公开(公告)号：DE10340129A1

公开(公告)日：2005-04-14

申请号：DE10340129

申请日：2003-08-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/50 ,  H01L23/28 ,  H01L25/065 ,  H01L21/50

Abstract: Semiconductor chip (3) has rear (4), sides (5,7) and contact faces (9) on active top side (10). Module body is card-shaped, containing chip and plastics mass (12), in which chip rear and sides are embbeded, with card forming combined surface (13) of plastics and chip top side.On combined surface are fitted plug contacts (2) linked to chip contact faces by wiring lines (14) of single wiring layer (16) on combined surface. Insulating cover film (17) is deposited on contact faces, leaving plug contacts exposed. Independent claims are included for wafer manufacturing utensil and its production and for manufacture of electronic module.

公开(公告)号：DE10334575A1

公开(公告)日：2005-03-17

申请号：DE10334575

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L21/50

Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

公开(公告)号：DE10325541A1

公开(公告)日：2005-01-13

申请号：DE10325541

申请日：2003-06-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  POHL JENS ,  THEUSS HORST

IPC: H01L21/58 ,  H01L23/00 ,  H01L23/482 ,  H01L23/32

Abstract: An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.

公开(公告)号：DE102005043808A1

公开(公告)日：2007-03-29

申请号：DE102005043808

申请日：2005-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD ,  STROBEL PETER ,  RAKOW BERND

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/60

公开(公告)号：DE502004001120D1

公开(公告)日：2006-09-14

申请号：DE502004001120

申请日：2004-06-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  JEREBIC SIMON ,  POHL JENS ,  STROBEL PETER ,  WOERNER HOLGER

IPC: H01L31/0203 ,  G01J1/02 ,  H01L23/48 ,  H01L23/538 ,  H04N5/225

Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

公开(公告)号：DE102004009742A1

公开(公告)日：2005-09-29

申请号：DE102004009742

申请日：2004-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  VILSMEIER HERMANN ,  GROENINGER HORST ,  BAUER MICHAEL

IPC: H01L21/78 ,  H01L21/301

公开(公告)号：DE10334578A1

公开(公告)日：2005-03-10

申请号：DE10334578

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：DE10308855A1

公开(公告)日：2004-09-16

申请号：DE10308855

申请日：2003-02-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STROBEL PETER ,  OFNER GERALD ,  FUERGUT EDWARD ,  JEREBIC SIMON ,  BEMMERL THOMAS ,  FINK MARKUS ,  VILSMEIER HERMANN

IPC: H01L21/60 ,  H01L21/78 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L23/50

Abstract: Semiconductor wafer for electronic components (2) has on its top surface integrated circuits for semiconductor chips (6) in lines and columns. Between integrated circuits are located strip-shaped dividing regions for chips, which contain through contacts with perforations, extending to rear side of wafer. Walls (11) of perforation contain metal film (12), or insulating layer (30) coated with metal film. Preferably through contacts contain meltable solder material. Integrated circuits are located on top side (14), while rims (15-18), at least one including rim contacts (19). Independent claims are included for semiconductor chip, electronic component and method for producing semiconductor wafer.

公开(公告)号：DE502004008355D1

公开(公告)日：2008-12-11

申请号：DE502004008355

申请日：2004-06-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT-CHRISTIAN

IPC: G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：DE10334575B4

公开(公告)日：2007-10-04

申请号：DE10334575

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  GOLLER BERND ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L25/065 ,  H01L21/50 ,  H01L23/31 ,  H01L23/495

Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.