad and the second electrical pad are not higher than the light-emitting semiconductor stack.

Abstract translation: 一种发光二极管结构，包括：基板; 在所述基板上的发光半导体堆叠，其中，所述发光半导体堆叠包括第一半导体层，与所述第一半导体层具有不同极性的第二半导体层，以及所述第一半导体层与所述第二半导体层之间的发光层 半导体层; 在所述基板上的第一电焊盘，其中所述第一电焊盘与所述发光半导体堆叠分离并且电连接到所述第一半导体层; 以及在所述基板上的第二电焊盘，其中所述第二电焊盘离开所述发光半导体堆叠并且电连接到所述第二半导体层，其中所述第一电焊盘和所述第二电焊盘不高于所述发光 半导体堆叠

公开(公告)号：US20130164873A1

公开(公告)日：2013-06-27

申请号：US13776312

申请日：2013-02-25

Applicant: EPISTAR CORPORATION

Inventor： Chen Ou ,  Wen-Hsiang Lin ,  Shih-Kuo Lai

IPC: H01L33/00

CPC classification number: H01L21/0262 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L33/007 ,  H01L33/12

Abstract: A nitride-based light-emitting device includes a substrate and a plurality of layers formed over the substrate in the following sequence: a nitride-based buffer layer formed by nitrogen, a first group III element, and optionally, a second group III element, a first nitride-based semiconductor layer, a light-emitting layer, and a second nitride-based semiconductor layer.

Abstract translation: 氮化物系发光器件包括基板和在该基板上形成的多个层，其顺序如下：由氮形成的基于氮化物的缓冲层，第一III族元素和任选的第二III族元素， 第一氮化物基半导体层，发光层和第二氮化物基半导体层。

公开(公告)号：US11961939B2

公开(公告)日：2024-04-16

申请号：US17848079

申请日：2022-06-23

Applicant: EPISTAR CORPORATION

Inventor： Peng Ren Chen ,  Yu-Shan Chiu ,  Wen-Hsiang Lin ,  Shih-Wei Wang ,  Chen Ou

IPC: H01L33/22 ,  H01L33/00 ,  H01L33/02 ,  H01L33/06 ,  H01L33/12 ,  H01L33/32

CPC classification number: H01L33/22 ,  H01L33/007 ,  H01L33/025 ,  H01L33/06 ,  H01L33/12 ,  H01L33/32

Abstract: A method of manufacturing a light-emitting device, including: providing a substrate structure including a top surface; forming a precursor layer on the top surface; removing a portion of the precursor layer and a portion of the substrate from the top surface to form a base portion and a plurality of protrusions regularly arranged on the base portion; forming a buffer layer on the base portion and the plurality protrusions; and forming a III-V compound cap layer on the buffer layer; wherein one of the plurality of protrusions comprises a first portion and a second portion formed on the first portion; wherein the first portion is integrated with the base portion and has a first material which is the same as that of the base portion; and wherein the buffer layer contacts side surfaces of the plurality of protrusions and a surface of the base portion.

公开(公告)号：USD1012330S1

公开(公告)日：2024-01-23

申请号：US29758799

申请日：2020-11-18

Applicant: EPISTAR CORPORATION

Designer： Chen Ou ,  Li-Ming Chang ,  Chien-Fu Shen ,  Hsin-Ying Wang

Abstract: FIG. 1 is a perspective view of a light-emitting diode device showing a first embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view of a light-emitting diode device showing a second embodiment of our new design;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a left side view thereof;
FIG. 12 is a right side view thereof;
FIG. 13 is a top plan view thereof;
FIG. 14 is a bottom plan view thereof;
FIG. 15 is a perspective view of a light-emitting diode device showing a third embodiment of our new design;
FIG. 16 is a front elevational view thereof;
FIG. 17 is a rear elevational view thereof;
FIG. 18 is a left side view thereof;
FIG. 19 is a right side view thereof;
FIG. 20 is a top plan view thereof;
FIG. 21 is a bottom plan view thereof;
FIG. 22 is a perspective view of a light-emitting diode device showing a fourth embodiment of our new design;
FIG. 23 is a front elevational view thereof;
FIG. 24 is a rear elevational view thereof;
FIG. 25 is a left side view thereof;
FIG. 26 is a right side view thereof;
FIG. 27 is a top plan view thereof; and,
FIG. 28 is a bottom plan view thereof.
The broken lines illustrate portions of the light-emitting diode device and form no part of the claimed design.

公开(公告)号：USD972769S1

公开(公告)日：2022-12-13

申请号：US29776714

申请日：2021-03-31

Applicant: EPISTAR CORPORATION

Designer： Hui-Fang Kao ,  Yao-Ning Chan ,  Yi-Tang Lai ,  Yun-Chung Chou ,  Shih-Chang Lee ,  Chen Ou