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    LED LIGHT EMITTING DEVICE AND LUMINAIRE
    21.
    发明申请
    LED LIGHT EMITTING DEVICE AND LUMINAIRE 审中-公开
    LED发光装置和灯泡

    公开(公告)号：WO2014060196A1

    公开(公告)日：2014-04-24

    申请号：PCT/EP2013/069883

    申请日：2013-09-24

    Applicant: OSRAM GMBH

    Inventor： YANG, Jianghui ,  LI, Aiai ,  ZHENG, Shengmei ,  MING, Yusheng

    IPC: H01L33/64 ,  H01L33/62

    CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10378 ,  H05K2201/10553 ,  H01L2924/00

    Abstract: The present invention discloses an LED light emitting device and a luminaire. The LED light emitting device comprises an LED light emitting assembly (220) and a circuit board (210), the LED light emitting assembly comprises a head dissipation pad (2243) and an electric conductive pad (2241, 2242) at the side facing the circuit board, and the circuit board comprises a heat conduction layer (211) and an electric conductive wire (212, 213), characterized in that it further comprises a thermal diffusion member (230) located between the LED light emitting assembly (220) and the circuit board (210), and the thermal diffusion member comprises: an electrical connection part (231, 232) connecting the electric conductive pad (2241, 2242) and the electric conductive wire (212, 213); and a thermal diffusion part (233) connecting the heat dissipation pad (2243) and the heat conduction layer (211), wherein, the thermal diffusion part (233) comprises a larger area and/or thickness than the heat dissipation pad (2243). The present invention adds a thermal diffusion member between the LED light emitting assembly and the circuit board and thus can greatly reduce thermal resistance.

    Abstract translation: 本发明公开了一种LED发光装置和照明装置。 LED发光装置包括LED发光组件（220）和电路板（210），所述LED发光组件包括在面向所述LED发光组件的一侧的头部消耗垫（2243）和导电垫（2241,2242） 电路板，并且电路板包括导热层（211）和导电线（212,213），其特征在于，还包括位于LED发光组件（220）与LED发光组件（220）之间的热扩散构件（230） 所述电路板（210）和所述热扩散部件包括：连接所述导电焊盘（2241,2242）和所述导电线（212,213）的电连接部（231,232）。 以及连接所述散热垫（2243）和所述导热层（211）的热扩散部（233），其中，所述热扩散部（233）具有比所述散热垫（2243）更大的面积和/或厚度， 。 本发明在LED发光组件和电路板之间添加热扩散构件，从而可以大大降低热阻。

    PRINTED CIRCUIT BOARD ARRANGEMENT
    22.
    发明申请
    PRINTED CIRCUIT BOARD ARRANGEMENT 审中-公开
    电路板装置

    公开(公告)号：WO1996031103A1

    公开(公告)日：1996-10-03

    申请号：PCT/DE1996000315

    申请日：1996-02-24

    Applicant: ROBERT BOSCH GMBH

    Inventor： ROBERT BOSCH GMBH ,  BENTZ, Willy ,  ERNST, Waldemar ,  KOLMORGEN, Stefan

    IPC: H05K05/00

    CPC classification number: B60R16/0239 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/0047 ,  H05K7/20854 ,  H05K2201/10189 ,  H05K2201/10553

    Abstract: The proposal is for a printed circuit board arrangement (1) for an electrical device, especially a control or regulating device for an electromechanical system, having at least one metal base plate (2). There is also a substrate (10) supporting the tracks for electrical components (2, 11) fitted thereon, where the substrate (10) is laminated on the base plate (2), and terminals (4) for electrical connections to the printed circuit board arrangement (1). The base plate (2) takes the form of a housing for the electrical device and/or a mechanical system and the substrate (10) is on the base plate (2) in the inner regions, with the preponderantly surface-fitted electrical components (2, 11) lying in regions on the substrate (10) in which thermal contact with heat-dissipating means can be made.

    Abstract translation: 它是一种用于电气设备的印刷电路板装置（1），尤其是用于电动机械装置的控制或调节装置提出，其具有至少一个金属载体板（2）。 此外，在导体轨支撑基板（10）上的承载板布置在其上，电气部件（2，11），其中所述衬底（10）（2）进行层压，并用于向所述电路板组件电连接（1）提供连接元件（4） ， 承载板（2）被设计为用于电气装置和/或机械装置和基片（10）位于所述载体板的内部区域的外壳元件（2），其中，所述主要表面装有电气部件（2，11）在 设置在所述基板（10），其中，与所述散热装置的热接触可以生产上的区域。

    ELECTRONIC STRUCTURE
    23.
    发明公开
    ELECTRONIC STRUCTURE 审中-公开
    电子结构

    公开(公告)号：EP2422593A2

    公开(公告)日：2012-02-29

    申请号：EP09779481.2

    申请日：2009-05-14

    Applicant: AGC Glass Europe

    Inventor： LUIJKX, Antoine

    IPC: H05K3/32 ,  F21V21/096 ,  F21V33/00 ,  H01L27/32 ,  H01R13/62 ,  B32B17/10

    CPC classification number: H05K3/325 ,  B32B17/10018 ,  B32B17/10055 ,  B32B17/10761 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/0108 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10553

    Abstract: The invention relates to an electronic structure, which comprises a panel (1), comprising at least one transparent or translucent substrate layer carrying at least one conductive path (2a, 2b) and at least one magnetic element (3a, 3b), whereas the magnetic element (3a, 3b) is electrically connected to the conductive path (2a, 2b); and at least one module (11), comprising at least one electronic component (12) and at least one magnetic element (13a, 13b), whereas the magnetic element (13a, 13b) is electrically connected to the electronic component (12), whereas the module (11) is in a detachable manner, mechanically and electrically attached to the panel (1) by magnetic attraction between the magnetic element (13a, 13b) of the module (11) and the magnetic element (3a, 3b) of the panel (1), the use of such an electronic structure, such a module (11), such a panel (1) and methods for producing such an electronic structure, panel (1) and module (11).

    ELECTRICAL POWER DISTRIBUTION UNIT AND ELECTRICAL PUNCHED GRID THEREFOR
    24.
    发明公开
    ELECTRICAL POWER DISTRIBUTION UNIT AND ELECTRICAL PUNCHED GRID THEREFOR 有权
    电力供应不足以及电动冲床GRID THEREOF

    公开(公告)号：EP1984211A2

    公开(公告)日：2008-10-29

    申请号：EP07703245.6

    申请日：2007-02-03

    Applicant: Tyco Electronics AMP GmbH

    Inventor： CHRITZ, Gunther

    IPC: B60R16/023 ,  H05K7/02 ,  H05K1/00

    CPC classification number: H05K1/0263 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2201/10553

    Abstract: An electrical power distribution unit for an electrical system has a printed circuit board with a punched grid arranged thereon. An electrical component is arranged on the printed circuit board on a side of the punched grid. An electrical contact of the electrical component projects through a passage opening in the printed circuit board. The punched grid is arranged between the electrical component and the printed circuit board, and an opening is formed in the punched grid in an area around the electrical contact. The punched grid has a current infeed which comprises a plurality of tongues. At least one of the tongues is bendable out of a plane of the punched grid in such a way that two of the tongues form a mutually adjacent common portion, which is electrically contactable by an electrical plug connector.

    Vorrichtung zur Wärmeabfuhr von Leiterplatten
    26.
    发明公开
    Vorrichtung zur Wärmeabfuhr von Leiterplatten 失效
    印制电路板散热装置

    公开(公告)号：EP0136454A1

    公开(公告)日：1985-04-10

    申请号：EP84108975.8

    申请日：1984-07-28

    Applicant: Bodenseewerk Gerätetechnik GmbH

    Inventor： Ohlenburger, Hans

    IPC: H05K7/20

    CPC classification number: H05K7/205 ,  H05K1/0209 ,  H05K7/20436 ,  H05K7/20545 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10553

    Abstract: Leiterplatten (12) sind an ihren Rändern in einem Gehäuse (10) gehaltert und tragen auf einer Seite elektrische Komponenten (16). Zur Wärmeabfuhr von den Leiterplatten (12) tragen diese eine gut wärmeleitende Schicht (20). Die wärmeleitende Schicht (20) ist über einen Wärmeableitblock (22), der im Mittelbereich der Leiterplatte (12) vorgesehen ist, mit dem Gehäuse in wärmeleitendem Kontakt.

    Abstract translation: 电路板（12）在其边缘处安装在壳体（10）中并且承载一侧电气部件（16）。 为了从印刷电路板（12）散热，它们具有良好的导热层（20）。 导热层（20）通过设置在印刷电路板（12）的中心区域中的散热块（22）与壳体导热接触。

    キャパシタ内蔵基板の製造方法
    27.
    发明专利
    キャパシタ内蔵基板の製造方法 审中-公开

    公开(公告)号：JPWO2017026195A1

    公开(公告)日：2018-05-10

    申请号：JP2017534135

    申请日：2016-06-30

    Applicant: 株式会社村田製作所

    Inventor： 舟木 達弥 ,  井上 徳之

    IPC: H05K3/46 ,  H05K1/16

    CPC classification number: H05K1/185 ,  H01G4/005 ,  H01G4/10 ,  H01G4/248 ,  H05K3/32 ,  H05K3/46 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10553 ,  H05K2201/1056

    Abstract: 本発明は、キャパシタ内蔵基板の製造方法であって、キャパシタ内蔵コア絶縁フィルムを作製する工程と、キャパシタ内蔵コア絶縁フィルムの両主面に、ビルドアップ層を積層する工程とを含み、上記キャパシタ内蔵コア絶縁フィルムが、第1金属層および第2金属層と、絶縁層と、キャパシタとを有し、第1金属層および第2金属層が、絶縁層を介して対向するように配置され、キャパシタが、絶縁層を貫通し、一方のキャパシタ電極が第1金属層に電気的に接続され、他方のキャパシタ電極が第2金属層に電気的に接続されるように配置されていることを特徴とする、キャパシタ内蔵基板の製造方法を提供する。

    핀 타입형 파워 엘이디(ＬＥＤ) 방열구조
    30.
    发明授权
    핀 타입형 파워 엘이디(ＬＥＤ) 방열구조 有权
    针式电源LED辐射热结构

    公开(公告)号：KR100892224B1

    公开(公告)日：2009-04-06

    申请号：KR1020080009835

    申请日：2008-01-30

    Applicant: (주)썬웨이브

    Inventor： 이창원 ,  조연수 ,  조경민

    IPC: H01L33/64 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  H01L33/642 ,  H01L2924/0002 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2201/10871 ,  H01L2924/00

    Abstract: A heat radiating structure for a pin type power LED is provided to effectively release the heat generated through the first lead frame connected to the LED device by setting up the radiating unit in the space between a molding unit of substrate and the LED. An LED device(1) is settled on the settling portion extended to the first lead frame. The LED device supplies the power through a lead from the outside. A stopper(4) is formed at one end of leads(5,5') of two lead frames(7,6). A radiating unit(10) is installed in the formed space between a molding unit(8) and a substrate(3) of LED. The radiating unit delivers the heat generated from the LED device to the lead of the first lead frame. The delivered heat is delivered to the radiating unit contacted with the lead.

    Abstract translation: 提供一种用于针式功率LED的散热结构，通过在基板的成型单元和LED之间的空间内设置辐射单元来有效地释放通过连接到LED器件的第一引线框产生的热量。 LED装置（1）安置在延伸到第一引线框架的沉降部分上。 LED设备通过外部的引线提供电源。 在两个引线框架（7,6）的引线（5,5'）的一端形成有止动件（4）。 辐射单元（10）安装在LED的模制单元（8）和基板（3）之间的成形空间中。 辐射单元将从LED器件产生的热量传递到第一引线框架的引线。 传送的热量被传送到与引线接触的辐射单元。

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