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公开(公告)号：US20140159090A1
公开(公告)日：2014-06-12
申请号：US14098707
申请日：2013-12-06
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu HUANG , Chiu-Lin YAO
IPC: H01L33/46
CPC classification number: H01L33/46 , H01L33/02 , H01L33/22 , H01L33/38 , H01L33/44 , H01L2933/0091
Abstract: A light-emitting device is disclosed and comprises: a semiconductor stack; a transparent substrate comprising a first material; a bonding layer which bonds the semiconductor stack and the transparent substrate; and a medium in the transparent substrate, the medium comprising a second material different from the first material.
Abstract translation: 公开了一种发光器件，包括：半导体叠层; 透明基板，包括第一材料; 键合所述半导体堆叠和所述透明基板的接合层; 以及在所述透明基板中的介质，所述介质包括与所述第一材料不同的第二材料。
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公开(公告)号：US20140070250A1
公开(公告)日：2014-03-13
申请号：US13856220
申请日：2013-04-03
Applicant: Epistar Corporation
Inventor： Shih-I CHEN , Tsung-Xian LEE , Yi-Ming CHEN , Wei-Yu CHEN , Ching- Pei LIN , Min-Hsun HSIEH , Cheng-Nan HAN , Tien-Yang WANG , Hsing-Chao CHEN , Hsin-Mao LIU , Zong-Xi CHEN , Tzu-Chieh HSU , Chien-Fu HUANG , Yu-Ren PENG
IPC: H01L33/50
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/44 , H01L33/505 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting device of an embodiment of the present application comprises a substrate; a first semiconductor light-emitting structure formed on the substrate, wherein the first semiconductor light-emitting structure comprises a first semiconductor layer having a first conductivity type, a second semiconductor layer having a second conductivity type and a first active layer formed between the first semiconductor layer and the second semiconductor layer, wherein the first active layer is capable of emitting a first light having a first dominant wavelength; and a first thermal-sensitive layer formed on a path of the first light, wherein the first thermal-sensitive layer comprises a material characteristic which varies with a temperature change.
Abstract translation: 本申请的实施方式的发光装置包括：基板; 形成在所述基板上的第一半导体发光结构，其中所述第一半导体发光结构包括具有第一导电类型的第一半导体层，具有第二导电类型的第二半导体层和形成在所述第一半导体层之间的第一有源层 层和第二半导体层，其中第一有源层能够发射具有第一主波长的第一光; 以及形成在所述第一光的路径上的第一热敏层，其中所述第一热敏层包括随温度变化而变化的材料特性。
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公开(公告)号：US20140021505A1
公开(公告)日：2014-01-23
申请号：US14038969
申请日：2013-09-27
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu HUANG , Shiuan-Leh LIN , Chih-Chiang LU , Chia-Liang HSU
IPC: H01L33/46
CPC classification number: H01L33/12 , H01L33/0079 , H01L33/02 , H01L33/10 , H01L33/22 , H01L33/30 , H01L33/32 , H01L33/46 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0091
Abstract: This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer formed on the substrate; a transparent bonding layer; a first semiconductor window layer bonded to the semiconductor layer through the transparent bonding layer; and a light-emitting stack formed on the first semiconductor window layer. The intermediate layer has a refractive index between the refractive index of the substrate and the refractive index of the first semiconductor window layer.
Abstract translation: 本公开公开了一种发光装置。 发光装置包括：基板; 形成在所述基板上的中间层; 透明结合层; 通过透明结合层与半导体层接合的第一半导体窗口层; 以及形成在第一半导体窗口层上的发光叠层。 中间层具有基板的折射率与第一半导体窗口层的折射率之间的折射率。
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公开(公告)号：US20240186447A1
公开(公告)日：2024-06-06
申请号：US18439378
申请日：2024-02-12
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu HUANG , Chih-Chiang LU , Chun-Yu LIN , Hsin-Chih CHIU
CPC classification number: H01L33/02 , H01L22/12 , H01L22/14 , H01L24/24 , H01L25/0753 , H01L33/62 , H01L33/36 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066
Abstract: The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.
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公开(公告)号：US20230187473A1
公开(公告)日：2023-06-15
申请号：US18105045
申请日：2023-02-02
Applicant: Epistar Corporation
Inventor： Chien-Fu SHEN , Chao-Hsing CHEN , Tsun-Kai KO , Schang-Jing HON , Sheng-Jie HSU , De-Shan KUO , Hsin-Ying WANG , Chiu-Lin YAO , Chien-Fu HUANG , Hsin-Mao LIU , Chien-Kai CHUNG
CPC classification number: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/44 , H01L33/62 , H01L33/382 , H01L33/385 , H01L2924/0002
Abstract: A light-emitting device includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and the second light-emitting structure unit includes a second sidewall; an isolation layer formed on the first sidewall and the second sidewall, including a first edge on the first light-emitting structure unit and wherein the first edge has an acute angle in a cross-sectional view; and an electrical connection formed on the isolation layer, the first light-emitting structure unit and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall and the second sidewall are inclined; and wherein the electrical connection includes a first part on the first light-emitting structure unit, and the first part does not overlap the first edge of the isolation layer.
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Patent Agency Ranking
公开(公告)号：US20210183942A1
公开(公告)日：2021-06-17
申请号：US17170407
申请日：2021-02-08
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu SHEN , Chao-Hsing CHEN , Tsun-Kai KO , Schang-Jing HON , Sheng-Jie HSU , De-Shan KUO , Hsin-Ying WANG , Chiu-Lin YAO , Chien-Fu HUANG , Hsin-Mao LIU , Chien-Kai CHUNG
Abstract: A light-emitting device, includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and a second sidewall; a trench between the first and the second light-emitting structure units; and an electrical connection arranged on the first sidewall and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall connects to the top surface; wherein the first sidewall faces the second light-emitting structure units, and the second sidewall is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the second sidewall is steeper than the first sidewall.
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公开(公告)号：US20180287031A1
公开(公告)日：2018-10-04
申请号：US16001676
申请日：2018-06-06
Applicant: EPISTAR CORPORATION
Inventor： Shih-I CHEN , Chia-Liang HSU , Tzu-Chieh HSU , Han-Min WU , Ye-Ming HSU , Chien-Fu HUANG , Chao-Hsing CHEN , Chiu-Lin YAO , Hsin-Mao LIU , Chien-Kai CHUNG
IPC: H01L33/62 , H01L33/60 , H01L27/15 , H01L33/08 , H01L33/10 , H01L25/075 , H01L33/48 , H01L33/46 , H01L33/44 , H01L33/42 , H01L33/38 , H01L33/14 , H01L33/40 , H01L33/32
Abstract: A light-emitting device includes a supportive substrate and a first light-emitting element on the supportive substrate. The first light-emitting element includes a first light-emitting stacked layer having a first surface and a second surface opposite to the first surface, and a first transparent layer on the first surface and electrically connected to the first light-emitting stacked layer. A second light-emitting element locates on the supportive substrate and a metal layer electrically connects to the first light-emitting element and the second light-emitting element and physically connects to the first transparent layer. The first light-emitting stacked layer includes a first width and the first transparent layer includes a second width different from the first width from a cross section view of the light-emitting device.
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公开(公告)号：US20180006206A1
公开(公告)日：2018-01-04
申请号：US15702286
申请日：2017-09-12
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu HUANG , Yao-Ning CHAN , Tzu Chieh HSU , Yi-ming CHEN , Hsin-Chih CHIU , Chih-Chiang LU , Chia-liang HSU , Chun-Hsien CHANG
CPC classification number: H01L33/62 , H01L25/167 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/385 , H01L33/48 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066
Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.
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公开(公告)号：US20160218247A1
公开(公告)日：2016-07-28
申请号：US14902795
申请日：2013-07-05
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu HUANG , Yao-Ning CHAN , Tzu Chieh HSU , Yi Ming CHEN , Hsin-Chih CHIU , Chih-Chiang LU , Chia-Liang HSU , Chun-Hsien CHANG
CPC classification number: H01L33/62 , H01L25/167 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/385 , H01L33/48 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066
Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 μm; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.
Abstract translation: 本公开提供一种制造发光器件的方法，其包括在第一衬底上提供第一衬底和多个半导体堆叠块，并且多个半导体堆叠块中的每一个包括第一导电型半导体层， 第一导电型半导体层上的发光层和发光层上的第二导电型半导体层; 其中在所述第一基板上存在分隔两个相邻的半导体层叠块的沟槽，并且所述沟槽的宽度小于10μm; 并且进行第一分离步骤以将多个半导体堆叠块的第一半导体堆叠块与第一衬底分离，并将第二半导体堆叠块保持在第一衬底上。
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公开(公告)号：US20160049442A1
公开(公告)日：2016-02-18
申请号：US14924264
申请日：2015-10-27
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu SHEN , Chao-Hsing CHEN , Tsun-Kai KO , Schang-Jing HON , Sheng-Jie HSU , De-Shan KUO , Hsin-Ying WANG , Chiu-Lin YAO , Chien-Fu HUANG , Hsin-Mao LIU , Chien-Kai CHUN
CPC classification number: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting structure, comprising a substrate; a first unit and a second unit, separately formed on the substrate; a trench between the first unit and the second unit; and an electrical connection, electrically connecting the first unit and the second unit and comprising a bridging portion and a joining portion extending from the bridging portion, wherein the bridging portion is wider than the joining portion and the bridging portion is configured to cover the trench, and the joining portion is configured to cover first unit and the second unit.
Abstract translation: 1.一种发光结构，包括基板; 分别形成在所述基板上的第一单元和第二单元; 第一单元和第二单元之间的沟槽; 以及电连接，电连接所述第一单元和所述第二单元，并且包括桥接部分和从所述桥接部分延伸的接合部分，其中所述桥接部分比所述接合部分宽，并且所述桥接部分构造成覆盖所述沟槽， 并且所述接合部被构造成覆盖所述第一单元和所述第二单元。
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