公开(公告)号：KR200126781Y1

公开(公告)日：1999-05-01

申请号：KR2019940021228

申请日：1994-08-23

Applicant: 삼성전기주식회사

Inventor： 우석하

IPC: H05K7/20

CPC classification number: H05K3/4084 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00

Abstract: 방열효과를 향상시킬 수 있는 반도체소자의 방열장치가 개시되는바, 이는 반도체소자의 양측면 중앙에 형성되어 상기 반도체소자에서 발생되는 열을 방열하기 위한 지지리이드를 인쇄회로기판의 랜드패턴 중앙에 형성된 홀에 삽입하여 결합하고, 상기 인쇄회로기판의 하부에는 결착홈이 형성된 철판요크를 결합하여 상기 반도체소자에서 발생되는 열을 방열토록 함으로써, 반도체소자의 방열효과를 향상시켜 모터의 성능을 향상시킬 수 있도록 하였다.
또한, 복수개의 리이브가 형성된 철판요크를 인쇄회로기판의 랜드패턴 중앙에 형성된 홀에 삽입하여 결합하고, 상기 인쇄회로기판의 랜드패턴에는 반도체소자의 리이드를 결합하여 지지하고, 상기 리이드와 상기 철판요크를 전도성 접착제로 접착하여 상기 반도체소자에서 발생되는 열을 방열토록 한 반도체소자의 방열장치에 관한 것이다.

公开(公告)号：EP3193568A3

公开(公告)日：2017-08-16

申请号：EP17159040.9

申请日：2003-12-10

Applicant: Marquardt GmbH

Inventor： Neitzel, Roland ,  Stegerwald, Gerhard

IPC: H05K3/30 ,  H05K3/32 ,  H05K1/11 ,  H01R12/58 ,  H05K7/14 ,  H05K3/00

CPC classification number: H01R12/585 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: Die Erfindung betrifft eine elektrische Schaltung mit einem Schaltungsträger (3) in der Art einer wenigstens teilweise flexiblen Leiterplatte. Der Schaltungsträger (3) weist elektrische, elektronische o. dgl. Bauteile (2), wie einen Elektromotor (2a), Schalter (2b), Widerstand, Kondensator, Spule, IC, Steckanschluß o. dgl. auf. Weiter besitzt der Schaltungsträger (3) Leiterbahnen zur elektrischen Verbindung der Bauteile (2) sowie Kontaktflächen (5) zur elektrischen Kontaktierung der Bauteile (2). Die Kontaktfläche (5) ist wenigstens teilweise in der Ebene des Schaltungsträgers (3) freigeschnitten, derart dass die Kontaktfläche (5) eine Flexibilität in eine außerhalb der Ebene (6) des Schaltungsträgers (3) verlaufende Richtung aufweist, insbesondere in der Art einer Kontaktzunge. Ein Kontaktelement (8) zur elektrischen Kontaktierung des Bauteils (2) liegt mit einem Anpressdruck derart an der Kontaktfläche (5) an, dass die Kontaktfläche (5) aus der Ebene (6) des Schaltungsträgers (3) ausgelenkt ist.

公开(公告)号：EP1875504B1

公开(公告)日：2017-03-08

申请号：EP06758855.8

申请日：2006-05-01

Applicant: Finisar Corporation

Inventor： ICE, Donald, A. ,  DOUMA, Darin, J. ,  KIELY, Phillip, Anthony

IPC: H01L23/495

CPC classification number: H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

公开(公告)号：EP2724597B1

公开(公告)日：2017-01-18

申请号：EP12737201.9

申请日：2012-06-21

Applicant: Schweizer Electronic AG

Inventor： GOTTWALD, Thomas ,  RÖSSLE, Christian

IPC: H05K3/20 ,  H05K3/34 ,  H05K3/00 ,  H01G2/06

CPC classification number: H05K1/185 ,  H01G2/065 ,  H01L23/645 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/32237 ,  H01L2224/73267 ,  H01L2924/1431 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19106 ,  H02K9/22 ,  H02K11/30 ,  H02K11/33 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/184 ,  H05K3/0044 ,  H05K3/0061 ,  H05K3/30 ,  H05K3/3442 ,  H05K3/40 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4602 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2203/0228 ,  H01L2924/00

公开(公告)号：EP2117082B1

公开(公告)日：2016-05-18

申请号：EP06822495.5

申请日：2006-10-27

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/77 ,  H01R12/78 ,  H01R12/79 ,  H05K3/32 ,  H05K3/36 ,  H01R12/58 ,  H01R12/62 ,  H01R12/59 ,  H01R12/61 ,  H05K1/11 ,  H05K3/40

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

公开(公告)号：EP2853442A1

公开(公告)日：2015-04-01

申请号：EP14003270.7

申请日：2014-09-22

Applicant: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO

Inventor： Hishikawa, Koji ,  Nagano, Akira

IPC: B60Q3/02 ,  H05K3/04 ,  H05K1/02 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC classification number: H05K3/202 ,  H01L23/3107 ,  H01L2924/0002 ,  H05K3/04 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2203/175 ,  H01L2924/00

Abstract: An insulator 1 is obtained by insert molding a conductor forming member 4 in which a plurality of conductor forming parts 5,6 for forming conductors are integrally connected by a connecting part 7, and thereafter, by removing a plurality of parts of the connecting part 7. A plurality of gaps 10, 11 are formed in the connecting part 7. The connecting part 7 is divided into a plurality of connecting portions by the plurality of gaps 10, 11 so that the plurality of connecting portions are electrically separated to each other.

Abstract translation: 绝缘体1通过嵌入成型导体形成构件4而获得，导体形成构件4中，用于形成导体的多个导体形成部分5,6通过连接部分7一体连接，然后通过去除连接部分7的多个部分 多个间隙10,11形成在连接部分7中。连接部分7被多个间隙10,11分成多个连接部分，使得多个连接部分彼此电分离。

公开(公告)号：EP2548421B1

公开(公告)日：2015-02-25

申请号：EP11709694.1

申请日：2011-03-16

Applicant: Robert Bosch GmbH

Inventor： HEIM, Michael ,  BRAUN, Sigmund

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

公开(公告)号：EP2312916B1

公开(公告)日：2014-12-31

申请号：EP10186521.0

申请日：2010-10-05

Applicant: IBIDEN CO., LTD.

Inventor： Tsukada, Kiyotaka ,  Muraki, Tetsuya

IPC: H05K3/20 ,  H05K1/02 ,  H05K1/18 ,  H01L23/14 ,  H01L23/373

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board ( 10 ) comprises a first conductive post ( 31 ) for electrically connecting to the collector electrode of a semiconductor device ( 50 ), a first metal plate ( 11 ) connecting to the first conductive post ( 31 ), a second conductive post ( 32 ) for electrically connecting to the gate electrode ( 52 ) of the semiconductor device ( 50 ), a second metal plate ( 12 ) connecting to the second conductive post ( 32 ), a third conductive post ( 33 ) for electrically connecting to the emitter electrode ( 53 ) of the semiconductor device ( 50 ), and a third metal plate ( 13 ) connecting to the third conductive post ( 33 ).

公开(公告)号：EP2724597A2

公开(公告)日：2014-04-30

申请号：EP12737201.9

申请日：2012-06-21

Applicant: Schweizer Electronic AG

Inventor： GOTTWALD, Thomas ,  RÖSSLE, Christian

IPC: H05K3/20 ,  H05K3/34 ,  H05K3/00 ,  H01G2/06

CPC classification number: H05K1/185 ,  H01G2/065 ,  H01L23/645 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/32237 ,  H01L2224/73267 ,  H01L2924/1431 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19106 ,  H02K9/22 ,  H02K11/30 ,  H02K11/33 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/184 ,  H05K3/0044 ,  H05K3/0061 ,  H05K3/30 ,  H05K3/3442 ,  H05K3/40 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4602 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2203/0228 ,  H01L2924/00

Abstract: The present invention relates to an electronic assembly (50, 50') with a printed circuit board structure in a multilayer form (10) that has at least two electrically conductive layers (12, 14). The electronic assembly also comprises an additional passive component (C, C'; L) that is connected to the two electrically conductive layers (12, 14), each of which has at least one segment that extends beyond the multilayer structure (10) to form connection regions (12.2, 14.1, 14.2), the passive component (C, C'; L) making contact directly at the connection regions (12.2, 14.1, 14.2).

Abstract translation: 一种电子组件组，包括具有至少两个导电层的多层结构的印刷电路板结构。 电子组件组还包括连接到两个导电层的附加无源部件，每个导电层具有延伸超过多层结构的至少一个部分以形成连接区域，无源部件直接在连接区域处形成接触。

公开(公告)号：EP2701472A1

公开(公告)日：2014-02-26

申请号：EP12774530.5

申请日：2012-01-06

Applicant: Kabushiki Kaisha Toyota Jidoshokki

Inventor： SHIMADU, Hitoshi ,  SAWADA, Takehiko ,  HAYAKAWA, Takahiro ,  ASAI, Tomoaki ,  YAMAUCHI, Ryou

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K3/4092 ,  H05K3/368 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/1031 ,  H05K2203/0195 ,  Y02P70/611

Abstract: A wiring substrate (10, 40, 60. 80) includes a wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) and an insulating layer (11, 26, 48, 81) to which the wiring pattern is fixed. The insulating layer includes an edge. The wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) includes a joint portion (14, 44, 66) connected with the insulating layer (11, 26, 48, 81) and an extended portion (45, 45, 67, 85) that extends from the joint portion (14, 44, 66) and protrudes from the edge of the insulating layer (11, 26, 48, 81). The insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66) includes an outermost surface. A connection terminal (T, T1) is provided by bending the extended portion (45, 45, 67, 85) so that a part of the extended portion (45, 45, 67, 85) is protruded from the outermost surface of the insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66).

Abstract translation: 一种布线基板（10,40,60,80）包括布线图案（13,21,41,43,65,83a，83b，83c）和绝缘层（11,26,48,81），所述布线 模式是固定的。 绝缘层包括边缘。 布线图案（13,21,41,43,65,83a，83b，83c）包括与绝缘层（11,26,48,81）连接的接合部（14,44,66）和与绝缘层（11,26,48,81）连接的延伸部 （14,44,66）延伸并且从绝缘层（11,26,48,81）的边缘突出的部分（45,45,67,85）。 绝缘层（11,26,48,81）或接合部分（14,34,66）包括最外表面。 通过弯曲延伸部分（45,45,67,85）以使延伸部分（45,45,67,85）的一部分从绝缘体的最外表面突出来提供连接端子（T，T1） 层（11,26,48,81）或接合部分（14,44,66）。